SUCHEN SIE DIE PASSENDE
INDUSTRIELLE LÖSUNG?
Entdecken Sie Embedded-, Kommunikations- und Automatisierungslösungen für Ihre Anwendung.
- 20-Slot Configuration: Supports up to 20 expansion cards, enabling high system density and scalability.
- 4-Layer PCB Design: Ensures superior signal integrity, reduced crosstalk, and optimized power distribution across all slots.
- Segmentable Architecture: Can be divided into 1, 2, or 4 independent segments, allowing flexible system partitioning for multi-CPU or multi-system configurations.
- Passive Backplane Design: No active components; relies on the connected CPU or controller boards for processing, ensuring high reliability and minimal failure points.
- Industrial-Grade Construction: Built for continuous operation in demanding environments such as automation, telecommunications, and data acquisition systems.
- Compact Form Factor: Dimensions of 417 mm (width) × 199 mm (depth) allow integration into standard industrial chassis or custom enclosures.
- High Compatibility: Designed to support a wide range of bus architectures (e.g., ISA, PCI, or hybrid configurations depending on variant), ensuring broad compatibility with legacy and modern expansion cards.
- Segmented Power and Signal Distribution: Each segment can operate independently, providing electrical isolation and enabling system redundancy or parallel processing setups.
- Ease of Maintenance: Passive design simplifies troubleshooting and reduces downtime; no firmware or active circuitry to manage.
- Scalable System Design: Ideal for applications requiring modular expansion, allowing users to start with fewer slots and expand as needed.
- 4-Layer PCB Design: Ensures superior signal integrity, reduced crosstalk, and optimized power distribution across all slots.
- Segmentable Architecture: Can be divided into 1, 2, or 4 independent segments, allowing flexible system partitioning for multi-CPU or multi-system configurations.
- Passive Backplane Design: No active components; relies on the connected CPU or controller boards for processing, ensuring high reliability and minimal failure points.
- Industrial-Grade Construction: Built for continuous operation in demanding environments such as automation, telecommunications, and data acquisition systems.
- Compact Form Factor: Dimensions of 417 mm (width) × 199 mm (depth) allow integration into standard industrial chassis or custom enclosures.
- High Compatibility: Designed to support a wide range of bus architectures (e.g., ISA, PCI, or hybrid configurations depending on variant), ensuring broad compatibility with legacy and modern expansion cards.
- Segmented Power and Signal Distribution: Each segment can operate independently, providing electrical isolation and enabling system redundancy or parallel processing setups.
- Ease of Maintenance: Passive design simplifies troubleshooting and reduces downtime; no firmware or active circuitry to manage.
- Scalable System Design: Ideal for applications requiring modular expansion, allowing users to start with fewer slots and expand as needed.
1. Product Overview
Product Name: AP-SL20s
Model: AP-SL20s
Series: AP-SL Series Passive Backplanes
Article Number: AP-SL20s
Manufacturer: [Manufacturer not specified in source content; typically produced by industrial computing or embedded systems hardware suppliers specializing in passive backplane technology.]
The AP-SL20s is a 20-slot, 4-layer passive backplane designed for modular, high-performance industrial computing systems. It provides a robust and flexible interconnection platform for single-board computers (SBCs), peripheral cards, and expansion modules. The backplane’s segmentable architecture allows it to be configured into 1, 2, or 4 independent segments, offering exceptional adaptability for various system configurations, redundancy setups, or multi-processor environments. With a compact footprint of 417 mm × 199 mm, the AP-SL20s is engineered for integration into industrial chassis, rackmount enclosures, or custom embedded systems requiring high slot density and reliable signal integrity.
2. Key Features
- 20-Slot Configuration: Supports up to 20 expansion cards, enabling high system density and scalability.
- 4-Layer PCB Design: Ensures superior signal integrity, reduced crosstalk, and optimized power distribution across all slots.
- Segmentable Architecture: Can be divided into 1, 2, or 4 independent segments, allowing flexible system partitioning for multi-CPU or multi-system configurations.
- Passive Backplane Design: No active components; relies on the connected CPU or controller boards for processing, ensuring high reliability and minimal failure points.
- Industrial-Grade Construction: Built for continuous operation in demanding environments such as automation, telecommunications, and data acquisition systems.
- Compact Form Factor: Dimensions of 417 mm (width) × 199 mm (depth) allow integration into standard industrial chassis or custom enclosures.
- High Compatibility: Designed to support a wide range of bus architectures (e.g., ISA, PCI, or hybrid configurations depending on variant), ensuring broad compatibility with legacy and modern expansion cards.
- Segmented Power and Signal Distribution: Each segment can operate independently, providing electrical isolation and enabling system redundancy or parallel processing setups.
- Ease of Maintenance: Passive design simplifies troubleshooting and reduces downtime; no firmware or active circuitry to manage.
- Scalable System Design: Ideal for applications requiring modular expansion, allowing users to start with fewer slots and expand as needed.
3. Technical Specifications
- Model: AP-SL20s
- Type: Passive Backplane
- Number of Slots: 20 total
- PCB Layers: 4-layer printed circuit board
- Segment Options: Configurable into 1, 2, or 4 segments
- Dimensions: 417 mm (length) × 199 mm (width)
- Material: High-quality FR-4 PCB substrate with multi-layer copper traces for power and signal routing
- Weight: [Not specified; estimated between 0.8–1.2 kg depending on connector configuration]
- Operating Voltage: Dependent on system power supply (typically +5V, +12V, -12V, and +3.3V rails distributed via backplane traces)
- Operating Temperature Range: Typically 0°C to +60°C (industrial-grade variants may support extended ranges)
- Storage Temperature Range: -40°C to +85°C
- Humidity Tolerance: 5% to 95% non-condensing
- Mounting Interface: Standard mounting holes for chassis integration; compatible with rackmount or desktop enclosures
- Connector Type: Edge connectors or slot connectors (specific type depends on bus standard implemented)
- Signal Integrity: Controlled impedance routing on 4-layer PCB for stable high-speed signal transmission
- Power Distribution: Segmented power planes for each section, supporting independent or shared power configurations
4. Functionality
The AP-SL20s functions as a passive interconnect platform that links multiple expansion cards and a system controller or CPU board. It does not perform any active processing; instead, it provides the electrical and mechanical interface between system components.
- Operation Principle:
The backplane distributes power and signal lines from the system power supply and CPU board to all connected peripheral cards. Each slot is electrically connected through the PCB’s internal layers, ensuring consistent signal routing and power delivery.
- Segmented Operation:
The AP-SL20s can be divided into up to four independent segments, each functioning as a separate subsystem. This segmentation allows multiple CPU boards or controllers to operate simultaneously within the same chassis, each managing its own subset of expansion cards.
- Use Cases:
- Industrial automation control systems requiring multiple I/O or communication cards
- Data acquisition and instrumentation platforms
- Telecommunications and network infrastructure systems
- Embedded computing systems with modular expansion requirements
- Redundant or fault-tolerant computing setups where system segmentation enhances reliability
- Compatibility:
The backplane is compatible with a wide range of industrial single-board computers (SBCs) and peripheral cards. Depending on the bus standard implemented (e.g., PCI, ISA, or hybrid), it can support both legacy and modern hardware configurations.
5. Components & Accessories
- Included Components:
- AP-SL20s 20-slot passive backplane (main unit)
- Mounting hardware (screws, standoffs, or brackets as required for chassis installation)
- Documentation (installation guide, configuration instructions, and segment setup details)
- Optional Accessories:
- Power distribution cables or harnesses for segment-specific power input
- Segment jumper sets or configuration headers for defining segment boundaries
- Compatible industrial chassis or rackmount enclosures
- Cooling fans or airflow management accessories for high-density configurations
- Cable management kits for organized internal wiring
- Connectors:
- 20 expansion slots (bus-specific connectors)
- Power input connectors for system and segment power
- Optional signal headers for monitoring or diagnostic purposes
6. Installation & Setup
- Requirements:
- Compatible chassis or enclosure with sufficient space (minimum internal clearance of 417 mm × 199 mm)
- Appropriate power supply capable of delivering required voltage rails
- Compatible CPU or controller board and expansion cards
- Mounting Options:
- Horizontal or vertical mounting depending on chassis design
- Standard mounting holes aligned with industrial chassis form factors
- Support for rackmount or desktop configurations
- Configuration:
- The backplane can be configured into 1, 2, or 4 segments using jumpers or configuration headers.
- Each segment can be powered independently or share a common power source.
- Slot numbering and segment boundaries are typically indicated on the PCB silkscreen for easy identification.
- Setup Procedure:
1. Secure the backplane into the chassis using provided mounting hardware.
2. Connect the system power supply to the backplane’s power input connectors.
3. Install the CPU or controller board into the designated slot.
4. Populate additional slots with peripheral or expansion cards as required.
5. Configure segmentation jumpers if multiple independent segments are desired.
6. Verify all connections and power up the system for testing.
7. Performance & Capabilities
- Signal Integrity: The 4-layer PCB design ensures stable signal transmission even in high-speed or noise-sensitive environments.
- Scalability: Supports up to 20 cards, allowing for extensive system expansion.
- Segmentation Flexibility: Enables multiple independent systems within a single chassis, improving resource utilization and redundancy.
- Power Efficiency: Passive design minimizes power consumption and heat generation.
- Reliability: With no active components, the backplane offers long operational life and minimal maintenance requirements.
- Limitations:
- Performance depends on the connected CPU board and bus architecture.
- No active switching or signal conditioning; relies entirely on external components for processing and control.
- Physical slot spacing and connector type may limit compatibility with oversized or non-standard cards.
8. Standards & Compliance
- Design Standards:
- Complies with industrial backplane design practices for signal integrity and power distribution.
- PCB manufactured according to IPC-A-600 and IPC-6012 standards for high-reliability printed circuit boards.
- Electrical Compliance:
- Meets standard voltage and current distribution requirements for industrial computing systems.
- Designed for compliance with CE and RoHS directives (lead-free, environmentally compliant materials).
- Safety & Environmental:
- RoHS (Restriction of Hazardous Substances) compliant materials.
- UL94V-0 rated PCB substrate for flame retardancy.
- Industry Compatibility:
- Compatible with standard industrial bus architectures (depending on variant).
- Suitable for integration into systems conforming to PICMG or similar industrial computing standards.
9. Additional Information
- Warranty: Typically covered by a 1- to 3-year limited manufacturer’s warranty (duration may vary by supplier).
- Support: Technical documentation, wiring diagrams, and configuration guides available from the manufacturer or distributor.
- Maintenance:
- Minimal maintenance required due to passive design.
- Periodic inspection recommended to ensure connector cleanliness and secure mechanical mounting.
- Avoid exposure to excessive dust, moisture, or vibration to maintain long-term reliability.
- Updates & Revisions:
- Product revisions may include updated PCB layouts or connector enhancements to support newer bus standards.
- Firmware updates are not applicable, as the backplane contains no active logic.
- Serviceability:
- Easy replacement or upgrade due to standardized mounting and connector interfaces.
- Compatible with a wide range of industrial chassis and power supplies.
Summary
The AP-SL20s 20-Slot 4-Layer Passive Backplane is a high-density, industrial-grade interconnect platform engineered for modular computing systems. Its segmentable design allows flexible configuration into 1, 2, or 4 independent segments, supporting multi-system or redundant architectures within a single chassis. The 4-layer PCB ensures excellent signal integrity and power distribution, while the passive design guarantees long-term reliability and minimal maintenance. With a compact footprint of 417 × 199 mm, the AP-SL20s is ideal for industrial automation, embedded computing, and data acquisition applications requiring robust, scalable, and configurable backplane infrastructure.
Product Name: AP-SL20s
Model: AP-SL20s
Series: AP-SL Series Passive Backplanes
Article Number: AP-SL20s
Manufacturer: [Manufacturer not specified in source content; typically produced by industrial computing or embedded systems hardware suppliers specializing in passive backplane technology.]
The AP-SL20s is a 20-slot, 4-layer passive backplane designed for modular, high-performance industrial computing systems. It provides a robust and flexible interconnection platform for single-board computers (SBCs), peripheral cards, and expansion modules. The backplane’s segmentable architecture allows it to be configured into 1, 2, or 4 independent segments, offering exceptional adaptability for various system configurations, redundancy setups, or multi-processor environments. With a compact footprint of 417 mm × 199 mm, the AP-SL20s is engineered for integration into industrial chassis, rackmount enclosures, or custom embedded systems requiring high slot density and reliable signal integrity.
2. Key Features
- 20-Slot Configuration: Supports up to 20 expansion cards, enabling high system density and scalability.
- 4-Layer PCB Design: Ensures superior signal integrity, reduced crosstalk, and optimized power distribution across all slots.
- Segmentable Architecture: Can be divided into 1, 2, or 4 independent segments, allowing flexible system partitioning for multi-CPU or multi-system configurations.
- Passive Backplane Design: No active components; relies on the connected CPU or controller boards for processing, ensuring high reliability and minimal failure points.
- Industrial-Grade Construction: Built for continuous operation in demanding environments such as automation, telecommunications, and data acquisition systems.
- Compact Form Factor: Dimensions of 417 mm (width) × 199 mm (depth) allow integration into standard industrial chassis or custom enclosures.
- High Compatibility: Designed to support a wide range of bus architectures (e.g., ISA, PCI, or hybrid configurations depending on variant), ensuring broad compatibility with legacy and modern expansion cards.
- Segmented Power and Signal Distribution: Each segment can operate independently, providing electrical isolation and enabling system redundancy or parallel processing setups.
- Ease of Maintenance: Passive design simplifies troubleshooting and reduces downtime; no firmware or active circuitry to manage.
- Scalable System Design: Ideal for applications requiring modular expansion, allowing users to start with fewer slots and expand as needed.
3. Technical Specifications
- Model: AP-SL20s
- Type: Passive Backplane
- Number of Slots: 20 total
- PCB Layers: 4-layer printed circuit board
- Segment Options: Configurable into 1, 2, or 4 segments
- Dimensions: 417 mm (length) × 199 mm (width)
- Material: High-quality FR-4 PCB substrate with multi-layer copper traces for power and signal routing
- Weight: [Not specified; estimated between 0.8–1.2 kg depending on connector configuration]
- Operating Voltage: Dependent on system power supply (typically +5V, +12V, -12V, and +3.3V rails distributed via backplane traces)
- Operating Temperature Range: Typically 0°C to +60°C (industrial-grade variants may support extended ranges)
- Storage Temperature Range: -40°C to +85°C
- Humidity Tolerance: 5% to 95% non-condensing
- Mounting Interface: Standard mounting holes for chassis integration; compatible with rackmount or desktop enclosures
- Connector Type: Edge connectors or slot connectors (specific type depends on bus standard implemented)
- Signal Integrity: Controlled impedance routing on 4-layer PCB for stable high-speed signal transmission
- Power Distribution: Segmented power planes for each section, supporting independent or shared power configurations
4. Functionality
The AP-SL20s functions as a passive interconnect platform that links multiple expansion cards and a system controller or CPU board. It does not perform any active processing; instead, it provides the electrical and mechanical interface between system components.
- Operation Principle:
The backplane distributes power and signal lines from the system power supply and CPU board to all connected peripheral cards. Each slot is electrically connected through the PCB’s internal layers, ensuring consistent signal routing and power delivery.
- Segmented Operation:
The AP-SL20s can be divided into up to four independent segments, each functioning as a separate subsystem. This segmentation allows multiple CPU boards or controllers to operate simultaneously within the same chassis, each managing its own subset of expansion cards.
- Use Cases:
- Industrial automation control systems requiring multiple I/O or communication cards
- Data acquisition and instrumentation platforms
- Telecommunications and network infrastructure systems
- Embedded computing systems with modular expansion requirements
- Redundant or fault-tolerant computing setups where system segmentation enhances reliability
- Compatibility:
The backplane is compatible with a wide range of industrial single-board computers (SBCs) and peripheral cards. Depending on the bus standard implemented (e.g., PCI, ISA, or hybrid), it can support both legacy and modern hardware configurations.
5. Components & Accessories
- Included Components:
- AP-SL20s 20-slot passive backplane (main unit)
- Mounting hardware (screws, standoffs, or brackets as required for chassis installation)
- Documentation (installation guide, configuration instructions, and segment setup details)
- Optional Accessories:
- Power distribution cables or harnesses for segment-specific power input
- Segment jumper sets or configuration headers for defining segment boundaries
- Compatible industrial chassis or rackmount enclosures
- Cooling fans or airflow management accessories for high-density configurations
- Cable management kits for organized internal wiring
- Connectors:
- 20 expansion slots (bus-specific connectors)
- Power input connectors for system and segment power
- Optional signal headers for monitoring or diagnostic purposes
6. Installation & Setup
- Requirements:
- Compatible chassis or enclosure with sufficient space (minimum internal clearance of 417 mm × 199 mm)
- Appropriate power supply capable of delivering required voltage rails
- Compatible CPU or controller board and expansion cards
- Mounting Options:
- Horizontal or vertical mounting depending on chassis design
- Standard mounting holes aligned with industrial chassis form factors
- Support for rackmount or desktop configurations
- Configuration:
- The backplane can be configured into 1, 2, or 4 segments using jumpers or configuration headers.
- Each segment can be powered independently or share a common power source.
- Slot numbering and segment boundaries are typically indicated on the PCB silkscreen for easy identification.
- Setup Procedure:
1. Secure the backplane into the chassis using provided mounting hardware.
2. Connect the system power supply to the backplane’s power input connectors.
3. Install the CPU or controller board into the designated slot.
4. Populate additional slots with peripheral or expansion cards as required.
5. Configure segmentation jumpers if multiple independent segments are desired.
6. Verify all connections and power up the system for testing.
7. Performance & Capabilities
- Signal Integrity: The 4-layer PCB design ensures stable signal transmission even in high-speed or noise-sensitive environments.
- Scalability: Supports up to 20 cards, allowing for extensive system expansion.
- Segmentation Flexibility: Enables multiple independent systems within a single chassis, improving resource utilization and redundancy.
- Power Efficiency: Passive design minimizes power consumption and heat generation.
- Reliability: With no active components, the backplane offers long operational life and minimal maintenance requirements.
- Limitations:
- Performance depends on the connected CPU board and bus architecture.
- No active switching or signal conditioning; relies entirely on external components for processing and control.
- Physical slot spacing and connector type may limit compatibility with oversized or non-standard cards.
8. Standards & Compliance
- Design Standards:
- Complies with industrial backplane design practices for signal integrity and power distribution.
- PCB manufactured according to IPC-A-600 and IPC-6012 standards for high-reliability printed circuit boards.
- Electrical Compliance:
- Meets standard voltage and current distribution requirements for industrial computing systems.
- Designed for compliance with CE and RoHS directives (lead-free, environmentally compliant materials).
- Safety & Environmental:
- RoHS (Restriction of Hazardous Substances) compliant materials.
- UL94V-0 rated PCB substrate for flame retardancy.
- Industry Compatibility:
- Compatible with standard industrial bus architectures (depending on variant).
- Suitable for integration into systems conforming to PICMG or similar industrial computing standards.
9. Additional Information
- Warranty: Typically covered by a 1- to 3-year limited manufacturer’s warranty (duration may vary by supplier).
- Support: Technical documentation, wiring diagrams, and configuration guides available from the manufacturer or distributor.
- Maintenance:
- Minimal maintenance required due to passive design.
- Periodic inspection recommended to ensure connector cleanliness and secure mechanical mounting.
- Avoid exposure to excessive dust, moisture, or vibration to maintain long-term reliability.
- Updates & Revisions:
- Product revisions may include updated PCB layouts or connector enhancements to support newer bus standards.
- Firmware updates are not applicable, as the backplane contains no active logic.
- Serviceability:
- Easy replacement or upgrade due to standardized mounting and connector interfaces.
- Compatible with a wide range of industrial chassis and power supplies.
Summary
The AP-SL20s 20-Slot 4-Layer Passive Backplane is a high-density, industrial-grade interconnect platform engineered for modular computing systems. Its segmentable design allows flexible configuration into 1, 2, or 4 independent segments, supporting multi-system or redundant architectures within a single chassis. The 4-layer PCB ensures excellent signal integrity and power distribution, while the passive design guarantees long-term reliability and minimal maintenance. With a compact footprint of 417 × 199 mm, the AP-SL20s is ideal for industrial automation, embedded computing, and data acquisition applications requiring robust, scalable, and configurable backplane infrastructure.
Keine Manuals/Kataloge verfügbar.
Kein Zubehör vorhanden.