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- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module), ideal for compact systems such as industrial PCs, embedded controllers, and portable devices.
- Memory Type: DDR3L SDRAM (Double Data Rate Type 3, Low Voltage).
- Capacity: 4 GB per module, providing a balance between performance and energy efficiency.
- Voltage: Operates at 1.35 V, reducing power consumption compared to standard 1.5 V DDR3 modules.
- Wide Temperature Range: Rated for operation from -40°C to +85°C, ensuring stable performance in harsh environments such as outdoor, automotive, or industrial applications.
- High Reliability: Designed for continuous operation in mission-critical systems with enhanced thermal tolerance and robust signal integrity.
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of systems supporting DDR3L SO-DIMM memory.
- Energy Efficiency: Low-voltage operation minimizes heat generation and extends battery life in mobile or embedded systems.
- Compact Design: SO-DIMM form factor allows integration into space-constrained systems without compromising performance.
- Error-Free Operation: Non-ECC (unless otherwise specified), suitable for systems where ECC is not required but reliability remains critical.
- Memory Type: DDR3L SDRAM (Double Data Rate Type 3, Low Voltage).
- Capacity: 4 GB per module, providing a balance between performance and energy efficiency.
- Voltage: Operates at 1.35 V, reducing power consumption compared to standard 1.5 V DDR3 modules.
- Wide Temperature Range: Rated for operation from -40°C to +85°C, ensuring stable performance in harsh environments such as outdoor, automotive, or industrial applications.
- High Reliability: Designed for continuous operation in mission-critical systems with enhanced thermal tolerance and robust signal integrity.
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of systems supporting DDR3L SO-DIMM memory.
- Energy Efficiency: Low-voltage operation minimizes heat generation and extends battery life in mobile or embedded systems.
- Compact Design: SO-DIMM form factor allows integration into space-constrained systems without compromising performance.
- Error-Free Operation: Non-ECC (unless otherwise specified), suitable for systems where ECC is not required but reliability remains critical.
1. Product Overview
Product Name: 8GB-DDR3L-ET
Model / Article Number: 8GB-DDR3L-ET
Series: DDR3L SO-DIMM Wide Temperature Series
Manufacturer: [Manufacturer not specified – typically industrial memory module supplier]
Product Type: DDR3L SO-DIMM Memory Module
Capacity: 4 GB
Voltage: 1.35 V (Low Voltage DDR3L Standard)
Operating Temperature Range: -40°C to +85°C (Wide Temperature Range)
The 8GB-DDR3L-ET is a compact, low-voltage, wide-temperature SO-DIMM memory module designed for embedded, industrial, and rugged computing environments. It provides reliable performance under extreme thermal conditions and is optimized for systems requiring high stability, low power consumption, and extended operational life.
2. Key Features
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module), ideal for compact systems such as industrial PCs, embedded controllers, and portable devices.
- Memory Type: DDR3L SDRAM (Double Data Rate Type 3, Low Voltage).
- Capacity: 4 GB per module, providing a balance between performance and energy efficiency.
- Voltage: Operates at 1.35 V, reducing power consumption compared to standard 1.5 V DDR3 modules.
- Wide Temperature Range: Rated for operation from -40°C to +85°C, ensuring stable performance in harsh environments such as outdoor, automotive, or industrial applications.
- High Reliability: Designed for continuous operation in mission-critical systems with enhanced thermal tolerance and robust signal integrity.
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of systems supporting DDR3L SO-DIMM memory.
- Energy Efficiency: Low-voltage operation minimizes heat generation and extends battery life in mobile or embedded systems.
- Compact Design: SO-DIMM form factor allows integration into space-constrained systems without compromising performance.
- Error-Free Operation: Non-ECC (unless otherwise specified), suitable for systems where ECC is not required but reliability remains critical.
3. Technical Specifications
- Memory Type: DDR3L SDRAM
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB
- Voltage: 1.35 V (DDR3L standard, backward compatible with 1.5 V DDR3 systems if supported)
- Data Rate: Typically supports DDR3L-1333, DDR3L-1600, or DDR3L-1866 speeds (exact speed depends on system configuration and chipset support).
- Bus Width: 64-bit data bus
- Module Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 g per module
- Operating Temperature: -40°C to +85°C (wide temperature range)
- Storage Temperature: -55°C to +100°C (typical for industrial-grade modules)
- Signal Interface: SSTL_15 compatible signaling
- Refresh Rate: Auto-refresh and self-refresh supported
- PCB Layers: Multi-layer PCB design for improved signal integrity and thermal performance
- Compliance: JEDEC-compliant DDR3L standard (JESD79-3L)
4. Functionality
The 8GB-DDR3L-ET module functions as a volatile memory component that temporarily stores data for active processes in computing systems. It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal to achieve high throughput.
Use Cases and Applications:
- Industrial Automation: Controllers, PLCs, and HMIs operating in extended temperature environments.
- Embedded Systems: Single-board computers, gateways, and IoT edge devices requiring reliable memory under variable conditions.
- Transportation and Automotive: In-vehicle computing, infotainment systems, and telematics units exposed to temperature extremes.
- Defense and Aerospace: Ruggedized computing platforms and mission-critical systems.
- Networking Equipment: Routers, switches, and communication modules requiring stable memory performance.
- Medical Devices: Diagnostic and monitoring systems where reliability and low power consumption are essential.
Compatibility:
- Compatible with systems supporting DDR3L SO-DIMM memory modules.
- Backward compatible with DDR3 systems that support 1.35 V operation.
- Works with Intel and AMD chipsets designed for DDR3L memory.
5. Components & Accessories
Included Items:
- One (1) DDR3L SO-DIMM 4 GB memory module (8GB-DDR3L-ET).
Optional Add-ons / Accessories:
- Additional modules for dual-channel or multi-channel configurations.
- Anti-static packaging for ESD protection during handling and installation.
- Optional conformal coating or underfill (depending on manufacturer customization) for enhanced environmental protection.
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance.
- Standard SO-DIMM slot interface compatible with DDR3L sockets.
6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules.
- Ensure BIOS/firmware supports DDR3L voltage (1.35 V).
- Observe ESD precautions during handling and installation.
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retaining clips lock into place.
- Ensure proper orientation by aligning the notch on the module with the key in the socket.
Configuration:
- Memory speed and timing parameters are automatically detected via SPD (Serial Presence Detect) EEPROM.
- BIOS may allow manual configuration of memory frequency, timings, and voltage if required.
- For dual-channel operation, install matched pairs of modules in corresponding slots.
Environmental Considerations:
- Suitable for systems operating in environments with wide temperature fluctuations.
- Ensure adequate airflow or passive cooling if installed in sealed enclosures.
7. Performance & Capabilities
Speed:
- Supports DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Provides high bandwidth for multitasking and data-intensive applications.
Capacity:
- 4 GB per module, scalable depending on the number of available SO-DIMM slots.
Efficiency:
- Low-voltage operation (1.35 V) reduces power consumption by approximately 10–15% compared to standard DDR3 modules.
- Lower heat generation contributes to improved system thermal management and longevity.
Latency and Timing:
- Typical CAS latency (CL) values range from CL9 to CL11, depending on speed grade.
- Optimized for stable operation across the full temperature range.
Reliability:
- Industrial-grade components ensure consistent performance under vibration, shock, and thermal stress.
- Wide temperature tolerance minimizes risk of data corruption or instability in extreme conditions.
Limitations:
- Non-ECC memory; not suitable for systems requiring error correction.
- Performance dependent on system chipset and BIOS configuration.
8. Standards & Compliance
Industry Standards:
- JEDEC Standard JESD79-3L (DDR3L SDRAM specification).
- RoHS (Restriction of Hazardous Substances) compliant.
- REACH compliant (Registration, Evaluation, Authorization, and Restriction of Chemicals).
- CE and FCC conformity (depending on manufacturer certification).
- Halogen-free and lead-free construction (environmentally friendly design).
Regulatory Compliance:
- Meets industrial-grade quality and reliability standards.
- Manufactured under ISO 9001 and ISO 14001 certified processes (typical for industrial memory suppliers).
- ESD and EMC compliant for safe integration into electronic systems.
Environmental Standards:
- Designed for operation in extended temperature environments (-40°C to +85°C).
- Suitable for use in systems requiring compliance with industrial and automotive environmental standards.
9. Additional Information
Warranty:
- Typically includes a limited lifetime warranty or extended industrial warranty (duration may vary by manufacturer).
- Covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer.
- Customer support for integration, configuration, and troubleshooting.
Maintenance:
- No active maintenance required; ensure proper handling to avoid ESD damage.
- Periodic system diagnostics recommended to verify memory integrity.
Firmware / Updates:
- SPD data pre-programmed for plug-and-play operation.
- BIOS updates may enhance compatibility or performance in specific systems.
Reliability and Lifecycle:
- Designed for long-term availability and stable supply for industrial customers.
- High endurance and consistent performance across multiple thermal cycles.
Summary:
The 8GB-DDR3L-ET (SO-DIMM DDR3L 4GB 1.35V Wide Temperature) is a robust, energy-efficient memory module engineered for demanding industrial and embedded applications. Its wide operating temperature range (-40°C to +85°C), low-voltage operation, and compact SO-DIMM form factor make it ideal for systems requiring dependable performance in harsh or space-constrained environments. Fully compliant with JEDEC DDR3L standards and manufactured to industrial-grade quality, it offers a reliable solution for OEMs, system integrators, and engineers seeking stable, long-life memory components for mission-critical applications.
Product Name: 8GB-DDR3L-ET
Model / Article Number: 8GB-DDR3L-ET
Series: DDR3L SO-DIMM Wide Temperature Series
Manufacturer: [Manufacturer not specified – typically industrial memory module supplier]
Product Type: DDR3L SO-DIMM Memory Module
Capacity: 4 GB
Voltage: 1.35 V (Low Voltage DDR3L Standard)
Operating Temperature Range: -40°C to +85°C (Wide Temperature Range)
The 8GB-DDR3L-ET is a compact, low-voltage, wide-temperature SO-DIMM memory module designed for embedded, industrial, and rugged computing environments. It provides reliable performance under extreme thermal conditions and is optimized for systems requiring high stability, low power consumption, and extended operational life.
2. Key Features
- Form Factor: SO-DIMM (Small Outline Dual Inline Memory Module), ideal for compact systems such as industrial PCs, embedded controllers, and portable devices.
- Memory Type: DDR3L SDRAM (Double Data Rate Type 3, Low Voltage).
- Capacity: 4 GB per module, providing a balance between performance and energy efficiency.
- Voltage: Operates at 1.35 V, reducing power consumption compared to standard 1.5 V DDR3 modules.
- Wide Temperature Range: Rated for operation from -40°C to +85°C, ensuring stable performance in harsh environments such as outdoor, automotive, or industrial applications.
- High Reliability: Designed for continuous operation in mission-critical systems with enhanced thermal tolerance and robust signal integrity.
- Compatibility: Fully compliant with JEDEC DDR3L standards, ensuring interoperability with a wide range of systems supporting DDR3L SO-DIMM memory.
- Energy Efficiency: Low-voltage operation minimizes heat generation and extends battery life in mobile or embedded systems.
- Compact Design: SO-DIMM form factor allows integration into space-constrained systems without compromising performance.
- Error-Free Operation: Non-ECC (unless otherwise specified), suitable for systems where ECC is not required but reliability remains critical.
3. Technical Specifications
- Memory Type: DDR3L SDRAM
- Form Factor: 204-pin SO-DIMM
- Capacity: 4 GB
- Voltage: 1.35 V (DDR3L standard, backward compatible with 1.5 V DDR3 systems if supported)
- Data Rate: Typically supports DDR3L-1333, DDR3L-1600, or DDR3L-1866 speeds (exact speed depends on system configuration and chipset support).
- Bus Width: 64-bit data bus
- Module Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 g per module
- Operating Temperature: -40°C to +85°C (wide temperature range)
- Storage Temperature: -55°C to +100°C (typical for industrial-grade modules)
- Signal Interface: SSTL_15 compatible signaling
- Refresh Rate: Auto-refresh and self-refresh supported
- PCB Layers: Multi-layer PCB design for improved signal integrity and thermal performance
- Compliance: JEDEC-compliant DDR3L standard (JESD79-3L)
4. Functionality
The 8GB-DDR3L-ET module functions as a volatile memory component that temporarily stores data for active processes in computing systems. It operates synchronously with the system clock, transferring data on both the rising and falling edges of the clock signal to achieve high throughput.
Use Cases and Applications:
- Industrial Automation: Controllers, PLCs, and HMIs operating in extended temperature environments.
- Embedded Systems: Single-board computers, gateways, and IoT edge devices requiring reliable memory under variable conditions.
- Transportation and Automotive: In-vehicle computing, infotainment systems, and telematics units exposed to temperature extremes.
- Defense and Aerospace: Ruggedized computing platforms and mission-critical systems.
- Networking Equipment: Routers, switches, and communication modules requiring stable memory performance.
- Medical Devices: Diagnostic and monitoring systems where reliability and low power consumption are essential.
Compatibility:
- Compatible with systems supporting DDR3L SO-DIMM memory modules.
- Backward compatible with DDR3 systems that support 1.35 V operation.
- Works with Intel and AMD chipsets designed for DDR3L memory.
5. Components & Accessories
Included Items:
- One (1) DDR3L SO-DIMM 4 GB memory module (8GB-DDR3L-ET).
Optional Add-ons / Accessories:
- Additional modules for dual-channel or multi-channel configurations.
- Anti-static packaging for ESD protection during handling and installation.
- Optional conformal coating or underfill (depending on manufacturer customization) for enhanced environmental protection.
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance.
- Standard SO-DIMM slot interface compatible with DDR3L sockets.
6. Installation & Setup
Requirements:
- Compatible motherboard or system supporting DDR3L SO-DIMM modules.
- Ensure BIOS/firmware supports DDR3L voltage (1.35 V).
- Observe ESD precautions during handling and installation.
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retaining clips lock into place.
- Ensure proper orientation by aligning the notch on the module with the key in the socket.
Configuration:
- Memory speed and timing parameters are automatically detected via SPD (Serial Presence Detect) EEPROM.
- BIOS may allow manual configuration of memory frequency, timings, and voltage if required.
- For dual-channel operation, install matched pairs of modules in corresponding slots.
Environmental Considerations:
- Suitable for systems operating in environments with wide temperature fluctuations.
- Ensure adequate airflow or passive cooling if installed in sealed enclosures.
7. Performance & Capabilities
Speed:
- Supports DDR3L data rates up to 1600 MT/s (megatransfers per second), depending on system configuration.
- Provides high bandwidth for multitasking and data-intensive applications.
Capacity:
- 4 GB per module, scalable depending on the number of available SO-DIMM slots.
Efficiency:
- Low-voltage operation (1.35 V) reduces power consumption by approximately 10–15% compared to standard DDR3 modules.
- Lower heat generation contributes to improved system thermal management and longevity.
Latency and Timing:
- Typical CAS latency (CL) values range from CL9 to CL11, depending on speed grade.
- Optimized for stable operation across the full temperature range.
Reliability:
- Industrial-grade components ensure consistent performance under vibration, shock, and thermal stress.
- Wide temperature tolerance minimizes risk of data corruption or instability in extreme conditions.
Limitations:
- Non-ECC memory; not suitable for systems requiring error correction.
- Performance dependent on system chipset and BIOS configuration.
8. Standards & Compliance
Industry Standards:
- JEDEC Standard JESD79-3L (DDR3L SDRAM specification).
- RoHS (Restriction of Hazardous Substances) compliant.
- REACH compliant (Registration, Evaluation, Authorization, and Restriction of Chemicals).
- CE and FCC conformity (depending on manufacturer certification).
- Halogen-free and lead-free construction (environmentally friendly design).
Regulatory Compliance:
- Meets industrial-grade quality and reliability standards.
- Manufactured under ISO 9001 and ISO 14001 certified processes (typical for industrial memory suppliers).
- ESD and EMC compliant for safe integration into electronic systems.
Environmental Standards:
- Designed for operation in extended temperature environments (-40°C to +85°C).
- Suitable for use in systems requiring compliance with industrial and automotive environmental standards.
9. Additional Information
Warranty:
- Typically includes a limited lifetime warranty or extended industrial warranty (duration may vary by manufacturer).
- Covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer.
- Customer support for integration, configuration, and troubleshooting.
Maintenance:
- No active maintenance required; ensure proper handling to avoid ESD damage.
- Periodic system diagnostics recommended to verify memory integrity.
Firmware / Updates:
- SPD data pre-programmed for plug-and-play operation.
- BIOS updates may enhance compatibility or performance in specific systems.
Reliability and Lifecycle:
- Designed for long-term availability and stable supply for industrial customers.
- High endurance and consistent performance across multiple thermal cycles.
Summary:
The 8GB-DDR3L-ET (SO-DIMM DDR3L 4GB 1.35V Wide Temperature) is a robust, energy-efficient memory module engineered for demanding industrial and embedded applications. Its wide operating temperature range (-40°C to +85°C), low-voltage operation, and compact SO-DIMM form factor make it ideal for systems requiring dependable performance in harsh or space-constrained environments. Fully compliant with JEDEC DDR3L standards and manufactured to industrial-grade quality, it offers a reliable solution for OEMs, system integrators, and engineers seeking stable, long-life memory components for mission-critical applications.
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