cPCI-3700A
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- CompactPCI Standard Compliance: Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications for 3U boards.
- 19‑inch Rack‑Mount Design: Standard 19″ width, 4U height enclosure suitable for rack or desktop use.
- 13‑Slot Backplane: Integrated cBP‑3213P 32‑bit backplane with bridge card and rear I/O option.
- Rear I/O Capability: Supports rear transition modules for enhanced connectivity and system flexibility.
- High‑Density Integration: Accommodates up to 13 CompactPCI slots, including system and peripheral slots.
- Cooling System: Bottom‑mounted, removable DC brushless fans with air filters; fan controller with failure detection.
- EMC Shielding: Comprehensive electromagnetic compatibility protection with gaskets on front, rear, and side panels.
- Flexible Power Options: Compatible with ADLINK’s cPS‑150R, cPS‑175 series, or standard ATX/PS2 power supplies (power unit not included).
- Bridge Card Support: Enables system expansion or segmentation across multiple CompactPCI buses.
- Mechanical Robustness: Industrial‑grade aluminum construction with removable panels and handles for portability.
- Modular Architecture: Compatible with ADLINK’s cPCI‑PSF power supply frame, cPCI‑DBF drive bay frame, and cPCI‑SP3E slot panels.
- 19‑inch Rack‑Mount Design: Standard 19″ width, 4U height enclosure suitable for rack or desktop use.
- 13‑Slot Backplane: Integrated cBP‑3213P 32‑bit backplane with bridge card and rear I/O option.
- Rear I/O Capability: Supports rear transition modules for enhanced connectivity and system flexibility.
- High‑Density Integration: Accommodates up to 13 CompactPCI slots, including system and peripheral slots.
- Cooling System: Bottom‑mounted, removable DC brushless fans with air filters; fan controller with failure detection.
- EMC Shielding: Comprehensive electromagnetic compatibility protection with gaskets on front, rear, and side panels.
- Flexible Power Options: Compatible with ADLINK’s cPS‑150R, cPS‑175 series, or standard ATX/PS2 power supplies (power unit not included).
- Bridge Card Support: Enables system expansion or segmentation across multiple CompactPCI buses.
- Mechanical Robustness: Industrial‑grade aluminum construction with removable panels and handles for portability.
- Modular Architecture: Compatible with ADLINK’s cPCI‑PSF power supply frame, cPCI‑DBF drive bay frame, and cPCI‑SP3E slot panels.
Comprehensive Product Summary: ADLINK cPCIS‑2103R CompactPCI Rackmount Chassis
### 1. Product Overview
Product Name: cPCIS‑2103R
Model: cPCIS‑2103R
Series: cPCIS‑2000 Series (3U CompactPCI Sub‑systems)
Article Number: cPCIS‑2103R
Manufacturer: ADLINK Technology Inc.
Trademark: NuIPC® (registered trademark of ADLINK Technology Inc.)
Product Type: 19‑inch rack‑mount CompactPCI chassis, 4U height, 13‑slot backplane with rear I/O capability
Intended Use: Modular industrial computer enclosure for 3U CompactPCI boards and sub‑systems
The ADLINK cPCIS‑2103R is a high‑performance, 19‑inch rack‑mount CompactPCI chassis designed for 3U form‑factor boards. It integrates a 13‑slot, 32‑bit CompactPCI backplane (model cBP‑3213P) with rear I/O support and bridge card connectivity. The chassis is part of ADLINK’s cPCIS‑2000 family of modular CompactPCI platforms, engineered for industrial, telecommunications, and embedded computing applications requiring high reliability, modularity, and compliance with PICMG standards.
### 2. Key Features
- CompactPCI Standard Compliance: Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications for 3U boards.
- 19‑inch Rack‑Mount Design: Standard 19″ width, 4U height enclosure suitable for rack or desktop use.
- 13‑Slot Backplane: Integrated cBP‑3213P 32‑bit backplane with bridge card and rear I/O option.
- Rear I/O Capability: Supports rear transition modules for enhanced connectivity and system flexibility.
- High‑Density Integration: Accommodates up to 13 CompactPCI slots, including system and peripheral slots.
- Cooling System: Bottom‑mounted, removable DC brushless fans with air filters; fan controller with failure detection.
- EMC Shielding: Comprehensive electromagnetic compatibility protection with gaskets on front, rear, and side panels.
- Flexible Power Options: Compatible with ADLINK’s cPS‑150R, cPS‑175 series, or standard ATX/PS2 power supplies (power unit not included).
- Bridge Card Support: Enables system expansion or segmentation across multiple CompactPCI buses.
- Mechanical Robustness: Industrial‑grade aluminum construction with removable panels and handles for portability.
- Modular Architecture: Compatible with ADLINK’s cPCI‑PSF power supply frame, cPCI‑DBF drive bay frame, and cPCI‑SP3E slot panels.
### 3. Technical Specifications
Form Factor: 19″ rack‑mount, 4U height enclosure for 3U CompactPCI boards
Dimensions:
- Width: 444.2 mm (482.6 mm with rack‑mount kit)
- Height: 177 mm (4U standard; 189.1 mm with foot stands)
- Depth: 257.9 mm
Usable Width: 21 slots (84 HP total)
Backplane: cBP‑3213P, 32‑bit CompactPCI, 13 slots, rear I/O capable, bridge card included
Material: Aluminum alloy chassis with steel reinforcement and EMC gaskets
Cooling System:
- Fan Type: DC brushless motor
- Quantity: 2 or 4 fans (depending on configuration)
- Rated Voltage: 12 V DC @ 0.43 A per fan
- Power Consumption: 5.16 W (rated), 7.7 W (max)
- Airflow: 60 CFM per fan (zero static pressure)
- Operating Temperature: −10 °C ~ +70 °C
- Fan Controller: Current‑controlled, failure detection ready
Power Requirements (for fan controller):
- +5 V @ 40 mA max
- −12 V @ 200 mA plus fan load
Connectors (Fan Controller):
- CN101: Power input (−12 V, GND, +5 V)
- CN102: Fan power outputs (up to 4 fans)
- CN103: Fan failure outputs (+5 V and 4 failure signals)
Weight: Approx. 8–10 kg (without PSU)
Color/Finish: Industrial gray anodized aluminum
### 4. Functionality
The cPCIS‑2103R serves as a modular enclosure for CompactPCI systems, providing mechanical housing, backplane interconnection, and cooling for 3U CompactPCI boards. It supports one system slot and up to twelve peripheral slots, enabling flexible system configurations for control, data acquisition, or communication applications.
Typical Use Cases:
- Industrial automation controllers
- Telecommunications and networking nodes
- Embedded computing platforms
- Data acquisition and signal processing systems
- Laboratory instrumentation and test equipment
Compatibility:
- Supports 3U CompactPCI CPU and I/O boards compliant with PICMG 2.0 R2.1
- Rear I/O compatible with transition modules via cBP‑3213P backplane
- Compatible with ADLINK power modules (cPS‑150R, cPS‑175 series) and ATX PSUs via cPCI‑PSF frame
- Integrates with optional LCD kits (cPCI‑LCD) and drive bay frames (cPCI‑DBF)
### 5. Components & Accessories
Included Components:
- cPCIS‑2103R 19″ rack chassis (4U height)
- cBP‑3213P 13‑slot 32‑bit CompactPCI backplane with bridge card
- Rear I/O connectors and guides
- Fan controller board with pre‑installed fans and air filters
- EMC gaskets and mounting hardware
Optional Accessories:
- Power Supply Units:
- cPS‑150R (175 W, 31‑pin redundant PSU)
- cPS‑175/AC, /48, /24 (175 W, 47‑pin PSU, AC or DC input)
- APS‑925A (280 W ATX PSU)
- Power Supply Frame: cPCI‑PSF (for PS2‑size PSU)
- Drive Bay Frame: cPCI‑DBF (supports 2 × 5¼″ + 1 × 3½″ drives)
- Slot Panels: cPCI‑SP3E (3U, 4 HP, with EMC gasket)
- LCD Kit: cPCI‑LCD (6.4″ TFT, 640 × 480, 300 cd/m², optional touchscreen)
- LCD Controller Cards: cPCI‑8215 (C&T 69000, 2 MB RAM) or cPCI‑8217 (SMI chipset, 4 MB RAM)
Connectors & Interfaces:
- Standard CompactPCI P1/P2 connectors per PICMG 2.0 R2.1
- Rear I/O connectors for transition modules
- Power input connectors (ATX, PS2, or CompactPCI PSU interface)
### 6. Installation & Setup
Mounting Options:
- 19″ rack‑mount with included brackets (482.6 mm width)
- Desktop configuration with adjustable foot stands
- Side handles for portable instrumentation
Installation Requirements:
- Standard 19″ rack space (4U height)
- Compatible CompactPCI CPU and I/O boards
- External or internal power supply (not included)
- Adequate airflow clearance below chassis for fan intake
Setup Procedure:
1. Mount chassis in rack or place on desktop with foot stands.
2. Install CompactPCI CPU and peripheral boards into backplane slots.
3. Connect power supply via cPCI‑PSF frame or redundant PSU backplane.
4. Connect rear I/O transition modules if required.
5. Verify fan operation and airflow direction.
6. Power on system and confirm backplane and PSU indicators.
Configuration Options:
- Select backplane voltage (V I/O = +5 V or +3.3 V) via jumper on backplane.
- Configure fan controller connections (CN101–CN103).
- Optional integration of LCD module and controller card.
### 7. Performance & Capabilities
System Capacity:
- 13 CompactPCI slots (1 system + 12 I/O)
- 32‑bit PCI bus operation at 33 MHz
- Rear I/O support for all peripheral slots
Cooling Performance:
- Up to 240 CFM total airflow (4 × 60 CFM fans)
- Operating temperature range: −10 °C ~ +70 °C
- Fan failure detection and current‑controlled operation
Power Handling:
- Supports up to 280 W ATX or 175 W × 2 redundant PSU configurations
- +5 V, +3.3 V, +12 V, −12 V rails per CompactPCI standard
- Hot‑swappable PSU support (with cPS‑150R or cPS‑175 series)
Efficiency & Reliability:
- Power supply efficiency up to 73 % (typical for cPS‑175 series)
- MTBF > 50,000 hours (PSU)
- EMC shielding ensures stable operation in industrial environments
Limitations:
- Power unit not included (must be ordered separately)
- Requires external cooling clearance below chassis
- Rear I/O limited to backplane configuration (cBP‑3213P)
### 8. Standards & Compliance
Industry Standards:
- PICMG 2.0 R2.1 CompactPCI specification
- PICMG 2.11 CompactPCI Power Interface specification
- IEC 603‑2 / DIN 41612 connector standards
- ATX power interface compatibility
Electrical & Safety Compliance (PSU dependent):
- UL 1950, CSA C22.2 No. 950, EN 60950 (TÜV certified)
- CE Marking (EMI/EMS compliance)
- FCC Part 15 Class A / EN 55022 Class A emissions
- EN 50082‑2 immunity (EN 61000‑4‑2/3/4/6/8, ENV 50204)
Environmental Ratings:
- Operating Temperature: 0 °C ~ 70 °C (full power to 40 °C with forced air)
- Storage Temperature: −40 °C ~ +85 °C
- Relative Humidity: < 95 % @ 40 °C, non‑condensing
- Operating Altitude: up to 6,400 m
Mechanical & EMC:
- EMC gaskets on all panels
- Vibration: 5 Hz–55 Hz, 0.38 mm displacement, 2 cycles/axis
- Shock: per MIL‑HDBK‑217E guidelines
### 9. Additional Information
Warranty:
One‑year limited warranty from date of purchase against defects in materials and workmanship. Warranty excludes damage from misuse, modification, or operation beyond specifications.
Support & Service:
ADLINK Technology Inc. provides global technical support and service.
- Website: [www.adlinktech.com](http://www.adlinktech.com)
- Email Contacts:
- General Service: service@adlink.com.tw
- NuIPC Support: nuipc@adlink.com.tw
- NuDAQ: nudaq@adlink.com.tw
- NuDAM: nudam@adlink.com.tw
- NuPRO: nupro@adlink.com.tw
- Software: sw@adlink.com.tw
- Telephone: +886‑2‑8226‑5877
- Fax: +886‑2‑8226‑5717
- Address: 9F, No. 166, Jian Yi Road, Chungho City, Taipei 235, Taiwan, R.O.C.
Maintenance:
- Periodically clean air filters and verify fan operation.
- Inspect EMC gaskets and replace if worn.
- Ensure backplane connectors remain free of dust and debris.
- Replace fans or PSUs with ADLINK‑approved components only.
Upgrades & Expansion:
- Supports integration of additional CompactPCI boards, redundant PSUs, or LCD modules.
- Backplane bridge card allows system expansion to secondary CompactPCI segments.
- Optional rear I/O transition modules extend connectivity for field applications.
Documentation & Revision:
- User Manual: cPCIS‑1000/2000 Series User’s Guide, Rev. 1.02 (Aug 30 2000)
- Information subject to change without notice for design improvements.
### Summary
The ADLINK cPCIS‑2103R is a robust, modular CompactPCI chassis engineered for demanding industrial and embedded applications. Its 13‑slot, 32‑bit backplane with rear I/O support provides exceptional flexibility for system integrators. The chassis’ 4U rack‑mount form factor, comprehensive EMC shielding, and efficient cooling system make it ideal for high‑reliability environments. With compatibility across ADLINK’s ecosystem of power supplies, backplanes, and LCD modules, the cPCIS‑2103R delivers a scalable foundation for CompactPCI‑based computing platforms requiring performance, modularity, and long‑term serviceability.
### 1. Product Overview
Product Name: cPCIS‑2103R
Model: cPCIS‑2103R
Series: cPCIS‑2000 Series (3U CompactPCI Sub‑systems)
Article Number: cPCIS‑2103R
Manufacturer: ADLINK Technology Inc.
Trademark: NuIPC® (registered trademark of ADLINK Technology Inc.)
Product Type: 19‑inch rack‑mount CompactPCI chassis, 4U height, 13‑slot backplane with rear I/O capability
Intended Use: Modular industrial computer enclosure for 3U CompactPCI boards and sub‑systems
The ADLINK cPCIS‑2103R is a high‑performance, 19‑inch rack‑mount CompactPCI chassis designed for 3U form‑factor boards. It integrates a 13‑slot, 32‑bit CompactPCI backplane (model cBP‑3213P) with rear I/O support and bridge card connectivity. The chassis is part of ADLINK’s cPCIS‑2000 family of modular CompactPCI platforms, engineered for industrial, telecommunications, and embedded computing applications requiring high reliability, modularity, and compliance with PICMG standards.
### 2. Key Features
- CompactPCI Standard Compliance: Fully compliant with PICMG 2.0 R2.1 CompactPCI specifications for 3U boards.
- 19‑inch Rack‑Mount Design: Standard 19″ width, 4U height enclosure suitable for rack or desktop use.
- 13‑Slot Backplane: Integrated cBP‑3213P 32‑bit backplane with bridge card and rear I/O option.
- Rear I/O Capability: Supports rear transition modules for enhanced connectivity and system flexibility.
- High‑Density Integration: Accommodates up to 13 CompactPCI slots, including system and peripheral slots.
- Cooling System: Bottom‑mounted, removable DC brushless fans with air filters; fan controller with failure detection.
- EMC Shielding: Comprehensive electromagnetic compatibility protection with gaskets on front, rear, and side panels.
- Flexible Power Options: Compatible with ADLINK’s cPS‑150R, cPS‑175 series, or standard ATX/PS2 power supplies (power unit not included).
- Bridge Card Support: Enables system expansion or segmentation across multiple CompactPCI buses.
- Mechanical Robustness: Industrial‑grade aluminum construction with removable panels and handles for portability.
- Modular Architecture: Compatible with ADLINK’s cPCI‑PSF power supply frame, cPCI‑DBF drive bay frame, and cPCI‑SP3E slot panels.
### 3. Technical Specifications
Form Factor: 19″ rack‑mount, 4U height enclosure for 3U CompactPCI boards
Dimensions:
- Width: 444.2 mm (482.6 mm with rack‑mount kit)
- Height: 177 mm (4U standard; 189.1 mm with foot stands)
- Depth: 257.9 mm
Usable Width: 21 slots (84 HP total)
Backplane: cBP‑3213P, 32‑bit CompactPCI, 13 slots, rear I/O capable, bridge card included
Material: Aluminum alloy chassis with steel reinforcement and EMC gaskets
Cooling System:
- Fan Type: DC brushless motor
- Quantity: 2 or 4 fans (depending on configuration)
- Rated Voltage: 12 V DC @ 0.43 A per fan
- Power Consumption: 5.16 W (rated), 7.7 W (max)
- Airflow: 60 CFM per fan (zero static pressure)
- Operating Temperature: −10 °C ~ +70 °C
- Fan Controller: Current‑controlled, failure detection ready
Power Requirements (for fan controller):
- +5 V @ 40 mA max
- −12 V @ 200 mA plus fan load
Connectors (Fan Controller):
- CN101: Power input (−12 V, GND, +5 V)
- CN102: Fan power outputs (up to 4 fans)
- CN103: Fan failure outputs (+5 V and 4 failure signals)
Weight: Approx. 8–10 kg (without PSU)
Color/Finish: Industrial gray anodized aluminum
### 4. Functionality
The cPCIS‑2103R serves as a modular enclosure for CompactPCI systems, providing mechanical housing, backplane interconnection, and cooling for 3U CompactPCI boards. It supports one system slot and up to twelve peripheral slots, enabling flexible system configurations for control, data acquisition, or communication applications.
Typical Use Cases:
- Industrial automation controllers
- Telecommunications and networking nodes
- Embedded computing platforms
- Data acquisition and signal processing systems
- Laboratory instrumentation and test equipment
Compatibility:
- Supports 3U CompactPCI CPU and I/O boards compliant with PICMG 2.0 R2.1
- Rear I/O compatible with transition modules via cBP‑3213P backplane
- Compatible with ADLINK power modules (cPS‑150R, cPS‑175 series) and ATX PSUs via cPCI‑PSF frame
- Integrates with optional LCD kits (cPCI‑LCD) and drive bay frames (cPCI‑DBF)
### 5. Components & Accessories
Included Components:
- cPCIS‑2103R 19″ rack chassis (4U height)
- cBP‑3213P 13‑slot 32‑bit CompactPCI backplane with bridge card
- Rear I/O connectors and guides
- Fan controller board with pre‑installed fans and air filters
- EMC gaskets and mounting hardware
Optional Accessories:
- Power Supply Units:
- cPS‑150R (175 W, 31‑pin redundant PSU)
- cPS‑175/AC, /48, /24 (175 W, 47‑pin PSU, AC or DC input)
- APS‑925A (280 W ATX PSU)
- Power Supply Frame: cPCI‑PSF (for PS2‑size PSU)
- Drive Bay Frame: cPCI‑DBF (supports 2 × 5¼″ + 1 × 3½″ drives)
- Slot Panels: cPCI‑SP3E (3U, 4 HP, with EMC gasket)
- LCD Kit: cPCI‑LCD (6.4″ TFT, 640 × 480, 300 cd/m², optional touchscreen)
- LCD Controller Cards: cPCI‑8215 (C&T 69000, 2 MB RAM) or cPCI‑8217 (SMI chipset, 4 MB RAM)
Connectors & Interfaces:
- Standard CompactPCI P1/P2 connectors per PICMG 2.0 R2.1
- Rear I/O connectors for transition modules
- Power input connectors (ATX, PS2, or CompactPCI PSU interface)
### 6. Installation & Setup
Mounting Options:
- 19″ rack‑mount with included brackets (482.6 mm width)
- Desktop configuration with adjustable foot stands
- Side handles for portable instrumentation
Installation Requirements:
- Standard 19″ rack space (4U height)
- Compatible CompactPCI CPU and I/O boards
- External or internal power supply (not included)
- Adequate airflow clearance below chassis for fan intake
Setup Procedure:
1. Mount chassis in rack or place on desktop with foot stands.
2. Install CompactPCI CPU and peripheral boards into backplane slots.
3. Connect power supply via cPCI‑PSF frame or redundant PSU backplane.
4. Connect rear I/O transition modules if required.
5. Verify fan operation and airflow direction.
6. Power on system and confirm backplane and PSU indicators.
Configuration Options:
- Select backplane voltage (V I/O = +5 V or +3.3 V) via jumper on backplane.
- Configure fan controller connections (CN101–CN103).
- Optional integration of LCD module and controller card.
### 7. Performance & Capabilities
System Capacity:
- 13 CompactPCI slots (1 system + 12 I/O)
- 32‑bit PCI bus operation at 33 MHz
- Rear I/O support for all peripheral slots
Cooling Performance:
- Up to 240 CFM total airflow (4 × 60 CFM fans)
- Operating temperature range: −10 °C ~ +70 °C
- Fan failure detection and current‑controlled operation
Power Handling:
- Supports up to 280 W ATX or 175 W × 2 redundant PSU configurations
- +5 V, +3.3 V, +12 V, −12 V rails per CompactPCI standard
- Hot‑swappable PSU support (with cPS‑150R or cPS‑175 series)
Efficiency & Reliability:
- Power supply efficiency up to 73 % (typical for cPS‑175 series)
- MTBF > 50,000 hours (PSU)
- EMC shielding ensures stable operation in industrial environments
Limitations:
- Power unit not included (must be ordered separately)
- Requires external cooling clearance below chassis
- Rear I/O limited to backplane configuration (cBP‑3213P)
### 8. Standards & Compliance
Industry Standards:
- PICMG 2.0 R2.1 CompactPCI specification
- PICMG 2.11 CompactPCI Power Interface specification
- IEC 603‑2 / DIN 41612 connector standards
- ATX power interface compatibility
Electrical & Safety Compliance (PSU dependent):
- UL 1950, CSA C22.2 No. 950, EN 60950 (TÜV certified)
- CE Marking (EMI/EMS compliance)
- FCC Part 15 Class A / EN 55022 Class A emissions
- EN 50082‑2 immunity (EN 61000‑4‑2/3/4/6/8, ENV 50204)
Environmental Ratings:
- Operating Temperature: 0 °C ~ 70 °C (full power to 40 °C with forced air)
- Storage Temperature: −40 °C ~ +85 °C
- Relative Humidity: < 95 % @ 40 °C, non‑condensing
- Operating Altitude: up to 6,400 m
Mechanical & EMC:
- EMC gaskets on all panels
- Vibration: 5 Hz–55 Hz, 0.38 mm displacement, 2 cycles/axis
- Shock: per MIL‑HDBK‑217E guidelines
### 9. Additional Information
Warranty:
One‑year limited warranty from date of purchase against defects in materials and workmanship. Warranty excludes damage from misuse, modification, or operation beyond specifications.
Support & Service:
ADLINK Technology Inc. provides global technical support and service.
- Website: [www.adlinktech.com](http://www.adlinktech.com)
- Email Contacts:
- General Service: service@adlink.com.tw
- NuIPC Support: nuipc@adlink.com.tw
- NuDAQ: nudaq@adlink.com.tw
- NuDAM: nudam@adlink.com.tw
- NuPRO: nupro@adlink.com.tw
- Software: sw@adlink.com.tw
- Telephone: +886‑2‑8226‑5877
- Fax: +886‑2‑8226‑5717
- Address: 9F, No. 166, Jian Yi Road, Chungho City, Taipei 235, Taiwan, R.O.C.
Maintenance:
- Periodically clean air filters and verify fan operation.
- Inspect EMC gaskets and replace if worn.
- Ensure backplane connectors remain free of dust and debris.
- Replace fans or PSUs with ADLINK‑approved components only.
Upgrades & Expansion:
- Supports integration of additional CompactPCI boards, redundant PSUs, or LCD modules.
- Backplane bridge card allows system expansion to secondary CompactPCI segments.
- Optional rear I/O transition modules extend connectivity for field applications.
Documentation & Revision:
- User Manual: cPCIS‑1000/2000 Series User’s Guide, Rev. 1.02 (Aug 30 2000)
- Information subject to change without notice for design improvements.
### Summary
The ADLINK cPCIS‑2103R is a robust, modular CompactPCI chassis engineered for demanding industrial and embedded applications. Its 13‑slot, 32‑bit backplane with rear I/O support provides exceptional flexibility for system integrators. The chassis’ 4U rack‑mount form factor, comprehensive EMC shielding, and efficient cooling system make it ideal for high‑reliability environments. With compatibility across ADLINK’s ecosystem of power supplies, backplanes, and LCD modules, the cPCIS‑2103R delivers a scalable foundation for CompactPCI‑based computing platforms requiring performance, modularity, and long‑term serviceability.
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