- **Deep Learning Acceleration:** Powered by the NVIDIA® Jetson™ TX2 or TX2i module, featuring a Pascal™ GPU with 256 CUDA cores for efficient AI inference at the edge. - **High‑Performance Memory and Storage:** 8 GB 128‑bit LPDDR4 memory and 32 GB eMMC 5.1 onboard storage, with additional mSATA and SDIO expansion options. - **Compact Fanless Design:** Dimensions of 148 (W) × 104.8 (D) × 52.1 (H) mm enable deployment in space‑constrained environments. - **Wide Operating Temperature Range:** Reliable operation from –20 °C to 70 °C for industrial and outdoor use. - **Comprehensive I/O Connectivity:** Dual GbE ports, three USB 3.0 ports, one USB 2.0 OTG, HDMI 2.0 with lock, COM port, CAN 2.0B bus, audio jack, and four‑channel DIO. - **Wireless Communication Support:** Integrated Wi‑Fi 802.11ac and Bluetooth 4.1, plus mPCIe and USIM slots for 3G/4G LTE or LoRa modules. - **Flexible Mounting Options:** Supports VESA, wall, and optional DIN‑rail mounting for versatile installation. - **Industrial‑Grade Reliability:** IP40 protection, vibration and shock resistance, and compliance with CE/FCC Class B and IEC/UL safety standards. - **Linux for Tegra (L4T) Support:** Pre‑installed NVIDIA L4T OS optimized for Jetson TX2, with ADLINK customization for edge AI workloads.

Hersteller: Adlink Technology Inc.

Kategorie: Inference & Deep Learning

- **Processor Support:** Compatible with 8th and 9th Generation Intel® Core™ i7, i5, and i3 CPUs (LGA1151 socket), offering up to 8 cores and 12 threads depending on model. - **GPU Acceleration:** Supports NVIDIA® Quadro® PEG cards, including P2200, P4000, P5000, RTX 4000, RTX 5000, RTX 6000, and RTX 8000, enabling advanced AI inference and deep learning workloads. - **Memory Capacity:** Dual SO-DIMM slots supporting up to 32GB DDR4 non-ECC memory at 2666/2400 MHz (dependent on CPU). - **Display Outputs:** Integrated 1x DVI, 1x HDMI, and 1x DisplayPort from CPU graphics, with additional outputs available from installed PEG cards. - **Expansion Options:** 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE modules and 1x M.2 M-key slot supporting 2280 SATA SSD modules. - **Storage Flexibility:** Two internal 2.5" SATA 6Gb/s drive bays plus one SATA 6Gb/s signal via M.2 M-key slot. - **Power Supply Options:** Available with 300W, 400W, or 500W Flex ATX power supplies to accommodate various GPU configurations. - **Software Compatibility:** Supports Windows 10 IoT Enterprise CBB 64-bit and Ubuntu 16.04 LTS operating systems. - **Industrial Reliability:** Operating temperature range from 0°C to 50°C (model-dependent), with compliance to EMC and safety standards (EN55032/EN55035, UL/cUL, CB, CCC). - **Compact Design:** Mini-ITX chassis with dimensions of 220 x 300 x 150 mm (W x D x H), optimized for embedded and edge deployments.

Hersteller: Adlink Technology Inc.

Kategorie: Inference & Deep Learning

- **GPU Architecture:** NVIDIA Pascal GP107 Quadro P2000 - **CUDA Cores:** 768 parallel processing cores - **Peak Performance:** 2.3 TFLOPS single‑precision (FP32) - **Memory:** 4 GB GDDR5, 128‑bit interface, 96 GB/s bandwidth - **Display Support:** Up to four independent UHD (4K) displays via DisplayPort 1.4 - **Form Factor:** MXM 3.1 Type A (82 × 70 mm) - **Power Consumption:** 58 W Total Graphics Power (TGP) - **Clock Speeds:** Base 1455 MHz, Boost 1480 MHz - **Operating Temperature Range:** ‑40 °C to +85 °C (ETT version) - **Long‑Term Availability:** 5‑year product lifecycle support - **Software Ecosystem:** CUDA Toolkit 8.0, OpenCL 1.2, DirectX 12, OpenGL 4.5, Vulkan 1.0 - **Connectivity:** PCI Express Gen3 x16 interface - **Compliance:** CE, FCC, EU‑RoHS, WHQL certified for Windows 7/10 The EGX‑MXM‑P2000 combines high compute density with low power draw, making it ideal for embedded systems in medical imaging, industrial automation, digital signage, and defense applications.

Hersteller: Adlink Technology Inc.

Kategorie: Inference & Deep Learning

- **Integrated NVIDIA® Jetson TX2 Platform:** Combines GPU, CPU, and memory in a compact module for high-performance edge computing. - **256-Core Pascal GPU:** Provides exceptional parallel processing power for deep learning inference, image recognition, and AI-based vision algorithms. - **ARMv8 (64-bit) Multi-Processor CPU Complex:** Features a dual-core NVIDIA Denver 2 and quad-core ARM Cortex-A57 CPU cluster operating at 2.0 GHz, enabling heterogeneous multiprocessing for efficient workload distribution. - **Industrial I/O Integration:** Includes 32-channel isolated digital input/output (DI/O) for direct connection to sensors, actuators, and industrial control systems. - **Frame Grabber Support:** Compatible with ADLINK GigE Vision and USB3 Vision frame grabbers, as well as other PCIe-based capture cards, allowing flexible camera integration. - **Compact, All-in-One Design:** Combines compute, I/O, and connectivity in a single enclosure, reducing system complexity and footprint. - **Deep Learning Deployment:** Supports deployment of neural network models optimized using NVIDIA® DIGITS or TensorRT, enabling rapid implementation of AI-based inspection and classification solutions. - **Comprehensive Connectivity:** Provides HDMI display output, Gigabit Ethernet, dual COM ports, and dual USB 3.0 ports for peripheral and network integration. - **Software Ecosystem:** Supports Ubuntu Linux OS, OpenGL, and CUDA for GPU-accelerated computing and AI development. - **Industrial Reliability:** Designed for continuous operation in manufacturing environments with an operating temperature range of 0°C to 45°C.

Hersteller: Adlink Technology Inc.

Kategorie: Inference & Deep Learning

- **High-Performance Processing:** Equipped with an Intel® Atom™ E3845 quad-core processor (1.91 GHz), providing robust computing power for real-time image processing and analysis. - **High-Resolution Imaging:** Integrated 4-megapixel (2048 × 2048) monochrome global shutter CMOS sensor (CMOSIS CMV4000) supporting up to 60 frames per second (fps). - **Rugged Industrial Design:** IP67-rated aluminum housing and M12 industrial connectors ensure protection against dust, water, and vibration, suitable for harsh factory environments. - **Advanced Image Processing:** Built-in FPGA coprocessor and GPU acceleration enable advanced image processing functions such as LUT, shading correction, ROI, multi-ROI, and binning. - **Flexible I/O and Connectivity:** Includes 4 digital inputs, 4 digital outputs, 1 opto-isolated trigger input, 1 RS-232 port, 1 USB 2.0 port, and 1 Gigabit Ethernet port. Supports an additional GigE Vision slave camera for multi-camera setups. - **Integrated Lighting Control:** Built-in PWM lighting control with 500 mA constant current output and 1000:1 dimming resolution at 18 kHz frequency for precise illumination management. - **Software Ecosystem Compatibility:** Supports major vision software platforms including MVTec HALCON, MERLIC, COGNEX VisionPro, STEMMER Common Vision Blox, Teledyne Dalsa Sherlock, Adaptive Vision Studio, and Euresys Open eVision. Compatible with GeniCam, GenTL, OpenCV, and OpenCL standards. - **Operating System Support:** Pre-installed with Windows® 7 or Windows® Embedded Standard 7 (WES7E), supporting File-Based Write Filter (FBWF) for system stability and security. - **Compact Form Factor:** Small footprint (68.5 mm × 110 mm × 52.7 mm) and lightweight (540 ± 5 g) design for easy integration into production lines or robotic systems.

Hersteller: Adlink Technology Inc.

Kategorie: Smart AI Cams

- **Embedded NVIDIA® Jetson™ TX2 Platform:** Each NEON-i1000 camera integrates the Jetson TX2 module, featuring a 256-core NVIDIA Pascal™ GPU, 8 GB LPDDR4 memory, and 59.7 GB/s memory bandwidth. This enables high-performance AI inference and image processing without requiring an external host PC. - **Multiple Sensor Options:** The series supports **four distinct color image sensors**, offering resolutions from **1.2 megapixels to 5 megapixels**, with both **global** and **rolling shutter** options to accommodate various imaging requirements. - **Comprehensive I/O Integration:** Includes **4x digital inputs** (one configurable as a sensor trigger), **4x digital outputs** (one configurable as a strobe output), **1x UART (TXD, RXD, GND)**, **1x Gigabit Ethernet port**, and **1x Type-C port** supporting both display output and USB connectivity. - **Flexible Storage and Expansion:** Equipped with a **Micro SD slot** for external storage expansion, supporting data logging, model deployment, and image archiving. - **Lens Compatibility:** Supports **C-mount lenses**, providing flexibility for different focal lengths and optical configurations. - **Compact Industrial Design:** The ruggedized housing (123.4 × 77.57 × 72.2 mm) is optimized for industrial environments, ensuring durability and ease of installation in constrained spaces. - **Software Ecosystem:** Fully compatible with **Ubuntu 18.04** and **NVIDIA JetPack 4.2.1**, enabling developers to leverage CUDA, cuDNN, and TensorRT for AI model deployment and optimization. - **Edge AI Capability:** Designed for **deep learning inference at the edge**, reducing latency and network dependency by processing data locally.

Hersteller: Adlink Technology Inc.

Kategorie: Smart AI Cams

- **Intel® Movidius™ Myriad™ X VPU Integration:** Each NEON‑i2000 camera incorporates the Myriad™ X Vision Processing Unit, optimized for deep learning inference at the edge. This enables efficient execution of convolutional neural networks (CNNs) and AI workloads directly on the device. - **Embedded Intel® Atom® x5‑E3930 Processor:** Dual‑core processor providing sufficient computational power for image preprocessing, control logic, and communication tasks. - **Multiple Sensor Options:** Four distinct color sensor configurations are available, offering resolutions from 1.2 megapixels to 5 megapixels, with both global and rolling shutter options to suit various imaging requirements. - **Comprehensive I/O Interfaces:** Equipped with 4× digital inputs, 4× digital outputs, 1× communication (COM) port, and 1× LAN port for network connectivity. A USB Type‑C port supports display and peripheral connections. - **Expandable Storage:** Integrated Micro SD slot for external storage expansion, enabling local data logging and model storage. - **Compact Industrial Design:** Engineered for easy installation and deployment in industrial environments, minimizing cabling complexity and space requirements. - **Software Ecosystem:** Fully compatible with **Ubuntu Linux** and **Intel® OpenVINO™ toolkit**, allowing developers to deploy pre‑trained neural networks and optimize inference performance. - **Flexible Deployment:** Designed for edge AI applications such as object detection, classification, quality inspection, and process monitoring.

Hersteller: Adlink Technology Inc.

Kategorie: Smart AI Cams

- **Integrated Vision, Control, AI, and Motion Modules:** The NeuronBot combines multiple subsystems—vision sensing, motion control, and AI computation—into a single cohesive platform. - **Rapid Robotic Development:** Designed as a development and demonstration kit, it supports quick prototyping and testing of robotic algorithms and applications. - **ROS/ROS 2 Compatibility:** Fully supported by open-source ROS and ROS 2 libraries and packages, enabling seamless integration with existing robotic ecosystems. - **High-Performance Computing:** Equipped with Intel® processors (Celeron® or Atom® x5-E3930) and optional Intel® Movidius™ Myriad™ X GPU for AI acceleration. - **Comprehensive Software Stack:** Ships with Ubuntu 18.04 LTS, Neuron SDK, and Intel® OpenVINO™ toolkit for AI inference optimization. - **Integrated LIDAR Sensor:** 360° RPLIDAR A1 laser distance sensor for mapping, navigation, and obstacle detection. - **Compact and Robust Design:** Small form factor (260 × 270 × 260 mm) with a payload capacity of up to 3 kg, suitable for indoor research and educational environments. - **Flexible I/O and Expansion:** Multiple USB, Ethernet, GPIO, and PCIe interfaces for peripheral integration and hardware expansion. - **Optional Wireless and Power Accessories:** Wi-Fi module, battery pack, and mounting brackets available for enhanced mobility and connectivity.

Hersteller: Adlink Technology Inc.

Kategorie: ROS Robots AV

- **x86-64 Mainstream Architecture:** Built on Intel® Xeon® and Core™ processors, providing a familiar and powerful platform for ROS 2 development. - **Real-Time Operation:** Integrated hard and soft real-time mechanisms ensure deterministic control and precise timing for robotics applications. - **Comprehensive I/O Connectivity:** Multiple Ethernet, USB, serial, and digital I/O interfaces support a wide range of sensors, actuators, and peripheral devices. - **Ruggedized Design:** Lockable USB connectors, industrial-grade components, and wide temperature tolerance (-20°C to 70°C) ensure reliability in harsh environments. - **External PCIe Gen3 Expansion:** Ruggedized cassette design allows for additional GPU, VPU, or functional modules to enhance computational performance. - **AI Acceleration Support:** Compatible with Intel® VPUs and NVIDIA® GPUs for AI inference and machine vision workloads. - **Flexible Expansion Options:** Extension box available for additional performance and functionality. - **Software Ecosystem:** Fully compatible with ADLINK Neuron SDK, Ubuntu 18.04 LTS, ROS/ROS 2, and Intel® OpenVINO™ toolkit. - **Industrial-Grade Reliability:** Complies with CE, FCC, UL, and CB safety standards, and meets IEC and MIL-STD vibration and shock requirements. - **Ideal for Robotics Applications:** Designed for AMR, AMIR, and other industrial service robotics requiring real-time control and AI integration.

Hersteller: Adlink Technology Inc.

Kategorie: ROS Robots AV

- **ROS/ROS 2 Compatibility:** Fully supports both ROS and ROS 2 frameworks, ensuring seamless integration with open-source robotic software libraries for motion control, vision, and navigation. - **Intel® Core™ Embedded Processor Options:** Available with 8th/9th Gen Intel® Core™ i7-9700TE, i5-8500T, or i3-8100T processors, offering scalable performance for diverse robotics workloads. - **MXM Graphics Module Support:** Compatible with ADLINK EGX-MXM series GPU modules (P1000, P2000, P3000, P5000), supporting Type A/B MXM modules up to 120W for AI acceleration. - **Rich I/O Interface:** Provides extensive connectivity including multiple Gigabit Ethernet ports, USB 3.1/2.0, serial ports, digital I/O, and M.2 expansion slots for wireless and storage modules. - **AI and Vision Acceleration:** Supports Intel® OpenVINO™ toolkit for optimized deep learning inference and computer vision applications. - **Compact Embedded Design:** Small form factor (197.72 x 167.32 mm) suitable for integration into robotic platforms and industrial environments. - **Flexible Expansion:** Includes PCIe x8 edge connector, M.2 slots (E, B, M keys), and optional TPM 2.0 and eSIM modules. - **Robust Environmental Tolerance:** Operates in temperatures from 0°C to 60°C (without MXM) or 0°C to 55°C (with MXM), with humidity tolerance up to 90% non-condensing. - **Software Ecosystem:** Bundled with ADLINK’s Neuron SDK, Ubuntu 18.04 LTS environment, and middleware support for ROS/ROS 2 and OpenVINO™.

Hersteller: Adlink Technology Inc.

Kategorie: ROS Robots AV

- **High-Performance AI Computing:** Powered by the NVIDIA® Jetson AGX Xavier™ module featuring an integrated **NVIDIA Volta GPU** with **512 CUDA cores** and **dual deep learning accelerators (DLAs)** for high-throughput AI inference. - **Energy Efficiency:** Exceptional performance-per-watt ratio with total system power consumption as low as **30 W**, ideal for mobile and embedded robotic platforms. - **Comprehensive I/O Connectivity:** Multiple high-speed interfaces including **USB 3.1 Gen2**, **Gigabit Ethernet**, **HDMI 2.0a**, **serial ports**, and **GMSL2 camera connectors** for advanced sensor integration. - **Ruggedized Design:** Lockable USB connectors, wide DC input range (9–36 V), and industrial-grade environmental tolerance ensure reliable operation in demanding field conditions. - **Time Synchronization:** Built-in synchronization support for **GMSL2 cameras** and **IMU sensors**, enabling precise multi-sensor data alignment for robotics and vision applications. - **Software Ecosystem:** Full support for **NVIDIA JetPack SDK** and **ADLINK Neuron SDK**, providing a complete development environment for AI, computer vision, and robotics applications. - **ROS 2 Integration:** Preconfigured for **ROS 2**, facilitating rapid deployment of robotic frameworks and middleware for autonomous navigation, manipulation, and perception. - **Flexible Expansion:** M.2 and Mini PCIe slots for storage, Wi-Fi, LTE, and other communication modules. - **Industrial Reliability:** Compliance with **CE**, **FCC Class A**, **UL**, and **cUL** standards, ensuring electromagnetic and safety robustness.

Hersteller: Adlink Technology Inc.

Kategorie: ROS Robots AV

- **Processor Support:** Intel® Core™ i7/i5/i3 and Celeron® processors (Socket G2, rPGA988B). This model is equipped with an Intel® Celeron® B810 dual‑core CPU at 1.6 GHz, 2 MB L2 cache, 32 nm process, 35 W TDP. - **Chipset:** Intel® QM67 Express Chipset for embedded and industrial applications. - **Graphics:** Integrated Intel® HD Graphics with simultaneous HDMI, DVI‑D, and VGA outputs. - **Memory:** 4 GB DDR3L‑1066 MHz SO‑DIMM (expandable up to 8 GB, dual‑channel). - **Storage:** 1× SD socket (up to 8 GB) and dual 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1. - **Expansion Slots:** 1× PCIe x16, 1× PCI (via riser card), and 1× Mini PCIe slot for wireless or SSD modules. - **Networking:** Dual Intel® Gigabit Ethernet ports (Intel® 82579LM and 82574L controllers) with Wake‑on‑LAN support. - **Serial Communication:** 4× COM ports (3× RS‑232, 1× RS‑232/422/485). - **USB Connectivity:** 6× USB 2.0 ports (2 front, 4 rear). - **Audio:** Realtek ALC892 HD Audio with Mic‑in, Line‑in, and Line‑out. - **Power Supply:** Integrated 250 W FlexATX AC power supply (100–240 VAC input). - **Cooling:** Dual 60 mm fans with removable air filters for easy maintenance. - **Mounting:** Wall‑mount brackets included; optional desktop or rack integration. - **Environmental Compliance:** CE, FCC Class A, and RoHS compliant. - **Operating Temperature:** 0 °C – 50 °C; storage –20 °C – 75 °C. - **Dimensions:** 330 mm (W) × 222 mm (D) × 88 mm (H). - **Weight:** Approx. 4.35 kg (9.6 lb).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Support:** Intel® Core™ i7-2710QE (2.1GHz, 6MB L2 Cache, 45W TDP), with options for i5-2510E, i3-2330E, and Celeron® B810. - **Chipset:** Intel® QM67 Express Chipset for enhanced I/O and graphics integration. - **Graphics:** Integrated Intel® HD Graphics with triple display output (HDMI, DVI-D, VGA). - **Memory:** Dual-channel DDR3 1066/1333MHz SO-DIMM, up to 8GB. - **Storage:** Two 2.5” SATA 6Gb/s drive bays supporting RAID 0/1; anti-shock mounting design. - **Expansion:** 1× PCIe x16 slot, 1× PCI slot (via riser card), and 1× Mini PCIe slot for wireless or SSD modules. - **Networking:** Dual Gigabit Ethernet ports (Intel® 82579LM and 82574L controllers) with Wake-on-LAN support. - **Serial Communication:** Four COM ports (1× RS-232/422/485, 3× RS-232). - **USB Connectivity:** Six USB 2.0 ports (2 front, 4 rear). - **Audio:** Realtek ALC892 HD Audio with Mic-in, Line-in, and Line-out. - **Power Supply:** Integrated 250W FlexATX AC PSU (100–240V AC input). - **Cooling:** Dual 6cm fans with removable air filters for easy maintenance. - **Mounting:** Wall-mount brackets included; optional rack or panel mounting. - **Environmental Tolerance:** Operating temperature 0°C to +50°C; storage -20°C to +75°C. - **Certifications:** CE, FCC Class A, RoHS compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Support:** Intel® Core™ i7‑2710QE, i5‑2510E, i3‑2330E, and Celeron® B810 (Socket G2, rPGA988B package). - **Chipset:** Intel® QM67 Express Chipset. - **Graphics:** Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA). - **Memory:** Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB. - **Storage:** Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design. - **Expansion:** - 1 × PCI Express x16 slot - 1 × PCI slot (via riser card) - 1 × Mini PCI Express slot (for SSD or wireless module) - **Networking:** Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN. - **I/O Interfaces:** - 6 × USB 2.0 (2 front, 4 rear) - 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485) - 3 × Audio jacks (Mic‑in, Line‑in, Line‑out) - **Power Supply:** 250 W FlexATX AC PSU (100–240 V AC input). - **Cooling:** Dual 60 mm fans with replaceable air filters. - **Mounting:** Wall‑mount brackets included; optional antenna hole for WLAN. - **Operating Temperature:** 0 °C – 50 °C. - **Certifications:** CE, FCC Class A, RoHS compliant. - **Form Factor:** Compact 2U chassis (330 × 222 × 88 mm).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i7‑6700TE, Quad‑Core, 2.4 GHz (Turbo up to 3.4 GHz), 8 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (2 × 16 GB). - **Graphics:** Integrated Intel® HD Graphics 530 supporting up to three independent displays. - **Display Interfaces:** - 2 × DisplayPort 1.2 (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (1920 × 1080 @ 60 Hz) - 1 × VGA (1920 × 1200 @ 60 Hz) - **Ethernet:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN. - **Serial Communication:** - 2 × software‑selectable RS‑232/422/485 (COM1 & COM2) with auto‑flow control - 2 × RS‑232 (COM3 & COM4) - 2 kV surge protection on RS‑422/485 lines - **USB Connectivity:** - 4 × USB 3.0 (Type A) - 2 × USB 2.0 (Type A) - 1 × internal USB 2.0 (optional) - Each port supports up to 1.6 A current output. - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **Expansion:** 1 × Mini PCIe slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Storage:** - 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD - 1 × Type II CFast slot (external, rear‑mounted) - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Fanless Design:** Passive cooling for silent, dust‑resistant operation. - **Mounting:** Wall‑mount kit included. - **Software Support:** Windows 7 Pro, Windows Embedded Standard 7, Windows 10 IoT Enterprise, and Linux (Ubuntu 12.04/Fedora 18 on request). - **Certifications:** CE, FCC Class A, UL/cUL, CB, RoHS, WEEE compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i5‑6500TE, Quad‑Core, 2.3 GHz (Turbo up to 3.3 GHz), 6 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual DDR4‑2133 MHz SO‑DIMM sockets, up to 32 GB total capacity. - **Graphics:** Integrated Intel® HD Graphics 530 supporting up to three independent displays. - **Display Interfaces:** - 2 × DisplayPort 1.2 (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (1920 × 1080 @ 60 Hz) - 1 × VGA (1920 × 1200 @ 60 Hz) - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN. - **Serial Communication:** 2 × software‑selectable RS‑232/422/485 ports (COM1/2) and 2 × RS‑232 ports (COM3/4). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 (optional). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output. - **Expansion:** 1 × Mini PCIe slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Storage:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector. - **Cooling:** Fanless passive thermal design for silent, dust‑resistant operation. - **Mounting:** Wall‑mount kit included. - **Operating Temperature:** 0 °C – 50 °C (industrial SSD recommended). - **Software Support:** Windows 7 Pro, Windows 10 IoT Enterprise, Linux (Ubuntu 12.04/Fedora 18 on request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard). - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. - **Fanless Design:** Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments. - **Networking:** Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support. - **Serial Communication:** Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional). - **Storage Options:** 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted). - **Expansion:** 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Mounting:** Wall‑mount kit included. - **Construction:** Compact, industrial‑grade aluminum chassis with front‑accessible I/O.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Fanless Industrial Design:** Completely fanless architecture ensures silent operation, reduced maintenance, and enhanced reliability in dusty or vibration-prone environments. - **Intel® Coffee Lake-S Platform:** Supports 8th and 9th Generation Intel® Core™ i7/i5/i3 and Xeon® E processors (LGA1151 socket), delivering high computing performance for industrial workloads. - **High Expandability:** Offers multiple PCI/PCIe expansion slots for add-on cards such as frame grabbers, motion controllers, or data acquisition modules. - **Rich I/O Connectivity:** Includes multiple Gigabit Ethernet ports, USB 3.1/2.0, serial ports (RS-232/422/485), and display outputs (DisplayPort, HDMI, DVI, or VGA depending on configuration). - **Wide Operating Temperature Range:** Designed for reliable operation in extended temperature environments, typically from -20°C to +60°C (depending on CPU and storage configuration). - **Shock and Vibration Resistance:** Built to meet industrial-grade mechanical standards for deployment in factory floors, vehicles, or outdoor enclosures. - **Flexible Storage Options:** Supports 2.5" SATA drives, M.2, and mSATA SSDs for flexible storage configurations. - **Dual Independent Display Support:** Enables simultaneous output to two displays for monitoring or control interfaces. - **Long Lifecycle Support:** Industrial-grade components and extended product availability ensure long-term deployment stability. - **Power Efficiency:** Optimized thermal design and power management for continuous 24/7 operation.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i7‑6700TE (Skylake) Quad‑Core CPU, 2.4 GHz base frequency, 8 MB cache, up to 3.4 GHz Turbo Boost. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Graphics:** Integrated Intel® HD Graphics 530 with support for dual independent displays. - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion:** - 1 × PCIe x16 (Gen 3) - 1 × PCI (32‑bit, 33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE boot, and IEEE 1588 support. - **Storage:** - 1 × internal SATA III (6 Gb/s) for 2.5″ HDD/SSD - 1 × rear CFast slot (Type II, SATA interface) - **USB Connectivity:** - 4 × USB 3.0 (front) - 2 × USB 2.0 (front) - 1 × internal USB 2.0 (Type A) - **Serial Communication:** - 2 × software‑selectable RS‑232/422/485 (COM1, COM2) - 2 × RS‑232 (COM3, COM4) - **Digital I/O:** 8 × DI and 8 × DO channels (non‑isolated). - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector. - **Cooling:** Fanless design with optional smart fan module for PCI/PCIe card heat dissipation. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Mounting:** Wall‑mount kit included. - **Dimensions:** 220 (W) × 210 (D) × 170 (H) mm. - **Weight:** 4.5 kg.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** Intel® Core™ i5‑6500TE Quad‑Core CPU (2.3 GHz base, 3.3 GHz Turbo, 6 MB cache) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz - **Graphics:** Integrated Intel® HD Graphics 530 with support for dual independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion:** - 1 × PCIe x16 Gen3 slot - 1 × PCI 32‑bit slot (33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE boot, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast Type II socket (SATA interface, 3.0 Gb/s) - **I/O Interfaces:** - 4 × USB 3.0 (Type A) - 2 × USB 2.0 (Type A) + 1 × internal USB 2.0 - 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232) - 8 × Digital Input + 8 × Digital Output channels - 1 × Mic‑in and 1 × Line‑out audio - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C to 50 °C (fanless, with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Fanless aluminum chassis for dust‑resistant, low‑noise operation

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor:** 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to two independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion Slots:** - 1 × PCIe x16 (Gen 3) - 1 × PCI (32‑bit, 33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast slot (Type II, SATA interface) - **USB Connectivity:** - 4 × USB 3.0 (external, Type A) - 2 × USB 2.0 (external, Type A) - 1 × internal USB 2.0 (Type A) - **Serial Communication:** - 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2) - 2 × RS‑232 ports (COM3, COM4) - **Digital I/O:** 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs) - **Audio:** 1 × Mic‑in, 1 × Line‑out - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C – 50 °C (fanless operation with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Rugged aluminum chassis, fanless thermal design

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700TE (quad-core, 2.4 GHz, 35W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance in harsh industrial environments. - **Memory:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Support:** Up to two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA ports. - **Expansion Capability:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit expansion slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 50°C (fanless operation). - **Mounting:** Wall-mount kit included. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg. - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Graphics:** Integrated Intel® HD Graphics 530 supporting dual independent displays. - **Display Interfaces:** 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz. - **Expansion Capability:** - 1 × PCIe Gen3 x16 slot - 3 × PCI 32‑bit slots - 1 × Mini PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (fanless operation). - **Mounting:** Wall‑mount kit included. - **Construction:** Rugged aluminum chassis for industrial environments. - **Software Support:** Windows 10 / 7 / Embedded Standard 7 and Linux.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU. Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series. - **Chipset:** Intel® H110 Express chipset (MVP‑6010 series). - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. Maximum resolutions: - DisplayPort: 4096 × 2304 @ 60 Hz - DVI‑D: 1920 × 1200 @ 60 Hz - VGA: 1920 × 1080 @ 60 Hz - **Expansion Capability:** 1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards. 1 × Mini‑PCIe slot with USIM socket for wireless or communication modules. - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support. - **Serial Communication:** 4 × COM ports (DB‑9): - 2 × software‑selectable RS‑232/422/485 (COM1, COM2) - 2 × RS‑232 (COM3, COM4) - RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines. - **Digital I/O:** 8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel. - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–). Optional 160 W AC‑DC adapter for AC input. - **Mechanical Design:** Fanless aluminum chassis with front‑accessible I/O for simplified maintenance. Wall‑mount kit included. - **Operating Environment:** Fanless operation from 0 °C to 50 °C (with 35 W CPU). Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast). Humidity: 95 % @ 40 °C (non‑condensing).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700 (65W) Skylake CPU with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance. - **Memory Support:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Capability:** Supports two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA outputs. - **Expansion Slots:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio Interface:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 40°C (for 65W CPU). - **Mounting:** Wall-mount kit included for flexible installation. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg (10.36 lbs). - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series