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- Processor: 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core)
- Chipset: Intel® H110 Mobile Platform Controller Hub
- Memory: Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133
- Graphics: Integrated Intel® HD Graphics 530 with support for up to two independent displays
- Display Interfaces:
- 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz)
- 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz)
- 1 × VGA (up to 1920 × 1200 @ 60 Hz)
- Expansion Slots:
- 1 × PCIe x16 (Gen 3)
- 1 × PCI (32‑bit, 33 MHz)
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support
- Storage:
- 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD
- 1 × rear CFast slot (Type II, SATA interface)
- USB Connectivity:
- 4 × USB 3.0 (external, Type A)
- 2 × USB 2.0 (external, Type A)
- 1 × internal USB 2.0 (Type A)
- Serial Communication:
- 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2)
- 2 × RS‑232 ports (COM3, COM4)
- Digital I/O: 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs)
- Audio: 1 × Mic‑in, 1 × Line‑out
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation with industrial SSD)
- Mounting: Wall‑mount kit included
- Construction: Rugged aluminum chassis, fanless thermal design
- Chipset: Intel® H110 Mobile Platform Controller Hub
- Memory: Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133
- Graphics: Integrated Intel® HD Graphics 530 with support for up to two independent displays
- Display Interfaces:
- 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz)
- 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz)
- 1 × VGA (up to 1920 × 1200 @ 60 Hz)
- Expansion Slots:
- 1 × PCIe x16 (Gen 3)
- 1 × PCI (32‑bit, 33 MHz)
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support
- Storage:
- 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD
- 1 × rear CFast slot (Type II, SATA interface)
- USB Connectivity:
- 4 × USB 3.0 (external, Type A)
- 2 × USB 2.0 (external, Type A)
- 1 × internal USB 2.0 (Type A)
- Serial Communication:
- 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2)
- 2 × RS‑232 ports (COM3, COM4)
- Digital I/O: 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs)
- Audio: 1 × Mic‑in, 1 × Line‑out
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation with industrial SSD)
- Mounting: Wall‑mount kit included
- Construction: Rugged aluminum chassis, fanless thermal design
Comprehensive Product Summary: ADLINK MVP‑6003/M4G Fanless Embedded Computer
### 1. Product Overview
Product Name: MVP‑6003/M4G
Model: MVP‑6003
Series: MVP‑6000 Series (MVP‑6001 / MVP‑6002 / MVP‑6003)
Article Number: MVP‑6003/M4G
Manufacturer: ADLINK Technology Inc.
Part Number: 50‑1Z214‑2020
Manual Revision: 4.0 (May 6, 2019)
The ADLINK MVP‑6003/M4G is a fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It integrates a 6th Generation Intel® Core™ i3‑6100TE dual‑core processor with the Intel® H110 chipset, providing a balance of performance, reliability, and energy efficiency in a rugged, maintenance‑free design. The system supports dual independent displays, multiple high‑speed I/O interfaces, and flexible expansion through PCIe, PCI, and Mini‑PCIe slots.
### 2. Key Features
- Processor: 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core)
- Chipset: Intel® H110 Mobile Platform Controller Hub
- Memory: Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133
- Graphics: Integrated Intel® HD Graphics 530 with support for up to two independent displays
- Display Interfaces:
- 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz)
- 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz)
- 1 × VGA (up to 1920 × 1200 @ 60 Hz)
- Expansion Slots:
- 1 × PCIe x16 (Gen 3)
- 1 × PCI (32‑bit, 33 MHz)
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support
- Storage:
- 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD
- 1 × rear CFast slot (Type II, SATA interface)
- USB Connectivity:
- 4 × USB 3.0 (external, Type A)
- 2 × USB 2.0 (external, Type A)
- 1 × internal USB 2.0 (Type A)
- Serial Communication:
- 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2)
- 2 × RS‑232 ports (COM3, COM4)
- Digital I/O: 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs)
- Audio: 1 × Mic‑in, 1 × Line‑out
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation with industrial SSD)
- Mounting: Wall‑mount kit included
- Construction: Rugged aluminum chassis, fanless thermal design
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Processor | Intel® Core™ i3‑6100TE, 2.7 GHz, dual‑core, 4 MB cache |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM, up to 32 GB DDR4‑2133 |
| Graphics | Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Expansion | 1 × PCIe x16 (Gen 3), 1 × PCI (32‑bit), 1 × Mini‑PCIe + USIM |
| Ethernet | 3 × Intel® I211‑AT GbE ports (IEEE 802.3az, 1588, VLAN, PXE) |
| Serial Ports | 2 × RS‑232/422/485 + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (VIH 2–5.25 V, VIL 0–0.8 V), 8 × DO (open‑drain 24 mA) |
| Audio | Mic‑in × 1, Line‑out × 1 |
| Storage | 1 × SATA III (6 Gb/s), 1 × CFast (Type II) |
| Power Input | 12 – 24 V DC (3‑pin connector V+, GND, V–) |
| Power Consumption | Idle 17.9 W / Full Load 50.66 W @ 24 V DC |
| Dimensions | 220 (W) × 210 (D) × 170 (H) mm (8.67 × 8.27 × 6.69 in) |
| Weight | 4.5 kg (9.92 lb) |
| Operating Temp. | 0 °C – 50 °C (industrial SSD) |
| Storage Temp. | –40 °C – 85 °C (excl. HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Shock | 100 G, 11 ms half‑sine (w/ CFast or SSD) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE / FCC Class A |
| Mounting | Wall‑mount kit included |
| Optional Cooling | Smart Fan Module (9 V or 12 V connector) |
### 4. Functionality
The MVP‑6003/M4G operates as a compact, fanless industrial controller optimized for automation and embedded computing. The Intel® Core™ i3‑6100TE CPU and H110 chipset deliver stable performance for multitasking, data acquisition, and real‑time control. The system’s fanless design ensures silent operation and high reliability in dusty or vibration‑prone environments.
Typical Use Cases:
- Machine vision and inspection systems
- Industrial automation and motion control
- Intelligent transportation and surveillance
- Data logging and edge computing
- Factory process monitoring
Compatibility:
- Supports Windows 7/10 (64‑bit), Linux, and real‑time OS environments
- BIOS configurable for legacy or UEFI boot modes
- Supports PXE boot and Wake‑on‑LAN for remote management
### 5. Components & Accessories
Included Items:
- MVP‑6003/M4G main unit
- Wall‑mount brackets and screw pack
- HDD/SSD mounting screws
- User’s Manual and ADLINK All‑in‑One DVD
Internal Connectors:
- GPS module power headers (3.3 V / 5 V)
- SATA III connector (6 Gb/s)
- Mini‑PCIe slot with USIM socket
- Internal USB 2.0 Type‑A port
- 9 V and 12 V fan connectors
- Clear CMOS jumper
- Extended PWR/RESET header
- 12 V power header for add‑on cards
Optional Accessories:
- Active/passive DisplayPort adapter cables (HDMI, DVI, VGA)
- 160 W AC‑DC adapter
- Smart Fan Module (9 V or 12 V)
- Auxiliary power cable (P/N 30‑20724‑0000)
### 6. Installation & Setup
Power Requirements:
- 12 – 24 V DC input (stable, low‑noise DC supply)
- Recommended 160 W power adapter for full load operation
Mounting:
- Wall‑mount installation using included brackets
- Must be mounted vertically (front/rear panels on sides) for ventilation
Storage Installation:
- 2.5″ HDD/SSD installed via bottom access panel
- CFast card inserted through rear slot (Type II Push‑Push)
Driver Installation:
- Chipset, Graphics, Ethernet, Audio, USB 3.0, Intel ME, and Serial I/O drivers downloadable from [www.adlinktech.com](http://www.adlinktech.com)
BIOS Configuration:
- Access via DEL key at POST
- Supports UEFI and Legacy boot, VT‑d, Hyper‑Threading, SpeedStep, and Watchdog Timer settings
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel® Core™ i3‑6100TE (2.7 GHz) with Hyper‑Threading
- Memory Bandwidth: DDR4‑2133 up to 32 GB
- Graphics Performance: Intel® HD Graphics 530 supports 4K resolutions and dual display output
- Networking: Three Intel® I211‑AT GbE controllers with teaming and IEEE 1588 time sync
- Storage Throughput: SATA III 6 Gb/s and CFast 3.0 Gb/s interfaces
- Power Efficiency: 17.9 W idle / 50.66 W full load @ 24 V DC
- Reliability: Fanless design increases MTBF and reduces maintenance
- Limitations: Operating temperature limited to 50 °C without add‑on cards; requires industrial SSD for cold boot at 0 °C
### 8. Standards & Compliance
- Environmental: RoHS and WEEE compliant
- Safety: California Proposition 65 warning for chemical exposure
- EMC: CE and FCC Class A certified
- ESD Protection: ±4 kV (contact), ±8 kV (air)
- Shock Resistance: 100 G half‑sine 11 ms (w/ CFast or SSD)
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes
### 9. Additional Information
Warranty & Support:
- Standard ADLINK limited warranty (coverage varies by region)
- Technical support via [Ask an Expert](http://askanexpert.adlinktech.com) and regional service centers
Maintenance:
- Fanless design minimizes dust accumulation and moving parts failure
- Periodic inspection of connectors and power supply recommended
- CMOS reset available via jumper for BIOS recovery
Firmware & Updates:
- BIOS and driver updates available from ADLINK website
- Supports user BIOS restore and custom default profiles
Environmental Responsibility:
- Fully compliant with EU RoHS and WEEE directives
- Designed for minimal environmental impact and recyclability
Service Contacts:
- ADLINK Technology Inc. (Taiwan) – +886‑2‑8226‑5877 / service@adlinktech.com
- ADLINK USA: +1‑408‑360‑0200 / info@adlinktech.com
- ADLINK China: +86‑21‑5132‑8988 / market@adlinktech.com
- ADLINK EMEA: +49‑621‑43214‑0 / emea@adlinktech.com
### Summary
The ADLINK MVP‑6003/M4G is a robust, fanless embedded controller engineered for industrial automation and edge computing. Combining a 6th Gen Intel® Core™ i3 processor, triple Gigabit Ethernet, dual display support, and extensive I/O interfaces, it delivers reliable performance in harsh environments. Its modular expansion capabilities (PCIe, PCI, Mini‑PCIe) and wide DC input range make it ideal for machine vision, motion control, and data acquisition applications requiring long‑term stability and low maintenance.
### 1. Product Overview
Product Name: MVP‑6003/M4G
Model: MVP‑6003
Series: MVP‑6000 Series (MVP‑6001 / MVP‑6002 / MVP‑6003)
Article Number: MVP‑6003/M4G
Manufacturer: ADLINK Technology Inc.
Part Number: 50‑1Z214‑2020
Manual Revision: 4.0 (May 6, 2019)
The ADLINK MVP‑6003/M4G is a fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It integrates a 6th Generation Intel® Core™ i3‑6100TE dual‑core processor with the Intel® H110 chipset, providing a balance of performance, reliability, and energy efficiency in a rugged, maintenance‑free design. The system supports dual independent displays, multiple high‑speed I/O interfaces, and flexible expansion through PCIe, PCI, and Mini‑PCIe slots.
### 2. Key Features
- Processor: 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core)
- Chipset: Intel® H110 Mobile Platform Controller Hub
- Memory: Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133
- Graphics: Integrated Intel® HD Graphics 530 with support for up to two independent displays
- Display Interfaces:
- 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz)
- 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz)
- 1 × VGA (up to 1920 × 1200 @ 60 Hz)
- Expansion Slots:
- 1 × PCIe x16 (Gen 3)
- 1 × PCI (32‑bit, 33 MHz)
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support
- Storage:
- 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD
- 1 × rear CFast slot (Type II, SATA interface)
- USB Connectivity:
- 4 × USB 3.0 (external, Type A)
- 2 × USB 2.0 (external, Type A)
- 1 × internal USB 2.0 (Type A)
- Serial Communication:
- 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2)
- 2 × RS‑232 ports (COM3, COM4)
- Digital I/O: 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs)
- Audio: 1 × Mic‑in, 1 × Line‑out
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation with industrial SSD)
- Mounting: Wall‑mount kit included
- Construction: Rugged aluminum chassis, fanless thermal design
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Processor | Intel® Core™ i3‑6100TE, 2.7 GHz, dual‑core, 4 MB cache |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM, up to 32 GB DDR4‑2133 |
| Graphics | Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Expansion | 1 × PCIe x16 (Gen 3), 1 × PCI (32‑bit), 1 × Mini‑PCIe + USIM |
| Ethernet | 3 × Intel® I211‑AT GbE ports (IEEE 802.3az, 1588, VLAN, PXE) |
| Serial Ports | 2 × RS‑232/422/485 + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (VIH 2–5.25 V, VIL 0–0.8 V), 8 × DO (open‑drain 24 mA) |
| Audio | Mic‑in × 1, Line‑out × 1 |
| Storage | 1 × SATA III (6 Gb/s), 1 × CFast (Type II) |
| Power Input | 12 – 24 V DC (3‑pin connector V+, GND, V–) |
| Power Consumption | Idle 17.9 W / Full Load 50.66 W @ 24 V DC |
| Dimensions | 220 (W) × 210 (D) × 170 (H) mm (8.67 × 8.27 × 6.69 in) |
| Weight | 4.5 kg (9.92 lb) |
| Operating Temp. | 0 °C – 50 °C (industrial SSD) |
| Storage Temp. | –40 °C – 85 °C (excl. HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Shock | 100 G, 11 ms half‑sine (w/ CFast or SSD) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE / FCC Class A |
| Mounting | Wall‑mount kit included |
| Optional Cooling | Smart Fan Module (9 V or 12 V connector) |
### 4. Functionality
The MVP‑6003/M4G operates as a compact, fanless industrial controller optimized for automation and embedded computing. The Intel® Core™ i3‑6100TE CPU and H110 chipset deliver stable performance for multitasking, data acquisition, and real‑time control. The system’s fanless design ensures silent operation and high reliability in dusty or vibration‑prone environments.
Typical Use Cases:
- Machine vision and inspection systems
- Industrial automation and motion control
- Intelligent transportation and surveillance
- Data logging and edge computing
- Factory process monitoring
Compatibility:
- Supports Windows 7/10 (64‑bit), Linux, and real‑time OS environments
- BIOS configurable for legacy or UEFI boot modes
- Supports PXE boot and Wake‑on‑LAN for remote management
### 5. Components & Accessories
Included Items:
- MVP‑6003/M4G main unit
- Wall‑mount brackets and screw pack
- HDD/SSD mounting screws
- User’s Manual and ADLINK All‑in‑One DVD
Internal Connectors:
- GPS module power headers (3.3 V / 5 V)
- SATA III connector (6 Gb/s)
- Mini‑PCIe slot with USIM socket
- Internal USB 2.0 Type‑A port
- 9 V and 12 V fan connectors
- Clear CMOS jumper
- Extended PWR/RESET header
- 12 V power header for add‑on cards
Optional Accessories:
- Active/passive DisplayPort adapter cables (HDMI, DVI, VGA)
- 160 W AC‑DC adapter
- Smart Fan Module (9 V or 12 V)
- Auxiliary power cable (P/N 30‑20724‑0000)
### 6. Installation & Setup
Power Requirements:
- 12 – 24 V DC input (stable, low‑noise DC supply)
- Recommended 160 W power adapter for full load operation
Mounting:
- Wall‑mount installation using included brackets
- Must be mounted vertically (front/rear panels on sides) for ventilation
Storage Installation:
- 2.5″ HDD/SSD installed via bottom access panel
- CFast card inserted through rear slot (Type II Push‑Push)
Driver Installation:
- Chipset, Graphics, Ethernet, Audio, USB 3.0, Intel ME, and Serial I/O drivers downloadable from [www.adlinktech.com](http://www.adlinktech.com)
BIOS Configuration:
- Access via DEL key at POST
- Supports UEFI and Legacy boot, VT‑d, Hyper‑Threading, SpeedStep, and Watchdog Timer settings
### 7. Performance & Capabilities
- Processing Power: Dual‑core Intel® Core™ i3‑6100TE (2.7 GHz) with Hyper‑Threading
- Memory Bandwidth: DDR4‑2133 up to 32 GB
- Graphics Performance: Intel® HD Graphics 530 supports 4K resolutions and dual display output
- Networking: Three Intel® I211‑AT GbE controllers with teaming and IEEE 1588 time sync
- Storage Throughput: SATA III 6 Gb/s and CFast 3.0 Gb/s interfaces
- Power Efficiency: 17.9 W idle / 50.66 W full load @ 24 V DC
- Reliability: Fanless design increases MTBF and reduces maintenance
- Limitations: Operating temperature limited to 50 °C without add‑on cards; requires industrial SSD for cold boot at 0 °C
### 8. Standards & Compliance
- Environmental: RoHS and WEEE compliant
- Safety: California Proposition 65 warning for chemical exposure
- EMC: CE and FCC Class A certified
- ESD Protection: ±4 kV (contact), ±8 kV (air)
- Shock Resistance: 100 G half‑sine 11 ms (w/ CFast or SSD)
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes
### 9. Additional Information
Warranty & Support:
- Standard ADLINK limited warranty (coverage varies by region)
- Technical support via [Ask an Expert](http://askanexpert.adlinktech.com) and regional service centers
Maintenance:
- Fanless design minimizes dust accumulation and moving parts failure
- Periodic inspection of connectors and power supply recommended
- CMOS reset available via jumper for BIOS recovery
Firmware & Updates:
- BIOS and driver updates available from ADLINK website
- Supports user BIOS restore and custom default profiles
Environmental Responsibility:
- Fully compliant with EU RoHS and WEEE directives
- Designed for minimal environmental impact and recyclability
Service Contacts:
- ADLINK Technology Inc. (Taiwan) – +886‑2‑8226‑5877 / service@adlinktech.com
- ADLINK USA: +1‑408‑360‑0200 / info@adlinktech.com
- ADLINK China: +86‑21‑5132‑8988 / market@adlinktech.com
- ADLINK EMEA: +49‑621‑43214‑0 / emea@adlinktech.com
### Summary
The ADLINK MVP‑6003/M4G is a robust, fanless embedded controller engineered for industrial automation and edge computing. Combining a 6th Gen Intel® Core™ i3 processor, triple Gigabit Ethernet, dual display support, and extensive I/O interfaces, it delivers reliable performance in harsh environments. Its modular expansion capabilities (PCIe, PCI, Mini‑PCIe) and wide DC input range make it ideal for machine vision, motion control, and data acquisition applications requiring long‑term stability and low maintenance.
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MVP-6000_Series_datasheet-20190415.pdf
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