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- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual In-line Memory Module)
- Capacity: 4 GB
- Extended Temperature Range: –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions
- High Reliability: Designed for continuous operation in industrial and embedded systems where uptime and stability are critical
- Low Power Consumption: DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw
- Compact Design: SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers
- High Data Throughput: Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration)
- Compatibility: Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms
- Error-Free Operation: Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions
- RoHS Compliant: Environmentally friendly design meeting Restriction of Hazardous Substances directives
- Form Factor: SO-DIMM (Small Outline Dual In-line Memory Module)
- Capacity: 4 GB
- Extended Temperature Range: –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions
- High Reliability: Designed for continuous operation in industrial and embedded systems where uptime and stability are critical
- Low Power Consumption: DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw
- Compact Design: SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers
- High Data Throughput: Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration)
- Compatibility: Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms
- Error-Free Operation: Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions
- RoHS Compliant: Environmentally friendly design meeting Restriction of Hazardous Substances directives
1. Product Overview
Product Name: SO-DIMM DDR3 4GB Extended Temperature
Model: 4GB-DDR3-ET
Series: DDR3 SO-DIMM Industrial Memory Series
Article Number: 4GB-DDR3-ET
Manufacturer: [Manufacturer not specified – typically used by industrial and embedded system integrators]
The 4GB-DDR3-ET is a high-reliability, small-outline dual in-line memory module (SO-DIMM) designed for industrial and embedded computing applications that require stable performance across extended temperature ranges. This module provides 4 gigabytes (GB) of DDR3 SDRAM capacity and is engineered to operate reliably in environments with ambient temperatures ranging from –20°C to +70°C, making it suitable for ruggedized systems, industrial automation, transportation, and outdoor computing platforms.
2. Key Features
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual In-line Memory Module)
- Capacity: 4 GB
- Extended Temperature Range: –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions
- High Reliability: Designed for continuous operation in industrial and embedded systems where uptime and stability are critical
- Low Power Consumption: DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw
- Compact Design: SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers
- High Data Throughput: Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration)
- Compatibility: Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms
- Error-Free Operation: Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions
- RoHS Compliant: Environmentally friendly design meeting Restriction of Hazardous Substances directives
3. Technical Specifications
- Memory Type: DDR3 SDRAM
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB (4096 MB)
- Data Rate: DDR3-1066 / DDR3-1333 / DDR3-1600 (depending on system support)
- Bus Width: 64-bit data bus
- Voltage: 1.5 V nominal operating voltage
- CAS Latency (CL): Typically CL9–CL11 (varies by speed grade)
- Operating Temperature Range: –20°C to +70°C (Extended Temperature)
- Storage Temperature Range: –40°C to +85°C (typical for industrial-grade modules)
- Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- PCB Layers: Multi-layer PCB design for signal integrity and thermal stability
- Material: FR-4 glass epoxy substrate with gold-plated contacts for corrosion resistance
- ECC Support: Non-ECC (standard version); ECC variant may be available upon request
- SPD (Serial Presence Detect): Integrated EEPROM for automatic configuration and system recognition
- Compliance: JEDEC Standard JESD79-3F for DDR3 SDRAM
4. Functionality
The 4GB-DDR3-ET module functions as a volatile memory component that temporarily stores data for active system processes. It operates synchronously with the system clock, allowing high-speed data transfer between the memory controller and the CPU. The DDR3 architecture doubles the data rate per clock cycle compared to DDR2, enabling faster performance and improved bandwidth efficiency.
Use Cases and Applications:
- Industrial PCs and embedded controllers
- Automation and control systems
- Transportation and railway computing
- Outdoor digital signage and kiosks
- Network appliances and edge computing devices
- Ruggedized laptops and portable instrumentation
- Medical imaging and diagnostic equipment
- Military and defense-grade computing platforms (non-radiation hardened)
Compatibility:
The module is compatible with any system supporting DDR3 SO-DIMM slots and 1.5 V operation. It can be used in both single-channel and dual-channel configurations depending on the motherboard design. The integrated SPD chip ensures automatic detection of timing parameters by the BIOS or firmware, simplifying configuration and ensuring optimal performance.
5. Components & Accessories
Included Items:
- 1 × 4GB DDR3 SO-DIMM Extended Temperature Memory Module (4GB-DDR3-ET)
- Standard anti-static packaging for ESD protection
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- Heat spreader or thermal pad for improved heat dissipation in high-temperature environments
- ECC (Error-Correcting Code) variant for mission-critical applications
- Custom labeling or serialization for OEM integration
Connectors:
- 204-pin gold-plated edge connector compatible with DDR3 SO-DIMM sockets
- Keyed notch for correct orientation and secure installation
6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot
- System BIOS supporting DDR3 memory modules up to 4 GB per slot
- Operating voltage of 1.5 V
Mounting Options:
- Standard insertion into SO-DIMM socket at a 30° angle, followed by downward pressure to lock into place
- Retaining clips or latches on the socket secure the module
Configuration:
- Automatic configuration via SPD (Serial Presence Detect) EEPROM
- No manual jumper or switch settings required
- BIOS or firmware automatically detects memory size, speed, and timing parameters
- For dual-channel operation, install matched pairs of identical modules
Installation Steps:
1. Power off the system and disconnect from power source.
2. Ground yourself to prevent electrostatic discharge.
3. Insert the module into the SO-DIMM slot at an angle, aligning the notch with the key in the socket.
4. Press down gently until the module clicks into place.
5. Reassemble and power on the system.
6. Verify memory recognition in BIOS or operating system.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports DDR3 data rates up to 1600 MT/s (megatransfers per second), providing theoretical bandwidth up to 12.8 GB/s per channel.
- Actual performance depends on system configuration, CPU memory controller, and BIOS settings.
Capacity:
- 4 GB per module; scalable to higher total system memory when multiple modules are installed.
Efficiency:
- Operates at 1.5 V, offering improved power efficiency compared to DDR2 (1.8 V).
- Lower power consumption reduces heat generation, enhancing system reliability in thermally constrained environments.
Thermal Performance:
- Rated for continuous operation from –20°C to +70°C ambient temperature.
- Tested for thermal cycling and stability under industrial conditions.
Reliability:
- Built using industrial-grade DRAM chips screened for extended temperature tolerance.
- Each module undergoes functional testing, burn-in, and quality assurance to ensure long-term stability.
Limitations:
- Non-ECC version does not provide error correction; for mission-critical or server-grade applications, ECC variants are recommended.
- DDR3 technology is not backward-compatible with DDR2 or forward-compatible with DDR4 sockets.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3 SDRAM standard JESD79-3F
- RoHS Directive: Compliant with EU RoHS 2011/65/EU and subsequent amendments
- REACH Regulation: Conforms to REACH (EC 1907/2006) requirements for chemical safety
- CE Marking: Meets applicable European safety and electromagnetic compatibility directives
- UL Certification: Manufactured in facilities certified to UL and ISO 9001 quality standards
- Environmental Testing: Qualified for thermal shock, vibration, and humidity per industrial-grade testing protocols
- ESD Protection: Packaged and handled according to IEC 61340-5-1 electrostatic discharge control standards
9. Additional Information
Warranty:
- Typically covered by a limited lifetime warranty or 3–5 year industrial warranty (depending on supplier or OEM policy).
- Warranty covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer or distributor.
- Engineering support for system integration and thermal management available upon request.
Maintenance:
- No active maintenance required; periodic inspection recommended for systems operating in high-dust or high-vibration environments.
- Ensure proper airflow and thermal management to maintain optimal performance.
Firmware / SPD Updates:
- SPD data pre-programmed for automatic system recognition.
- Updates or custom SPD programming available for OEM configurations.
Lifecycle and Availability:
- Designed for long-term availability to support industrial product lifecycles (typically 5–7 years).
- Stable BOM (Bill of Materials) policy ensures consistent component sourcing and minimal revision changes.
Environmental Considerations:
- Lead-free, halogen-free construction options available.
- Designed for reduced environmental impact and compliance with global environmental standards.
### Summary
The 4GB-DDR3-ET SO-DIMM DDR3 4GB Extended Temperature Memory Module is a robust, industrial-grade memory solution engineered for reliability, performance, and durability in demanding environments. With its extended operating temperature range of –20°C to +70°C, compact SO-DIMM form factor, and compliance with JEDEC and RoHS standards, it is ideally suited for embedded systems, industrial automation, and rugged computing platforms. Offering 4 GB of high-speed DDR3 memory capacity, low power consumption, and automatic configuration via SPD, the 4GB-DDR3-ET delivers dependable performance for mission-critical applications where stability and longevity are paramount.
Product Name: SO-DIMM DDR3 4GB Extended Temperature
Model: 4GB-DDR3-ET
Series: DDR3 SO-DIMM Industrial Memory Series
Article Number: 4GB-DDR3-ET
Manufacturer: [Manufacturer not specified – typically used by industrial and embedded system integrators]
The 4GB-DDR3-ET is a high-reliability, small-outline dual in-line memory module (SO-DIMM) designed for industrial and embedded computing applications that require stable performance across extended temperature ranges. This module provides 4 gigabytes (GB) of DDR3 SDRAM capacity and is engineered to operate reliably in environments with ambient temperatures ranging from –20°C to +70°C, making it suitable for ruggedized systems, industrial automation, transportation, and outdoor computing platforms.
2. Key Features
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual In-line Memory Module)
- Capacity: 4 GB
- Extended Temperature Range: –20°C to +70°C, ensuring stable operation in harsh or variable environmental conditions
- High Reliability: Designed for continuous operation in industrial and embedded systems where uptime and stability are critical
- Low Power Consumption: DDR3 technology provides improved energy efficiency compared to DDR2, reducing thermal output and power draw
- Compact Design: SO-DIMM form factor optimized for space-constrained systems such as industrial PCs, embedded controllers, and compact servers
- High Data Throughput: Supports standard DDR3 data rates (commonly 1066, 1333, 1600 MT/s depending on system configuration)
- Compatibility: Fully compliant with JEDEC DDR3 standards, ensuring interoperability with a wide range of industrial motherboards and embedded platforms
- Error-Free Operation: Manufactured using high-quality DRAM chips and tested for data integrity under extended temperature conditions
- RoHS Compliant: Environmentally friendly design meeting Restriction of Hazardous Substances directives
3. Technical Specifications
- Memory Type: DDR3 SDRAM
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB (4096 MB)
- Data Rate: DDR3-1066 / DDR3-1333 / DDR3-1600 (depending on system support)
- Bus Width: 64-bit data bus
- Voltage: 1.5 V nominal operating voltage
- CAS Latency (CL): Typically CL9–CL11 (varies by speed grade)
- Operating Temperature Range: –20°C to +70°C (Extended Temperature)
- Storage Temperature Range: –40°C to +85°C (typical for industrial-grade modules)
- Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- PCB Layers: Multi-layer PCB design for signal integrity and thermal stability
- Material: FR-4 glass epoxy substrate with gold-plated contacts for corrosion resistance
- ECC Support: Non-ECC (standard version); ECC variant may be available upon request
- SPD (Serial Presence Detect): Integrated EEPROM for automatic configuration and system recognition
- Compliance: JEDEC Standard JESD79-3F for DDR3 SDRAM
4. Functionality
The 4GB-DDR3-ET module functions as a volatile memory component that temporarily stores data for active system processes. It operates synchronously with the system clock, allowing high-speed data transfer between the memory controller and the CPU. The DDR3 architecture doubles the data rate per clock cycle compared to DDR2, enabling faster performance and improved bandwidth efficiency.
Use Cases and Applications:
- Industrial PCs and embedded controllers
- Automation and control systems
- Transportation and railway computing
- Outdoor digital signage and kiosks
- Network appliances and edge computing devices
- Ruggedized laptops and portable instrumentation
- Medical imaging and diagnostic equipment
- Military and defense-grade computing platforms (non-radiation hardened)
Compatibility:
The module is compatible with any system supporting DDR3 SO-DIMM slots and 1.5 V operation. It can be used in both single-channel and dual-channel configurations depending on the motherboard design. The integrated SPD chip ensures automatic detection of timing parameters by the BIOS or firmware, simplifying configuration and ensuring optimal performance.
5. Components & Accessories
Included Items:
- 1 × 4GB DDR3 SO-DIMM Extended Temperature Memory Module (4GB-DDR3-ET)
- Standard anti-static packaging for ESD protection
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- Heat spreader or thermal pad for improved heat dissipation in high-temperature environments
- ECC (Error-Correcting Code) variant for mission-critical applications
- Custom labeling or serialization for OEM integration
Connectors:
- 204-pin gold-plated edge connector compatible with DDR3 SO-DIMM sockets
- Keyed notch for correct orientation and secure installation
6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot
- System BIOS supporting DDR3 memory modules up to 4 GB per slot
- Operating voltage of 1.5 V
Mounting Options:
- Standard insertion into SO-DIMM socket at a 30° angle, followed by downward pressure to lock into place
- Retaining clips or latches on the socket secure the module
Configuration:
- Automatic configuration via SPD (Serial Presence Detect) EEPROM
- No manual jumper or switch settings required
- BIOS or firmware automatically detects memory size, speed, and timing parameters
- For dual-channel operation, install matched pairs of identical modules
Installation Steps:
1. Power off the system and disconnect from power source.
2. Ground yourself to prevent electrostatic discharge.
3. Insert the module into the SO-DIMM slot at an angle, aligning the notch with the key in the socket.
4. Press down gently until the module clicks into place.
5. Reassemble and power on the system.
6. Verify memory recognition in BIOS or operating system.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports DDR3 data rates up to 1600 MT/s (megatransfers per second), providing theoretical bandwidth up to 12.8 GB/s per channel.
- Actual performance depends on system configuration, CPU memory controller, and BIOS settings.
Capacity:
- 4 GB per module; scalable to higher total system memory when multiple modules are installed.
Efficiency:
- Operates at 1.5 V, offering improved power efficiency compared to DDR2 (1.8 V).
- Lower power consumption reduces heat generation, enhancing system reliability in thermally constrained environments.
Thermal Performance:
- Rated for continuous operation from –20°C to +70°C ambient temperature.
- Tested for thermal cycling and stability under industrial conditions.
Reliability:
- Built using industrial-grade DRAM chips screened for extended temperature tolerance.
- Each module undergoes functional testing, burn-in, and quality assurance to ensure long-term stability.
Limitations:
- Non-ECC version does not provide error correction; for mission-critical or server-grade applications, ECC variants are recommended.
- DDR3 technology is not backward-compatible with DDR2 or forward-compatible with DDR4 sockets.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3 SDRAM standard JESD79-3F
- RoHS Directive: Compliant with EU RoHS 2011/65/EU and subsequent amendments
- REACH Regulation: Conforms to REACH (EC 1907/2006) requirements for chemical safety
- CE Marking: Meets applicable European safety and electromagnetic compatibility directives
- UL Certification: Manufactured in facilities certified to UL and ISO 9001 quality standards
- Environmental Testing: Qualified for thermal shock, vibration, and humidity per industrial-grade testing protocols
- ESD Protection: Packaged and handled according to IEC 61340-5-1 electrostatic discharge control standards
9. Additional Information
Warranty:
- Typically covered by a limited lifetime warranty or 3–5 year industrial warranty (depending on supplier or OEM policy).
- Warranty covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer or distributor.
- Engineering support for system integration and thermal management available upon request.
Maintenance:
- No active maintenance required; periodic inspection recommended for systems operating in high-dust or high-vibration environments.
- Ensure proper airflow and thermal management to maintain optimal performance.
Firmware / SPD Updates:
- SPD data pre-programmed for automatic system recognition.
- Updates or custom SPD programming available for OEM configurations.
Lifecycle and Availability:
- Designed for long-term availability to support industrial product lifecycles (typically 5–7 years).
- Stable BOM (Bill of Materials) policy ensures consistent component sourcing and minimal revision changes.
Environmental Considerations:
- Lead-free, halogen-free construction options available.
- Designed for reduced environmental impact and compliance with global environmental standards.
### Summary
The 4GB-DDR3-ET SO-DIMM DDR3 4GB Extended Temperature Memory Module is a robust, industrial-grade memory solution engineered for reliability, performance, and durability in demanding environments. With its extended operating temperature range of –20°C to +70°C, compact SO-DIMM form factor, and compliance with JEDEC and RoHS standards, it is ideally suited for embedded systems, industrial automation, and rugged computing platforms. Offering 4 GB of high-speed DDR3 memory capacity, low power consumption, and automatic configuration via SPD, the 4GB-DDR3-ET delivers dependable performance for mission-critical applications where stability and longevity are paramount.
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