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- Memory Type: DDR3L (Double Data Rate 3 Low Voltage)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4 GB
- Voltage: 1.35 V nominal operating voltage (backward compatible with 1.5 V systems depending on platform support)
- Extended Temperature Range: –20°C to +70°C operational range for industrial and embedded environments
- Low Power Consumption: Optimized for energy-efficient systems, reducing heat generation and power draw
- High Reliability: Designed for continuous operation in demanding conditions, with robust signal integrity and thermal stability
- Compact Design: SO-DIMM form factor ideal for space-constrained systems such as industrial PCs, embedded controllers, and compact computing platforms
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of DDR3L-compatible chipsets and processors
- Enhanced Thermal Tolerance: Built using high-quality DRAM components screened for extended temperature performance
- Plug-and-Play Installation: Standard 204-pin SO-DIMM interface for easy integration into compatible systems
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4 GB
- Voltage: 1.35 V nominal operating voltage (backward compatible with 1.5 V systems depending on platform support)
- Extended Temperature Range: –20°C to +70°C operational range for industrial and embedded environments
- Low Power Consumption: Optimized for energy-efficient systems, reducing heat generation and power draw
- High Reliability: Designed for continuous operation in demanding conditions, with robust signal integrity and thermal stability
- Compact Design: SO-DIMM form factor ideal for space-constrained systems such as industrial PCs, embedded controllers, and compact computing platforms
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of DDR3L-compatible chipsets and processors
- Enhanced Thermal Tolerance: Built using high-quality DRAM components screened for extended temperature performance
- Plug-and-Play Installation: Standard 204-pin SO-DIMM interface for easy integration into compatible systems
1. Product Overview
Product Name: 4GB-DDR3L-ET
Model / Article Number: 4GB-DDR3L-ET
Series: DDR3L SO-DIMM Extended Temperature Series
Manufacturer: [Manufacturer not specified in source content; typically produced by industrial memory module suppliers specializing in extended-temperature DRAM solutions]
The 4GB-DDR3L-ET is a 4-gigabyte DDR3L SO-DIMM memory module designed for embedded, industrial, and rugged computing environments that require stable operation across a wide temperature range. This module operates at a low voltage of 1.35V, offering reduced power consumption compared to standard DDR3 modules (1.5V), while maintaining full compatibility with DDR3L-compliant systems. The “ET” designation indicates Extended Temperature capability, ensuring reliable performance from –20°C to +70°C, making it suitable for mission-critical applications in harsh or thermally variable conditions.
2. Key Features
- Memory Type: DDR3L (Double Data Rate 3 Low Voltage)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4 GB
- Voltage: 1.35 V nominal operating voltage (backward compatible with 1.5 V systems depending on platform support)
- Extended Temperature Range: –20°C to +70°C operational range for industrial and embedded environments
- Low Power Consumption: Optimized for energy-efficient systems, reducing heat generation and power draw
- High Reliability: Designed for continuous operation in demanding conditions, with robust signal integrity and thermal stability
- Compact Design: SO-DIMM form factor ideal for space-constrained systems such as industrial PCs, embedded controllers, and compact computing platforms
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of DDR3L-compatible chipsets and processors
- Enhanced Thermal Tolerance: Built using high-quality DRAM components screened for extended temperature performance
- Plug-and-Play Installation: Standard 204-pin SO-DIMM interface for easy integration into compatible systems
3. Technical Specifications
- Memory Type: DDR3L SDRAM (Synchronous Dynamic Random Access Memory)
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB (4096 MB)
- Data Rate: Typically supports DDR3L-1333 or DDR3L-1600 speeds (exact speed dependent on system configuration and manufacturer specification)
- Voltage: 1.35 V (nominal), backward compatible with 1.5 V operation in dual-voltage systems
- Temperature Range:
- Operating: –20°C to +70°C
- Storage: Typically –40°C to +85°C (depending on manufacturer)
- Module Dimensions:
- Length: ~67.6 mm
- Height: ~30 mm
- Thickness: ~3.8 mm (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- Pin Count: 204 pins (gold-plated contacts for corrosion resistance and signal reliability)
- ECC Support: Non-ECC (standard configuration; ECC variant may be available depending on manufacturer)
- Rank / Organization: Single or dual rank (varies by DRAM configuration)
- CAS Latency (CL): Typically CL9–CL11 (depending on speed grade)
- Bandwidth: Up to 12.8 GB/s (DDR3L-1600)
- PCB Material: Multi-layer FR4 PCB with controlled impedance traces for signal integrity
- Compliance: JEDEC standard JESD79-3L for DDR3L memory
4. Functionality
The 4GB-DDR3L-ET module functions as a volatile memory component for computing systems, temporarily storing data required by the CPU for active processes. It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal to achieve high throughput.
Use Cases and Applications:
- Industrial PCs and Automation Systems: Reliable operation in factory floors, control systems, and industrial computing platforms exposed to temperature fluctuations.
- Embedded Systems: Suitable for embedded controllers, single-board computers (SBCs), and IoT gateways requiring compact, low-power memory.
- Transportation and Automotive Electronics: Ideal for in-vehicle computing, infotainment, and telematics systems operating in extended temperature environments.
- Networking and Communication Equipment: Used in routers, switches, and network appliances where thermal stability and uptime are critical.
- Medical and Military Equipment: Supports applications demanding high reliability and consistent performance under environmental stress.
Compatibility:
The module is compatible with any system supporting DDR3L SO-DIMM memory, including Intel and AMD platforms, industrial motherboards, and embedded computing modules. It can operate in dual-channel configurations when paired with an identical module.
5. Components & Accessories
Included Items:
- One (1) 4GB DDR3L SO-DIMM module (4GB-DDR3L-ET)
Optional Add-ons / Accessories:
- Additional DDR3L SO-DIMM modules for dual-channel configurations
- Thermal pads or heat spreaders (optional, depending on system thermal design)
- Anti-static packaging for safe handling and transport
Connectors:
- 204-pin gold-plated SO-DIMM edge connector
- Standard keying notch for correct orientation during installation
6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules
- Available 204-pin SO-DIMM slot
- System BIOS supporting DDR3L voltage (1.35 V)
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retention clips lock into place.
- Ensure proper alignment with the keyed notch to prevent incorrect installation.
Configuration:
- The module is automatically detected by the system BIOS/UEFI.
- Memory speed and timing parameters are typically configured automatically via SPD (Serial Presence Detect).
- For optimal performance, use matched pairs in dual-channel configurations.
Environmental Considerations:
- Ensure adequate airflow within the system enclosure to maintain operating temperatures within the specified –20°C to +70°C range.
- Avoid electrostatic discharge (ESD) during installation by using proper grounding and anti-static precautions.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports DDR3L data rates up to 1600 MT/s (megatransfers per second), providing a theoretical peak bandwidth of 12.8 GB/s per module.
- Actual performance depends on system configuration, memory controller, and BIOS settings.
Capacity and Scalability:
- 4 GB capacity per module; scalable by adding additional modules in available slots.
- Supports dual-channel operation for increased memory bandwidth.
Efficiency:
- Operates at 1.35 V, reducing power consumption by approximately 10–15% compared to standard 1.5 V DDR3 modules.
- Lower power draw contributes to reduced heat generation and improved system thermal efficiency.
Reliability and Stability:
- Designed for continuous operation in extended temperature environments.
- High-quality DRAM chips screened for thermal endurance and electrical stability.
- Multi-layer PCB design minimizes signal noise and crosstalk.
Limitations:
- Non-ECC configuration may not provide error correction; for mission-critical applications requiring ECC, an ECC variant should be used.
- Performance limited by system memory controller capabilities and BIOS support.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3L standard JESD79-3L
- RoHS Compliance: Manufactured in accordance with Restriction of Hazardous Substances (RoHS) directives, ensuring environmentally safe materials
- REACH Compliance: Conforms to EU REACH regulations for chemical safety
- CE Marking: Meets applicable European safety and electromagnetic compatibility requirements
- UL Certification: Components and PCB materials typically UL-recognized for safety and flammability standards
- Environmental Standards: Designed for extended temperature operation (–20°C to +70°C) per industrial-grade specifications
- ESD Protection: Built-in ESD safeguards during manufacturing and packaging to prevent electrostatic damage
9. Additional Information
Warranty:
- Standard limited warranty (typically 3 to 5 years, depending on manufacturer policy) covering defects in materials and workmanship under normal operating conditions.
Support:
- Technical support available through manufacturer or authorized distributor channels.
- Documentation includes datasheets, installation guides, and compatibility lists.
Maintenance:
- No active maintenance required; ensure proper environmental conditions and system ventilation.
- Periodic system diagnostics recommended to verify memory integrity.
Firmware / SPD Updates:
- SPD (Serial Presence Detect) data pre-programmed for automatic configuration.
- Some manufacturers may offer SPD customization for specific timing or identification requirements.
Lifecycle and Availability:
- Designed for long-term availability to support industrial and embedded product lifecycles.
- Stable component sourcing ensures consistent performance and compatibility across production batches.
Environmental and Operational Notes:
- Suitable for deployment in systems exposed to moderate vibration, dust, and temperature variation.
- Not intended for extreme military or aerospace environments beyond specified temperature limits unless otherwise qualified.
Summary
The 4GB-DDR3L-ET is a high-reliability, low-voltage DDR3L SO-DIMM memory module engineered for industrial and embedded applications requiring dependable performance across a –20°C to +70°C temperature range. With 4 GB capacity, 1.35 V operation, and JEDEC-compliant design, it delivers efficient, stable, and thermally robust memory performance in compact computing systems. Its extended temperature tolerance, low power consumption, and standard 204-pin SO-DIMM interface make it an ideal choice for industrial PCs, embedded controllers, and ruggedized computing platforms where reliability and energy efficiency are paramount.
Product Name: 4GB-DDR3L-ET
Model / Article Number: 4GB-DDR3L-ET
Series: DDR3L SO-DIMM Extended Temperature Series
Manufacturer: [Manufacturer not specified in source content; typically produced by industrial memory module suppliers specializing in extended-temperature DRAM solutions]
The 4GB-DDR3L-ET is a 4-gigabyte DDR3L SO-DIMM memory module designed for embedded, industrial, and rugged computing environments that require stable operation across a wide temperature range. This module operates at a low voltage of 1.35V, offering reduced power consumption compared to standard DDR3 modules (1.5V), while maintaining full compatibility with DDR3L-compliant systems. The “ET” designation indicates Extended Temperature capability, ensuring reliable performance from –20°C to +70°C, making it suitable for mission-critical applications in harsh or thermally variable conditions.
2. Key Features
- Memory Type: DDR3L (Double Data Rate 3 Low Voltage)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4 GB
- Voltage: 1.35 V nominal operating voltage (backward compatible with 1.5 V systems depending on platform support)
- Extended Temperature Range: –20°C to +70°C operational range for industrial and embedded environments
- Low Power Consumption: Optimized for energy-efficient systems, reducing heat generation and power draw
- High Reliability: Designed for continuous operation in demanding conditions, with robust signal integrity and thermal stability
- Compact Design: SO-DIMM form factor ideal for space-constrained systems such as industrial PCs, embedded controllers, and compact computing platforms
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of DDR3L-compatible chipsets and processors
- Enhanced Thermal Tolerance: Built using high-quality DRAM components screened for extended temperature performance
- Plug-and-Play Installation: Standard 204-pin SO-DIMM interface for easy integration into compatible systems
3. Technical Specifications
- Memory Type: DDR3L SDRAM (Synchronous Dynamic Random Access Memory)
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB (4096 MB)
- Data Rate: Typically supports DDR3L-1333 or DDR3L-1600 speeds (exact speed dependent on system configuration and manufacturer specification)
- Voltage: 1.35 V (nominal), backward compatible with 1.5 V operation in dual-voltage systems
- Temperature Range:
- Operating: –20°C to +70°C
- Storage: Typically –40°C to +85°C (depending on manufacturer)
- Module Dimensions:
- Length: ~67.6 mm
- Height: ~30 mm
- Thickness: ~3.8 mm (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- Pin Count: 204 pins (gold-plated contacts for corrosion resistance and signal reliability)
- ECC Support: Non-ECC (standard configuration; ECC variant may be available depending on manufacturer)
- Rank / Organization: Single or dual rank (varies by DRAM configuration)
- CAS Latency (CL): Typically CL9–CL11 (depending on speed grade)
- Bandwidth: Up to 12.8 GB/s (DDR3L-1600)
- PCB Material: Multi-layer FR4 PCB with controlled impedance traces for signal integrity
- Compliance: JEDEC standard JESD79-3L for DDR3L memory
4. Functionality
The 4GB-DDR3L-ET module functions as a volatile memory component for computing systems, temporarily storing data required by the CPU for active processes. It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal to achieve high throughput.
Use Cases and Applications:
- Industrial PCs and Automation Systems: Reliable operation in factory floors, control systems, and industrial computing platforms exposed to temperature fluctuations.
- Embedded Systems: Suitable for embedded controllers, single-board computers (SBCs), and IoT gateways requiring compact, low-power memory.
- Transportation and Automotive Electronics: Ideal for in-vehicle computing, infotainment, and telematics systems operating in extended temperature environments.
- Networking and Communication Equipment: Used in routers, switches, and network appliances where thermal stability and uptime are critical.
- Medical and Military Equipment: Supports applications demanding high reliability and consistent performance under environmental stress.
Compatibility:
The module is compatible with any system supporting DDR3L SO-DIMM memory, including Intel and AMD platforms, industrial motherboards, and embedded computing modules. It can operate in dual-channel configurations when paired with an identical module.
5. Components & Accessories
Included Items:
- One (1) 4GB DDR3L SO-DIMM module (4GB-DDR3L-ET)
Optional Add-ons / Accessories:
- Additional DDR3L SO-DIMM modules for dual-channel configurations
- Thermal pads or heat spreaders (optional, depending on system thermal design)
- Anti-static packaging for safe handling and transport
Connectors:
- 204-pin gold-plated SO-DIMM edge connector
- Standard keying notch for correct orientation during installation
6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules
- Available 204-pin SO-DIMM slot
- System BIOS supporting DDR3L voltage (1.35 V)
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retention clips lock into place.
- Ensure proper alignment with the keyed notch to prevent incorrect installation.
Configuration:
- The module is automatically detected by the system BIOS/UEFI.
- Memory speed and timing parameters are typically configured automatically via SPD (Serial Presence Detect).
- For optimal performance, use matched pairs in dual-channel configurations.
Environmental Considerations:
- Ensure adequate airflow within the system enclosure to maintain operating temperatures within the specified –20°C to +70°C range.
- Avoid electrostatic discharge (ESD) during installation by using proper grounding and anti-static precautions.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports DDR3L data rates up to 1600 MT/s (megatransfers per second), providing a theoretical peak bandwidth of 12.8 GB/s per module.
- Actual performance depends on system configuration, memory controller, and BIOS settings.
Capacity and Scalability:
- 4 GB capacity per module; scalable by adding additional modules in available slots.
- Supports dual-channel operation for increased memory bandwidth.
Efficiency:
- Operates at 1.35 V, reducing power consumption by approximately 10–15% compared to standard 1.5 V DDR3 modules.
- Lower power draw contributes to reduced heat generation and improved system thermal efficiency.
Reliability and Stability:
- Designed for continuous operation in extended temperature environments.
- High-quality DRAM chips screened for thermal endurance and electrical stability.
- Multi-layer PCB design minimizes signal noise and crosstalk.
Limitations:
- Non-ECC configuration may not provide error correction; for mission-critical applications requiring ECC, an ECC variant should be used.
- Performance limited by system memory controller capabilities and BIOS support.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3L standard JESD79-3L
- RoHS Compliance: Manufactured in accordance with Restriction of Hazardous Substances (RoHS) directives, ensuring environmentally safe materials
- REACH Compliance: Conforms to EU REACH regulations for chemical safety
- CE Marking: Meets applicable European safety and electromagnetic compatibility requirements
- UL Certification: Components and PCB materials typically UL-recognized for safety and flammability standards
- Environmental Standards: Designed for extended temperature operation (–20°C to +70°C) per industrial-grade specifications
- ESD Protection: Built-in ESD safeguards during manufacturing and packaging to prevent electrostatic damage
9. Additional Information
Warranty:
- Standard limited warranty (typically 3 to 5 years, depending on manufacturer policy) covering defects in materials and workmanship under normal operating conditions.
Support:
- Technical support available through manufacturer or authorized distributor channels.
- Documentation includes datasheets, installation guides, and compatibility lists.
Maintenance:
- No active maintenance required; ensure proper environmental conditions and system ventilation.
- Periodic system diagnostics recommended to verify memory integrity.
Firmware / SPD Updates:
- SPD (Serial Presence Detect) data pre-programmed for automatic configuration.
- Some manufacturers may offer SPD customization for specific timing or identification requirements.
Lifecycle and Availability:
- Designed for long-term availability to support industrial and embedded product lifecycles.
- Stable component sourcing ensures consistent performance and compatibility across production batches.
Environmental and Operational Notes:
- Suitable for deployment in systems exposed to moderate vibration, dust, and temperature variation.
- Not intended for extreme military or aerospace environments beyond specified temperature limits unless otherwise qualified.
Summary
The 4GB-DDR3L-ET is a high-reliability, low-voltage DDR3L SO-DIMM memory module engineered for industrial and embedded applications requiring dependable performance across a –20°C to +70°C temperature range. With 4 GB capacity, 1.35 V operation, and JEDEC-compliant design, it delivers efficient, stable, and thermally robust memory performance in compact computing systems. Its extended temperature tolerance, low power consumption, and standard 204-pin SO-DIMM interface make it an ideal choice for industrial PCs, embedded controllers, and ruggedized computing platforms where reliability and energy efficiency are paramount.
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