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- Dual Intel Movidius Myriad X Integration:
The EGPA-I201-C1-A71 supports two Intel® Movidius™ Myriad X VPUs, providing powerful parallel AI inference capabilities for edge applications.
- M.2 2280 B+M Key Interface:
Designed in the M.2 2280 form factor, the module connects via a PCI Express 2.0 x1 interface, ensuring compatibility with a wide range of embedded and industrial motherboards.
- Low Power Design:
With a total thermal design power (TDP) of only 8W, the module delivers high computational performance while maintaining energy efficiency, making it ideal for fanless or thermally constrained systems.
- AI Framework Support:
Compatible with major deep learning frameworks including TensorFlow, Caffe, and MXNet, enabling flexible deployment of pre-trained models and custom AI workloads.
- Intel OpenVINO™ Toolkit Support:
Fully compatible with Intel’s OpenVINO™ toolkit, allowing developers to optimize and deploy deep learning inference across heterogeneous computing environments.
- Thermal Management Options:
Available in configurations with or without a heatsink, providing flexibility for different thermal and spatial requirements.
- Regulatory Compliance:
Certified for CE and FCC Class A standards, ensuring electromagnetic compatibility and safety compliance for industrial and commercial use.
- Durable Construction:
Features a 30µ” gold-plated connector (golden finger) for enhanced durability and reliable signal integrity over extended operational lifetimes.
- Warranty:
Backed by a 3-year limited warranty from Innodisk, ensuring long-term reliability and support.
The EGPA-I201-C1-A71 supports two Intel® Movidius™ Myriad X VPUs, providing powerful parallel AI inference capabilities for edge applications.
- M.2 2280 B+M Key Interface:
Designed in the M.2 2280 form factor, the module connects via a PCI Express 2.0 x1 interface, ensuring compatibility with a wide range of embedded and industrial motherboards.
- Low Power Design:
With a total thermal design power (TDP) of only 8W, the module delivers high computational performance while maintaining energy efficiency, making it ideal for fanless or thermally constrained systems.
- AI Framework Support:
Compatible with major deep learning frameworks including TensorFlow, Caffe, and MXNet, enabling flexible deployment of pre-trained models and custom AI workloads.
- Intel OpenVINO™ Toolkit Support:
Fully compatible with Intel’s OpenVINO™ toolkit, allowing developers to optimize and deploy deep learning inference across heterogeneous computing environments.
- Thermal Management Options:
Available in configurations with or without a heatsink, providing flexibility for different thermal and spatial requirements.
- Regulatory Compliance:
Certified for CE and FCC Class A standards, ensuring electromagnetic compatibility and safety compliance for industrial and commercial use.
- Durable Construction:
Features a 30µ” gold-plated connector (golden finger) for enhanced durability and reliable signal integrity over extended operational lifetimes.
- Warranty:
Backed by a 3-year limited warranty from Innodisk, ensuring long-term reliability and support.
Comprehensive Product Summary: EGPA-I201-C1-A71 – M.2 to Dual Intel Movidius Myriad X AI Module
### 1. Product Overview
Product Name: M.2 to Dual MYDX Module
Model: EGPA-I201-C1-A71
Series: EGPA-I201 Series
Article Number: EGPA-I201-C1-A71
Manufacturer: Innodisk Corporation
Product Description:
The Innodisk EGPA-I201-C1-A71 is a high-performance M.2 2280 B+M Key module designed to interface with dual Intel® Movidius™ Myriad X Vision Processing Units (VPUs). It serves as a compact, low-power AI acceleration solution optimized for edge computing, computer vision, and deep learning inference workloads. The module bridges M.2 connectivity with dual MYDX (Movidius Myriad X) modules, enabling developers and system integrators to deploy AI capabilities in embedded, industrial, and IoT environments.
Manufacturer Contact Information:
- Headquarters (Taiwan):
5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
Tel: +886-2-7703-3000
Email: sales@innodisk.com
- Regional Offices:
- USA: usasales@innodisk.com | +1-510-770-9421
- Europe: eusales@innodisk.com | +31-40-3045-400
- Japan: jpsales@innodisk.com | +81-3-6667-0161
- China: sales_cn@innodisk.com | +86-755-2167-3689
Official Website: [www.innodisk.com](http://www.innodisk.com)
### 2. Key Features
- Dual Intel Movidius Myriad X Integration:
The EGPA-I201-C1-A71 supports two Intel® Movidius™ Myriad X VPUs, providing powerful parallel AI inference capabilities for edge applications.
- M.2 2280 B+M Key Interface:
Designed in the M.2 2280 form factor, the module connects via a PCI Express 2.0 x1 interface, ensuring compatibility with a wide range of embedded and industrial motherboards.
- Low Power Design:
With a total thermal design power (TDP) of only 8W, the module delivers high computational performance while maintaining energy efficiency, making it ideal for fanless or thermally constrained systems.
- AI Framework Support:
Compatible with major deep learning frameworks including TensorFlow, Caffe, and MXNet, enabling flexible deployment of pre-trained models and custom AI workloads.
- Intel OpenVINO™ Toolkit Support:
Fully compatible with Intel’s OpenVINO™ toolkit, allowing developers to optimize and deploy deep learning inference across heterogeneous computing environments.
- Thermal Management Options:
Available in configurations with or without a heatsink, providing flexibility for different thermal and spatial requirements.
- Regulatory Compliance:
Certified for CE and FCC Class A standards, ensuring electromagnetic compatibility and safety compliance for industrial and commercial use.
- Durable Construction:
Features a 30µ” gold-plated connector (golden finger) for enhanced durability and reliable signal integrity over extended operational lifetimes.
- Warranty:
Backed by a 3-year limited warranty from Innodisk, ensuring long-term reliability and support.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Form Factor | M.2 2280 B+M Key |
| Interface | PCI Express 2.0 x1 |
| Supported AI Processors | Dual Intel® Movidius™ Myriad X VPUs |
| Thermal Design Power (TDP) | 8W |
| Dimensions (With Heatsink) | 22.8 mm (W) × 80.0 mm (L) × 22.0 mm (H) |
| Weight (With Heatsink) | 34.12 g |
| Dimensions (Without Heatsink) | 22.0 mm (W) × 80.0 mm (L) × 7.4 mm (H) |
| Weight (Without Heatsink) | 6.89 g |
| Operating Temperature Range | 0°C to +60°C |
| Supported Frameworks | TensorFlow, Caffe, MXNet |
| Supported Operating Systems | Windows 10 (64-bit), Ubuntu 18.04 (64-bit) |
| Certifications | CE, FCC Class A |
| Connector Finish | 30µ” gold plating |
| Warranty | 3 years |
| Product Availability | EGPA-I201-C1 (with heatsink) |
### 4. Functionality
The EGPA-I201-C1-A71 functions as an AI acceleration module that bridges the M.2 interface with dual Intel Movidius Myriad X VPUs. It is designed to offload AI inference workloads from the host CPU, enabling faster and more efficient processing of computer vision, image recognition, and deep learning tasks.
Operational Principle:
When installed in an M.2 slot (B+M Key) on a compatible host system, the module communicates via PCIe 2.0 x1. The dual Myriad X VPUs handle neural network inference tasks, leveraging the Intel OpenVINO™ toolkit for optimized performance. The host CPU manages data preprocessing and postprocessing, while the VPUs execute the computationally intensive inference operations.
Use Cases and Applications:
- Edge AI Computing: Real-time inference for IoT and embedded systems.
- Computer Vision: Object detection, facial recognition, and image classification.
- Industrial Automation: Quality inspection, defect detection, and predictive maintenance.
- Smart Surveillance: Video analytics and intelligent monitoring.
- Robotics: Vision-based navigation and object tracking.
- Healthcare Imaging: AI-assisted diagnostics and image segmentation.
Compatibility:
The module is compatible with systems supporting M.2 2280 B+M Key slots and PCIe 2.0 x1 lanes. It supports both Windows and Linux environments, ensuring broad integration across industrial PCs, embedded systems, and AI edge devices.
### 5. Components & Accessories
Included Items:
- EGPA-I201-C1-A71 M.2 2280 to Dual Intel Movidius Myriad X AI Module
- Optional heatsink (depending on configuration)
- Documentation and installation guide
Optional Accessories:
- Passive or active cooling solutions for enhanced thermal management
- M.2 mounting screws and standoffs (system-dependent)
- PCIe M.2 adapter cards for desktop or server integration
Connectors and Interfaces:
- M.2 Edge Connector: B+M Key, PCIe 2.0 x1 interface
- Dual MYDX Sockets: For Intel Movidius Myriad X modules
- Power Input: Supplied through M.2 interface (no external power required)
### 6. Installation & Setup
System Requirements:
- Host system with an available M.2 2280 B+M Key slot supporting PCIe 2.0 x1
- Compatible operating system (Windows 10 64-bit or Ubuntu 18.04 64-bit)
- Intel OpenVINO™ toolkit installed for AI inference acceleration
Installation Procedure:
1. Power off the host system and disconnect from power.
2. Insert the EGPA-I201-C1-A71 module into the M.2 slot, ensuring proper alignment of the B+M Key connector.
3. Secure the module using the appropriate screw or standoff.
4. If using the heatsink version, ensure adequate airflow or passive cooling clearance.
5. Power on the system and install necessary drivers and the Intel OpenVINO™ toolkit.
6. Verify device recognition in the operating system and configure AI workloads accordingly.
Configuration:
- Use Intel OpenVINO™ toolkit for model optimization and deployment.
- Supported frameworks (TensorFlow, Caffe, MXNet) can be integrated through OpenVINO’s Model Optimizer.
- Configure inference engine parameters to utilize both Myriad X VPUs for parallel processing.
### 7. Performance & Capabilities
Processing Power:
Each Intel Movidius Myriad X VPU integrates a Neural Compute Engine (NCE) optimized for deep learning inference. With dual VPUs, the EGPA-I201-C1-A71 can handle multiple concurrent AI workloads, significantly accelerating inference throughput compared to CPU-only systems.
Performance Highlights:
- Dual VPU architecture for parallel AI inference
- Optimized for low-latency, high-efficiency edge computing
- Supports FP16 precision for efficient neural network execution
- Low power consumption (8W TDP) suitable for embedded and fanless designs
Efficiency and Thermal Management:
The module’s low power design minimizes heat generation. The optional heatsink version enhances thermal dissipation, maintaining stable performance under sustained workloads.
Limitations:
- PCIe 2.0 x1 bandwidth may limit data throughput for extremely high-resolution or high-frame-rate applications.
- Operating temperature limited to 0°C–60°C; not suitable for extreme environments without additional cooling.
### 8. Standards & Compliance
Certifications:
- CE (Conformité Européenne): Ensures compliance with European safety, health, and environmental protection standards.
- FCC Class A: Certified for electromagnetic compatibility in industrial and commercial environments.
Industry Standards:
- M.2 2280 Form Factor: Compliant with M.2 specification for embedded and computing devices.
- PCI Express 2.0: Standardized interface ensuring interoperability with a wide range of host systems.
- Intel OpenVINO™ Compatibility: Conforms to Intel’s AI acceleration and inference optimization framework.
Environmental Compliance:
- RoHS-compliant materials (lead-free construction).
- Designed for industrial-grade reliability and long-term operation.
### 9. Additional Information
Warranty & Support:
- Warranty Period: 3 years limited warranty covering manufacturing defects and performance reliability.
- Technical Support: Global support network through Innodisk’s regional offices.
- Software Support:
- Intel OpenVINO™ toolkit (available from Intel’s official documentation portal).
- Framework compatibility with TensorFlow, Caffe, and MXNet.
Maintenance:
- Periodic inspection recommended for heatsink cleanliness and airflow.
- Firmware and software updates available through Innodisk and Intel support channels.
Product Lifecycle & Updates:
- Specifications subject to change without prior notice (as of September 5, 2020).
- Continuous updates aligned with Intel’s AI software ecosystem and OpenVINO™ toolkit revisions.
Ordering Information:
- Model: EGPA-I201-C1
- Description: M.2 2280 to Dual Intel Movidius Myriad X AI Module (with Heatsink)
- Manufacturer: Innodisk Corporation
- Website: [www.innodisk.com](http://www.innodisk.com)
### Summary
The Innodisk EGPA-I201-C1-A71 represents a compact, efficient, and robust AI acceleration solution tailored for edge and embedded computing environments. By integrating dual Intel Movidius Myriad X VPUs into an M.2 2280 form factor, it delivers exceptional inference performance within a low-power envelope. Its compatibility with Intel’s OpenVINO™ toolkit and leading AI frameworks ensures seamless deployment across diverse applications—from industrial automation to smart surveillance and robotics.
With CE/FCC Class A certification, durable 30µ” gold-plated connectors, and a 3-year warranty, the EGPA-I201-C1-A71 exemplifies Innodisk’s commitment to reliability, performance, and innovation in AI hardware design.
### 1. Product Overview
Product Name: M.2 to Dual MYDX Module
Model: EGPA-I201-C1-A71
Series: EGPA-I201 Series
Article Number: EGPA-I201-C1-A71
Manufacturer: Innodisk Corporation
Product Description:
The Innodisk EGPA-I201-C1-A71 is a high-performance M.2 2280 B+M Key module designed to interface with dual Intel® Movidius™ Myriad X Vision Processing Units (VPUs). It serves as a compact, low-power AI acceleration solution optimized for edge computing, computer vision, and deep learning inference workloads. The module bridges M.2 connectivity with dual MYDX (Movidius Myriad X) modules, enabling developers and system integrators to deploy AI capabilities in embedded, industrial, and IoT environments.
Manufacturer Contact Information:
- Headquarters (Taiwan):
5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
Tel: +886-2-7703-3000
Email: sales@innodisk.com
- Regional Offices:
- USA: usasales@innodisk.com | +1-510-770-9421
- Europe: eusales@innodisk.com | +31-40-3045-400
- Japan: jpsales@innodisk.com | +81-3-6667-0161
- China: sales_cn@innodisk.com | +86-755-2167-3689
Official Website: [www.innodisk.com](http://www.innodisk.com)
### 2. Key Features
- Dual Intel Movidius Myriad X Integration:
The EGPA-I201-C1-A71 supports two Intel® Movidius™ Myriad X VPUs, providing powerful parallel AI inference capabilities for edge applications.
- M.2 2280 B+M Key Interface:
Designed in the M.2 2280 form factor, the module connects via a PCI Express 2.0 x1 interface, ensuring compatibility with a wide range of embedded and industrial motherboards.
- Low Power Design:
With a total thermal design power (TDP) of only 8W, the module delivers high computational performance while maintaining energy efficiency, making it ideal for fanless or thermally constrained systems.
- AI Framework Support:
Compatible with major deep learning frameworks including TensorFlow, Caffe, and MXNet, enabling flexible deployment of pre-trained models and custom AI workloads.
- Intel OpenVINO™ Toolkit Support:
Fully compatible with Intel’s OpenVINO™ toolkit, allowing developers to optimize and deploy deep learning inference across heterogeneous computing environments.
- Thermal Management Options:
Available in configurations with or without a heatsink, providing flexibility for different thermal and spatial requirements.
- Regulatory Compliance:
Certified for CE and FCC Class A standards, ensuring electromagnetic compatibility and safety compliance for industrial and commercial use.
- Durable Construction:
Features a 30µ” gold-plated connector (golden finger) for enhanced durability and reliable signal integrity over extended operational lifetimes.
- Warranty:
Backed by a 3-year limited warranty from Innodisk, ensuring long-term reliability and support.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Form Factor | M.2 2280 B+M Key |
| Interface | PCI Express 2.0 x1 |
| Supported AI Processors | Dual Intel® Movidius™ Myriad X VPUs |
| Thermal Design Power (TDP) | 8W |
| Dimensions (With Heatsink) | 22.8 mm (W) × 80.0 mm (L) × 22.0 mm (H) |
| Weight (With Heatsink) | 34.12 g |
| Dimensions (Without Heatsink) | 22.0 mm (W) × 80.0 mm (L) × 7.4 mm (H) |
| Weight (Without Heatsink) | 6.89 g |
| Operating Temperature Range | 0°C to +60°C |
| Supported Frameworks | TensorFlow, Caffe, MXNet |
| Supported Operating Systems | Windows 10 (64-bit), Ubuntu 18.04 (64-bit) |
| Certifications | CE, FCC Class A |
| Connector Finish | 30µ” gold plating |
| Warranty | 3 years |
| Product Availability | EGPA-I201-C1 (with heatsink) |
### 4. Functionality
The EGPA-I201-C1-A71 functions as an AI acceleration module that bridges the M.2 interface with dual Intel Movidius Myriad X VPUs. It is designed to offload AI inference workloads from the host CPU, enabling faster and more efficient processing of computer vision, image recognition, and deep learning tasks.
Operational Principle:
When installed in an M.2 slot (B+M Key) on a compatible host system, the module communicates via PCIe 2.0 x1. The dual Myriad X VPUs handle neural network inference tasks, leveraging the Intel OpenVINO™ toolkit for optimized performance. The host CPU manages data preprocessing and postprocessing, while the VPUs execute the computationally intensive inference operations.
Use Cases and Applications:
- Edge AI Computing: Real-time inference for IoT and embedded systems.
- Computer Vision: Object detection, facial recognition, and image classification.
- Industrial Automation: Quality inspection, defect detection, and predictive maintenance.
- Smart Surveillance: Video analytics and intelligent monitoring.
- Robotics: Vision-based navigation and object tracking.
- Healthcare Imaging: AI-assisted diagnostics and image segmentation.
Compatibility:
The module is compatible with systems supporting M.2 2280 B+M Key slots and PCIe 2.0 x1 lanes. It supports both Windows and Linux environments, ensuring broad integration across industrial PCs, embedded systems, and AI edge devices.
### 5. Components & Accessories
Included Items:
- EGPA-I201-C1-A71 M.2 2280 to Dual Intel Movidius Myriad X AI Module
- Optional heatsink (depending on configuration)
- Documentation and installation guide
Optional Accessories:
- Passive or active cooling solutions for enhanced thermal management
- M.2 mounting screws and standoffs (system-dependent)
- PCIe M.2 adapter cards for desktop or server integration
Connectors and Interfaces:
- M.2 Edge Connector: B+M Key, PCIe 2.0 x1 interface
- Dual MYDX Sockets: For Intel Movidius Myriad X modules
- Power Input: Supplied through M.2 interface (no external power required)
### 6. Installation & Setup
System Requirements:
- Host system with an available M.2 2280 B+M Key slot supporting PCIe 2.0 x1
- Compatible operating system (Windows 10 64-bit or Ubuntu 18.04 64-bit)
- Intel OpenVINO™ toolkit installed for AI inference acceleration
Installation Procedure:
1. Power off the host system and disconnect from power.
2. Insert the EGPA-I201-C1-A71 module into the M.2 slot, ensuring proper alignment of the B+M Key connector.
3. Secure the module using the appropriate screw or standoff.
4. If using the heatsink version, ensure adequate airflow or passive cooling clearance.
5. Power on the system and install necessary drivers and the Intel OpenVINO™ toolkit.
6. Verify device recognition in the operating system and configure AI workloads accordingly.
Configuration:
- Use Intel OpenVINO™ toolkit for model optimization and deployment.
- Supported frameworks (TensorFlow, Caffe, MXNet) can be integrated through OpenVINO’s Model Optimizer.
- Configure inference engine parameters to utilize both Myriad X VPUs for parallel processing.
### 7. Performance & Capabilities
Processing Power:
Each Intel Movidius Myriad X VPU integrates a Neural Compute Engine (NCE) optimized for deep learning inference. With dual VPUs, the EGPA-I201-C1-A71 can handle multiple concurrent AI workloads, significantly accelerating inference throughput compared to CPU-only systems.
Performance Highlights:
- Dual VPU architecture for parallel AI inference
- Optimized for low-latency, high-efficiency edge computing
- Supports FP16 precision for efficient neural network execution
- Low power consumption (8W TDP) suitable for embedded and fanless designs
Efficiency and Thermal Management:
The module’s low power design minimizes heat generation. The optional heatsink version enhances thermal dissipation, maintaining stable performance under sustained workloads.
Limitations:
- PCIe 2.0 x1 bandwidth may limit data throughput for extremely high-resolution or high-frame-rate applications.
- Operating temperature limited to 0°C–60°C; not suitable for extreme environments without additional cooling.
### 8. Standards & Compliance
Certifications:
- CE (Conformité Européenne): Ensures compliance with European safety, health, and environmental protection standards.
- FCC Class A: Certified for electromagnetic compatibility in industrial and commercial environments.
Industry Standards:
- M.2 2280 Form Factor: Compliant with M.2 specification for embedded and computing devices.
- PCI Express 2.0: Standardized interface ensuring interoperability with a wide range of host systems.
- Intel OpenVINO™ Compatibility: Conforms to Intel’s AI acceleration and inference optimization framework.
Environmental Compliance:
- RoHS-compliant materials (lead-free construction).
- Designed for industrial-grade reliability and long-term operation.
### 9. Additional Information
Warranty & Support:
- Warranty Period: 3 years limited warranty covering manufacturing defects and performance reliability.
- Technical Support: Global support network through Innodisk’s regional offices.
- Software Support:
- Intel OpenVINO™ toolkit (available from Intel’s official documentation portal).
- Framework compatibility with TensorFlow, Caffe, and MXNet.
Maintenance:
- Periodic inspection recommended for heatsink cleanliness and airflow.
- Firmware and software updates available through Innodisk and Intel support channels.
Product Lifecycle & Updates:
- Specifications subject to change without prior notice (as of September 5, 2020).
- Continuous updates aligned with Intel’s AI software ecosystem and OpenVINO™ toolkit revisions.
Ordering Information:
- Model: EGPA-I201-C1
- Description: M.2 2280 to Dual Intel Movidius Myriad X AI Module (with Heatsink)
- Manufacturer: Innodisk Corporation
- Website: [www.innodisk.com](http://www.innodisk.com)
### Summary
The Innodisk EGPA-I201-C1-A71 represents a compact, efficient, and robust AI acceleration solution tailored for edge and embedded computing environments. By integrating dual Intel Movidius Myriad X VPUs into an M.2 2280 form factor, it delivers exceptional inference performance within a low-power envelope. Its compatibility with Intel’s OpenVINO™ toolkit and leading AI frameworks ensures seamless deployment across diverse applications—from industrial automation to smart surveillance and robotics.
With CE/FCC Class A certification, durable 30µ” gold-plated connectors, and a 3-year warranty, the EGPA-I201-C1-A71 exemplifies Innodisk’s commitment to reliability, performance, and innovation in AI hardware design.
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EGPA-I201_Datasheet.pdf
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