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- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4GB
- Operating Temperature Range: -40°C to +85°C (wide temperature range suitable for industrial environments)
- Voltage: Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration)
- Data Rate: Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility)
- Error Correction: Non-ECC (standard) or ECC (optional, depending on variant)
- Compatibility: Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms
- Reliability: Built with high-quality DRAM chips screened for extended temperature operation and long-term stability
- Compliance: JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms
- Durability: Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations
Unique Selling Points:
- Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use
- Compact SO-DIMM form factor ideal for space-constrained embedded systems
- High reliability and endurance for mission-critical applications
- Fully compliant with DDR3 JEDEC standards for broad compatibility
- Optimized for low power consumption and stable performance under thermal stress
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4GB
- Operating Temperature Range: -40°C to +85°C (wide temperature range suitable for industrial environments)
- Voltage: Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration)
- Data Rate: Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility)
- Error Correction: Non-ECC (standard) or ECC (optional, depending on variant)
- Compatibility: Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms
- Reliability: Built with high-quality DRAM chips screened for extended temperature operation and long-term stability
- Compliance: JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms
- Durability: Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations
Unique Selling Points:
- Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use
- Compact SO-DIMM form factor ideal for space-constrained embedded systems
- High reliability and endurance for mission-critical applications
- Fully compliant with DDR3 JEDEC standards for broad compatibility
- Optimized for low power consumption and stable performance under thermal stress
Comprehensive Product Summary: 8GB-DDR3-ET SO-DIMM DDR3 4GB Wide Temperature Memory Module
### 1. Product Overview
Product Name: SO-DIMM DDR3 4GB Wide Temperature Memory Module
Model: 8GB-DDR3-ET
Series: DDR3 SO-DIMM Industrial Grade Memory
Article Number: 8GB-DDR3-ET
Manufacturer: [Manufacturer not specified – typically industrial memory manufacturer or OEM supplier]
The 8GB-DDR3-ET is a high-reliability, industrial-grade DDR3 SO-DIMM memory module designed for embedded systems, industrial PCs, automation controllers, and rugged computing environments. It provides stable performance across a wide temperature range, ensuring dependable operation in harsh or thermally challenging conditions. This module is engineered to meet the stringent requirements of industrial and embedded applications where durability, longevity, and consistent performance are critical.
### 2. Key Features
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4GB
- Operating Temperature Range: -40°C to +85°C (wide temperature range suitable for industrial environments)
- Voltage: Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration)
- Data Rate: Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility)
- Error Correction: Non-ECC (standard) or ECC (optional, depending on variant)
- Compatibility: Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms
- Reliability: Built with high-quality DRAM chips screened for extended temperature operation and long-term stability
- Compliance: JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms
- Durability: Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations
Unique Selling Points:
- Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use
- Compact SO-DIMM form factor ideal for space-constrained embedded systems
- High reliability and endurance for mission-critical applications
- Fully compliant with DDR3 JEDEC standards for broad compatibility
- Optimized for low power consumption and stable performance under thermal stress
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Model Number | 8GB-DDR3-ET |
| Memory Type | DDR3 SDRAM |
| Form Factor | 204-pin SO-DIMM |
| Capacity | 4GB |
| Data Rate | DDR3-1066 / DDR3-1333 / DDR3-1600 (depending on system support) |
| Bus Width | 64-bit |
| Voltage | 1.5V nominal (DDR3 standard) |
| Operating Temperature Range | -40°C to +85°C |
| Storage Temperature Range | -55°C to +100°C (typical for industrial-grade modules) |
| Dimensions (L x H x T) | Approx. 67.6 mm x 30 mm x 3.8 mm (standard SO-DIMM dimensions) |
| Weight | Approx. 8–12 grams |
| Error Correction | Non-ECC (standard) |
| Chip Organization | x8 or x16 DRAM configuration (depending on module design) |
| Latency | CL7–CL11 (depending on frequency and configuration) |
| PCB Layers | 6-layer or 8-layer PCB for signal integrity and thermal stability |
| Compliance | JEDEC JESD79-3F standard |
| RoHS Compliance | Yes, lead-free and environmentally compliant |
| ESD Protection | Integrated protection circuitry for electrostatic discharge resilience |
### 4. Functionality
The 8GB-DDR3-ET operates as a volatile memory module that temporarily stores data for active processes within a computing system. It functions as the primary working memory, enabling high-speed data access and efficient multitasking. The DDR3 architecture allows double data rate transfers, meaning data is transmitted on both the rising and falling edges of the clock signal, effectively doubling throughput compared to DDR2.
Use Cases and Applications:
- Industrial PCs and embedded controllers
- Automation and control systems
- Transportation and railway computing systems
- Network appliances and routers
- Digital signage and kiosks
- Ruggedized laptops and portable devices
- Edge computing and IoT gateways
- Military and aerospace embedded systems
Compatibility:
- Compatible with motherboards and systems supporting DDR3 SO-DIMM slots
- Backward compatible with DDR3L (low-voltage) systems if voltage tolerance allows
- Works with Intel and AMD chipsets supporting DDR3 memory technology
### 5. Components & Accessories
Included Items:
- 1 × 4GB DDR3 SO-DIMM module (8GB-DDR3-ET)
- Standard anti-static packaging for ESD protection
- Product label with model number, serial number, and manufacturing batch code
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- Heat spreader or thermal pad for improved heat dissipation
- Custom labeling or serialization for OEM integration
- ECC variant for systems requiring error correction
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance
- Standard SO-DIMM notch alignment for keyed installation
### 6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot
- System BIOS supporting DDR3 memory modules up to 4GB per slot (or higher, depending on configuration)
- Proper ESD handling during installation
Mounting Options:
- Direct insertion into SO-DIMM slot at a 45° angle, followed by a downward press to lock into place
- Retention clips on both sides secure the module in position
Configuration:
- Automatic detection via SPD (Serial Presence Detect) EEPROM, which communicates timing parameters and voltage requirements to the system BIOS
- No manual configuration typically required; system auto-configures memory speed and latency based on SPD data
- For industrial systems, BIOS settings may allow manual timing adjustments for performance tuning or thermal optimization
### 7. Performance & Capabilities
Speed and Bandwidth:
- Supports data transfer rates up to 12.8 GB/s (DDR3-1600)
- Optimized for stable operation across full temperature range
- Low latency and high throughput for real-time processing applications
Capacity and Scalability:
- 4GB capacity per module; multiple modules can be installed for higher total system memory
- Suitable for systems requiring moderate memory capacity with high reliability
Efficiency:
- Low power consumption due to DDR3 architecture and efficient signaling
- Reduced heat generation compared to earlier DDR2 modules
Limitations:
- Not compatible with DDR4 or DDR5 systems
- Performance limited by system memory controller and chipset capabilities
- Non-ECC version does not provide error correction for mission-critical data integrity (ECC variant recommended for such use cases)
Thermal and Environmental Performance:
- Designed for continuous operation in ambient temperatures from -40°C to +85°C
- Tested for thermal cycling, vibration, and humidity endurance
- Suitable for fanless or sealed enclosures where airflow is limited
### 8. Standards & Compliance
Industry Standards:
- JEDEC JESD79-3F DDR3 SDRAM standard compliance
- SO-DIMM mechanical and electrical interface per JEDEC MO-268 specification
Regulatory Compliance:
- RoHS (Restriction of Hazardous Substances): Fully compliant, lead-free construction
- REACH: Conforms to European chemical safety regulations
- WEEE: Designed for environmentally responsible disposal and recycling
- CE Marking: Meets applicable EU safety and EMC directives (depending on manufacturer certification)
Quality and Reliability Testing:
- 100% functional testing at extended temperature range
- Burn-in and stress testing for industrial-grade reliability
- ESD and surge protection validation
- Vibration and shock testing per industrial standards
### 9. Additional Information
Warranty:
- Typical warranty: 3 to 5 years (depending on manufacturer policy)
- Covers defects in materials and workmanship under normal operating conditions
Support:
- Technical documentation and datasheets available from manufacturer or distributor
- Application engineering support for system integration and compatibility verification
- Firmware or SPD configuration support for OEM customization
Maintenance:
- No active maintenance required; passive component with long operational lifespan
- Recommended periodic inspection for contact cleanliness in high-vibration environments
Lifecycle and Availability:
- Long-term availability guaranteed for industrial customers (typically 5–7 years)
- Stable BOM (Bill of Materials) policy to ensure consistent performance across production batches
Updates and Revisions:
- SPD firmware updates may be available for timing optimization or compatibility improvements
- Product revisions identified by updated part numbers or suffixes (e.g., 8GB-DDR3-ET-R1)
### Summary
The 8GB-DDR3-ET SO-DIMM DDR3 4GB Wide Temperature Memory Module is a robust, industrial-grade memory solution engineered for reliability, stability, and performance in demanding environments. With its wide operating temperature range of -40°C to +85°C, compact SO-DIMM form factor, and adherence to JEDEC DDR3 standards, it is ideally suited for embedded, industrial, and rugged computing applications. The module’s combination of 4GB capacity, low power consumption, and high data throughput ensures efficient operation in systems where space, thermal management, and reliability are critical.
Whether deployed in factory automation, transportation systems, or outdoor embedded devices, the 8GB-DDR3-ET delivers consistent performance and long-term dependability, making it a preferred choice for OEMs and system integrators seeking industrial-grade DDR3 memory solutions.
### 1. Product Overview
Product Name: SO-DIMM DDR3 4GB Wide Temperature Memory Module
Model: 8GB-DDR3-ET
Series: DDR3 SO-DIMM Industrial Grade Memory
Article Number: 8GB-DDR3-ET
Manufacturer: [Manufacturer not specified – typically industrial memory manufacturer or OEM supplier]
The 8GB-DDR3-ET is a high-reliability, industrial-grade DDR3 SO-DIMM memory module designed for embedded systems, industrial PCs, automation controllers, and rugged computing environments. It provides stable performance across a wide temperature range, ensuring dependable operation in harsh or thermally challenging conditions. This module is engineered to meet the stringent requirements of industrial and embedded applications where durability, longevity, and consistent performance are critical.
### 2. Key Features
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 4GB
- Operating Temperature Range: -40°C to +85°C (wide temperature range suitable for industrial environments)
- Voltage: Standard DDR3 operating voltage (typically 1.5V; low-voltage variants may operate at 1.35V depending on configuration)
- Data Rate: Supports DDR3 standard frequencies (commonly 1066 MHz, 1333 MHz, 1600 MHz depending on system compatibility)
- Error Correction: Non-ECC (standard) or ECC (optional, depending on variant)
- Compatibility: Designed for systems supporting DDR3 SO-DIMM slots, including industrial PCs, embedded controllers, and compact computing platforms
- Reliability: Built with high-quality DRAM chips screened for extended temperature operation and long-term stability
- Compliance: JEDEC-compliant design ensuring interoperability and standardization across DDR3 platforms
- Durability: Designed for continuous operation in environments with temperature extremes, vibration, and humidity variations
Unique Selling Points:
- Wide temperature tolerance (-40°C to +85°C) for industrial and outdoor use
- Compact SO-DIMM form factor ideal for space-constrained embedded systems
- High reliability and endurance for mission-critical applications
- Fully compliant with DDR3 JEDEC standards for broad compatibility
- Optimized for low power consumption and stable performance under thermal stress
### 3. Technical Specifications
| Parameter | Specification |
|----------------|-------------------|
| Model Number | 8GB-DDR3-ET |
| Memory Type | DDR3 SDRAM |
| Form Factor | 204-pin SO-DIMM |
| Capacity | 4GB |
| Data Rate | DDR3-1066 / DDR3-1333 / DDR3-1600 (depending on system support) |
| Bus Width | 64-bit |
| Voltage | 1.5V nominal (DDR3 standard) |
| Operating Temperature Range | -40°C to +85°C |
| Storage Temperature Range | -55°C to +100°C (typical for industrial-grade modules) |
| Dimensions (L x H x T) | Approx. 67.6 mm x 30 mm x 3.8 mm (standard SO-DIMM dimensions) |
| Weight | Approx. 8–12 grams |
| Error Correction | Non-ECC (standard) |
| Chip Organization | x8 or x16 DRAM configuration (depending on module design) |
| Latency | CL7–CL11 (depending on frequency and configuration) |
| PCB Layers | 6-layer or 8-layer PCB for signal integrity and thermal stability |
| Compliance | JEDEC JESD79-3F standard |
| RoHS Compliance | Yes, lead-free and environmentally compliant |
| ESD Protection | Integrated protection circuitry for electrostatic discharge resilience |
### 4. Functionality
The 8GB-DDR3-ET operates as a volatile memory module that temporarily stores data for active processes within a computing system. It functions as the primary working memory, enabling high-speed data access and efficient multitasking. The DDR3 architecture allows double data rate transfers, meaning data is transmitted on both the rising and falling edges of the clock signal, effectively doubling throughput compared to DDR2.
Use Cases and Applications:
- Industrial PCs and embedded controllers
- Automation and control systems
- Transportation and railway computing systems
- Network appliances and routers
- Digital signage and kiosks
- Ruggedized laptops and portable devices
- Edge computing and IoT gateways
- Military and aerospace embedded systems
Compatibility:
- Compatible with motherboards and systems supporting DDR3 SO-DIMM slots
- Backward compatible with DDR3L (low-voltage) systems if voltage tolerance allows
- Works with Intel and AMD chipsets supporting DDR3 memory technology
### 5. Components & Accessories
Included Items:
- 1 × 4GB DDR3 SO-DIMM module (8GB-DDR3-ET)
- Standard anti-static packaging for ESD protection
- Product label with model number, serial number, and manufacturing batch code
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- Heat spreader or thermal pad for improved heat dissipation
- Custom labeling or serialization for OEM integration
- ECC variant for systems requiring error correction
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance
- Standard SO-DIMM notch alignment for keyed installation
### 6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot
- System BIOS supporting DDR3 memory modules up to 4GB per slot (or higher, depending on configuration)
- Proper ESD handling during installation
Mounting Options:
- Direct insertion into SO-DIMM slot at a 45° angle, followed by a downward press to lock into place
- Retention clips on both sides secure the module in position
Configuration:
- Automatic detection via SPD (Serial Presence Detect) EEPROM, which communicates timing parameters and voltage requirements to the system BIOS
- No manual configuration typically required; system auto-configures memory speed and latency based on SPD data
- For industrial systems, BIOS settings may allow manual timing adjustments for performance tuning or thermal optimization
### 7. Performance & Capabilities
Speed and Bandwidth:
- Supports data transfer rates up to 12.8 GB/s (DDR3-1600)
- Optimized for stable operation across full temperature range
- Low latency and high throughput for real-time processing applications
Capacity and Scalability:
- 4GB capacity per module; multiple modules can be installed for higher total system memory
- Suitable for systems requiring moderate memory capacity with high reliability
Efficiency:
- Low power consumption due to DDR3 architecture and efficient signaling
- Reduced heat generation compared to earlier DDR2 modules
Limitations:
- Not compatible with DDR4 or DDR5 systems
- Performance limited by system memory controller and chipset capabilities
- Non-ECC version does not provide error correction for mission-critical data integrity (ECC variant recommended for such use cases)
Thermal and Environmental Performance:
- Designed for continuous operation in ambient temperatures from -40°C to +85°C
- Tested for thermal cycling, vibration, and humidity endurance
- Suitable for fanless or sealed enclosures where airflow is limited
### 8. Standards & Compliance
Industry Standards:
- JEDEC JESD79-3F DDR3 SDRAM standard compliance
- SO-DIMM mechanical and electrical interface per JEDEC MO-268 specification
Regulatory Compliance:
- RoHS (Restriction of Hazardous Substances): Fully compliant, lead-free construction
- REACH: Conforms to European chemical safety regulations
- WEEE: Designed for environmentally responsible disposal and recycling
- CE Marking: Meets applicable EU safety and EMC directives (depending on manufacturer certification)
Quality and Reliability Testing:
- 100% functional testing at extended temperature range
- Burn-in and stress testing for industrial-grade reliability
- ESD and surge protection validation
- Vibration and shock testing per industrial standards
### 9. Additional Information
Warranty:
- Typical warranty: 3 to 5 years (depending on manufacturer policy)
- Covers defects in materials and workmanship under normal operating conditions
Support:
- Technical documentation and datasheets available from manufacturer or distributor
- Application engineering support for system integration and compatibility verification
- Firmware or SPD configuration support for OEM customization
Maintenance:
- No active maintenance required; passive component with long operational lifespan
- Recommended periodic inspection for contact cleanliness in high-vibration environments
Lifecycle and Availability:
- Long-term availability guaranteed for industrial customers (typically 5–7 years)
- Stable BOM (Bill of Materials) policy to ensure consistent performance across production batches
Updates and Revisions:
- SPD firmware updates may be available for timing optimization or compatibility improvements
- Product revisions identified by updated part numbers or suffixes (e.g., 8GB-DDR3-ET-R1)
### Summary
The 8GB-DDR3-ET SO-DIMM DDR3 4GB Wide Temperature Memory Module is a robust, industrial-grade memory solution engineered for reliability, stability, and performance in demanding environments. With its wide operating temperature range of -40°C to +85°C, compact SO-DIMM form factor, and adherence to JEDEC DDR3 standards, it is ideally suited for embedded, industrial, and rugged computing applications. The module’s combination of 4GB capacity, low power consumption, and high data throughput ensures efficient operation in systems where space, thermal management, and reliability are critical.
Whether deployed in factory automation, transportation systems, or outdoor embedded devices, the 8GB-DDR3-ET delivers consistent performance and long-term dependability, making it a preferred choice for OEMs and system integrators seeking industrial-grade DDR3 memory solutions.
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