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EGPU-3201-C2-A71

M.2 2280 to Dual USB3 Module
  • Manufacturer Innodisk
  • Category: mPCIe Modules
  • Innodisk Corporation 5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
- Form Factor Flexibility: Supports both M.2 2260 and 2280 B+M key configurations, allowing integration into a wide range of embedded and industrial systems.
- High-Speed Interface: Compliant with PCI Express Base Specification Revision 2.0, ensuring stable and efficient data transfer between the host and USB interface.
- USB 3.0 Compliance: Fully compliant with USB 3.0 Specification Revision 1.0, supporting data transfer rates up to 5 Gbps per port.
- xHCI 1.0 Compatibility: Supports Extensible Host Controller Interface (xHCI) 1.0, enabling native driver support in modern operating systems.
- Dual USB 3.0 Ports: Provides two independent USB 3.0 ports sharing a single PCIe Gen2 x1 bandwidth channel.
- Power Output:
- With external power input: up to 5V / 900mA per port
- Without external power: up to 200mA per port
- Robust Electrical Protection: Complies with EN61000-4-2 ESD protection standards:
- Air discharge: ±15kV
- Contact discharge: ±8kV
- Industrial Temperature Option: Available in standard (0°C to +70°C) and wide-temperature (-40°C to +85°C) variants for harsh environments.
- Compact Design: Slim M.2 2280 form factor (22 mm width) suitable for space-constrained embedded systems.
- Low Power Consumption: Maximum power draw of 1W (3.3V x 303mA), ideal for energy-efficient applications.
- Driver Support: Compatible with multiple operating systems, including Windows XP, 7, Vista, and Linux kernels v2.6.0 and above.

Country of origin: Taiwan R.O.C.

Customs tariff number: 8473 3020 000

Comprehensive Product Summary: Innodisk EGPU-3201-C2-A71 – M.2 2280 to Dual USB 3.0 Module




### 1. Product Overview

Product Name: M.2 2280 to Dual USB 3.0 Module
Model Number: EGPU-3201-C2-A71
Series: EGPU-3201 Series
Article Number: EGPU-3201-C2-A71
Manufacturer: Innodisk Corporation
Product Type: M.2 to Dual USB 3.0 Expansion Module
Product Category: Embedded Peripheral / Expansion Interface Module

Manufacturer Headquarters:
Innodisk Corporation
5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
Tel: +886-2-7703-3000
Email: sales@innodisk.com
Website: [www.innodisk.com](http://www.innodisk.com)

Regional Offices:
- USA: usasales@innodisk.com | +1-510-770-9421
- Europe: eusales@innodisk.com | +31-40-3045-400
- Japan: jpsales@innodisk.com | +81-3-6667-0161
- China: sales_cn@innodisk.com | +86-755-2167-3689

Release Date: October 27, 2021
Copyright: © 2020 Innodisk Corporation. All rights reserved. Specifications subject to change without notice.




### 2. Key Features

- Form Factor Flexibility: Supports both M.2 2260 and 2280 B+M key configurations, allowing integration into a wide range of embedded and industrial systems.
- High-Speed Interface: Compliant with PCI Express Base Specification Revision 2.0, ensuring stable and efficient data transfer between the host and USB interface.
- USB 3.0 Compliance: Fully compliant with USB 3.0 Specification Revision 1.0, supporting data transfer rates up to 5 Gbps per port.
- xHCI 1.0 Compatibility: Supports Extensible Host Controller Interface (xHCI) 1.0, enabling native driver support in modern operating systems.
- Dual USB 3.0 Ports: Provides two independent USB 3.0 ports sharing a single PCIe Gen2 x1 bandwidth channel.
- Power Output:
- With external power input: up to 5V / 900mA per port
- Without external power: up to 200mA per port
- Robust Electrical Protection: Complies with EN61000-4-2 ESD protection standards:
- Air discharge: ±15kV
- Contact discharge: ±8kV
- Industrial Temperature Option: Available in standard (0°C to +70°C) and wide-temperature (-40°C to +85°C) variants for harsh environments.
- Compact Design: Slim M.2 2280 form factor (22 mm width) suitable for space-constrained embedded systems.
- Low Power Consumption: Maximum power draw of 1W (3.3V x 303mA), ideal for energy-efficient applications.
- Driver Support: Compatible with multiple operating systems, including Windows XP, 7, Vista, and Linux kernels v2.6.0 and above.




### 3. Technical Specifications

| Parameter | Specification |
|----------------|-------------------|
| Form Factor | M.2 2260 / 2280 B+M Key |
| Input Interface | PCI Express 2.0 |
| Output Interface | USB 3.0 |
| Output Connector | 19-pin header |
| Power Consumption | Max 1W (3.3V x 303mA) |
| Dimensions (W x L x H) | 22.0 x 60.0 x 8.4 mm (M.2 2260) / 22.0 x 80.0 x 8.4 mm (M.2 2280) |
| Operating Temperature | Standard: 0°C ~ +70°C; Wide Temp: -40°C ~ +85°C |
| Storage Temperature | -55°C ~ +95°C |
| Vibration Resistance | 5G @ 7~2000Hz |
| Shock Resistance | 50G @ 0.5ms |
| USB Data Rate | Up to 5 Gbps (USB 3.0 SuperSpeed) |
| Power Output per Port | 5V / 900mA (with external power), 5V / 200mA (without external power) |
| ESD Protection | EN61000-4-2: Air ±15kV, Contact ±8kV |
| Compliance | PCIe 2.0, USB 3.0 Rev 1.0, xHCI 1.0 |
| Operating Systems Supported | Windows XP (32-bit), Windows 7 (32/64-bit), Windows Vista, Linux Kernel v2.6.0 / v2.6.8 and later |
| Driver Requirement | Downloadable from MyInnodisk website (not required for Win8+ or Linux Kernel v2.6.31+) |




### 4. Functionality

The Innodisk EGPU-3201-C2-A71 functions as a bridge module that converts an M.2 PCIe interface into dual USB 3.0 ports. It is designed for embedded systems, industrial PCs, and compact computing platforms that require additional USB connectivity without occupying standard motherboard USB headers.

How It Works:
- The module connects to the host system via an M.2 B+M key slot using the PCI Express 2.0 interface.
- Internally, it translates PCIe signals into USB 3.0 protocol through a compliant controller supporting xHCI 1.0.
- The two USB 3.0 ports share the PCIe Gen2 x1 bandwidth, providing high-speed data transfer for peripherals such as storage devices, cameras, or communication modules.
- External power input can be supplied to enhance current output capability for power-demanding USB devices.

Use Cases and Applications:
- Embedded computing systems requiring additional USB 3.0 ports
- Industrial automation controllers and gateways
- Edge computing and IoT devices
- Digital signage and kiosk systems
- Compact industrial PCs and fanless systems
- System integrators needing modular USB expansion

Compatibility:
- Compatible with M.2 B+M key slots supporting PCIe x1 lanes
- Works with standard USB 3.0 devices and backward compatible with USB 2.0/1.1 peripherals
- Supported by major operating systems with xHCI driver support




### 5. Components & Accessories

Included Items:
- EGPU-3201-C2-A71 M.2 2280 to Dual USB 3.0 Module
- 19-pin USB 3.0 header connector (onboard)
- Documentation and installation guide (digital or printed)

Optional Accessories:
- External power cable for enhanced USB power output
- Mounting screws for M.2 2260/2280 slots
- USB 3.0 header-to-dual Type-A cable (optional, depending on system configuration)

Connectors:
- Input: M.2 B+M key edge connector (PCIe 2.0 interface)
- Output: 19-pin USB 3.0 header supporting two USB 3.0 ports

USB 3.0 Pin Assignment (Summary):
| Signal | Pin | Pin | Signal |
|---------|-----|-----|--------|
| Vbus | 1 | 19 | Vbus |
| IntA_P1_SSRX- | 2 | 18 | IntA_P1_SSRX- |
| IntA_P1_SSRX+ | 3 | 17 | IntA_P2_SSRX+ |
| GND | 4 | 16 | GND |
| IntA_P1_SSTX- | 5 | 15 | IntA_P2_SSTX- |
| IntA_P1_SSTX+ | 6 | 14 | IntA_P2_SSTX+ |
| GND | 7 | 13 | GND |
| IntA_P1_D- | 8 | 12 | IntA_P2_D- |
| IntA_P1_D+ | 9 | 11 | IntA_P2_D+ |
| — | 10 | — | — |




### 6. Installation & Setup

Requirements:
- Host system with available M.2 B+M key slot supporting PCIe x1 interface
- Compatible operating system (Windows XP/7/Vista or Linux Kernel v2.6.0 and above)
- Optional external power source for full USB 3.0 power output

Mounting Options:
- Supports both M.2 2260 and M.2 2280 mounting holes
- Secured using standard M.2 screw and standoff
- Compact 8.4 mm height allows installation in low-profile enclosures

Configuration Steps:
1. Power off the host system.
2. Insert the EGPU-3201-C2-A71 module into the M.2 slot.
3. Secure the module with the appropriate screw (2260 or 2280 position).
4. Connect the 19-pin USB 3.0 header cable to the module.
5. Optionally connect external power input if higher current output is required.
6. Power on the system and install drivers if necessary (for older OS versions).
7. Verify USB ports functionality through the operating system’s device manager.

Driver Installation:
- For Windows XP, 7, and Vista: Download drivers from the MyInnodisk website.
- For Windows 8 and later or Linux Kernel v2.6.31 and above: No driver installation required (native xHCI support).




### 7. Performance & Capabilities

Data Transfer Performance:
- Each USB 3.0 port supports SuperSpeed (5 Gbps) data rate.
- Both ports share a single PCIe Gen2 x1 lane, providing a total theoretical bandwidth of 5 Gbps.

Power Delivery:
- With external power: up to 900mA per port, suitable for high-power USB devices such as external drives or cameras.
- Without external power: limited to 200mA per port, suitable for low-power peripherals.

Efficiency:
- Low power consumption (1W max) ensures minimal thermal output and efficient operation in embedded environments.
- Designed for continuous operation in industrial conditions with high vibration and shock resistance.

Limitations:
- Shared PCIe x1 bandwidth may limit simultaneous high-speed transfers on both ports.
- External power recommended for full USB 3.0 power compliance.

Reliability:
- Industrial-grade design with extended temperature range and ESD protection ensures long-term stability.
- Tested for vibration (5G) and shock (50G) endurance.




### 8. Standards & Compliance

Electrical and Interface Standards:
- PCI Express Base Specification Revision 2.0
- USB 3.0 Specification Revision 1.0
- xHCI 1.0 (Extensible Host Controller Interface)

Environmental and Safety Compliance:
- EN61000-4-2 (ESD Protection):
- Air Discharge: ±15kV
- Contact Discharge: ±8kV
- RoHS Compliant: Lead-free and environmentally friendly manufacturing process.

Mechanical and Environmental Testing:
- Vibration: 5G @ 7–2000Hz
- Shock: 50G @ 0.5ms
- Operating Temperature: 0°C to +70°C (standard), -40°C to +85°C (wide temperature)
- Storage Temperature: -55°C to +95°C

Industry Standards:
- Designed for embedded and industrial computing applications following global hardware interface standards.




### 9. Additional Information

Warranty:
- Standard manufacturer warranty (duration varies by region and distributor).
- Covers defects in materials and workmanship under normal use conditions.

Technical Support:
- Global support network through Innodisk regional offices.
- Online resources, datasheets, and driver downloads available at [www.innodisk.com](http://www.innodisk.com).

Maintenance:
- No regular maintenance required.
- Ensure proper ventilation and avoid exposure to excessive dust or moisture.
- Periodic inspection of connectors recommended for long-term reliability.

Firmware and Software Updates:
- Firmware updates provided via Innodisk support portal if applicable.
- Driver updates available for legacy operating systems through MyInnodisk.

Product Variants:
| Model | Form Factor | Temperature Range | Description |
|------------|----------------|-----------------------|-----------------|
| EGPU-3201-C1 | M.2 2260 | 0°C ~ +70°C | M.2 2260 to Dual USB 3.0 Module |
| EGPU-3201-W1 | M.2 2260 | -40°C ~ +85°C | M.2 2260 to Dual USB 3.0 Module (Wide Temp) |
| EGPU-3201-C2 | M.2 2280 | 0°C ~ +70°C | M.2 2280 to Dual USB 3.0 Module |
| EGPU-3201-W2 | M.2 2280 | -40°C ~ +85°C | M.2 2280 to Dual USB 3.0 Module (Wide Temp) |

Ordering Information:
- Part Number: EGPU-3201-C2-A71
- Description: M.2 2280 to Dual USB 3.0 Module
- Manufacturer: Innodisk Corporation




### Summary

The Innodisk EGPU-3201-C2-A71 is a compact, high-performance M.2 2280 to Dual USB 3.0 expansion module engineered for embedded and industrial computing applications. It bridges PCI Express 2.0 connectivity to dual USB 3.0 ports, offering up to 5 Gbps transfer speed per port. With robust ESD protection, low power consumption, and optional wide-temperature operation, it is ideal for mission-critical environments requiring reliable USB expansion in a small footprint.

Its compliance with PCIe 2.0, USB 3.0, and xHCI 1.0 standards ensures broad compatibility across modern operating systems and hardware platforms. The module’s mechanical durability, industrial-grade design, and flexible mounting options make it a versatile solution for system integrators and OEMs seeking dependable USB connectivity in embedded systems.

No accessories available.