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- Architecture: Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations.
- Core Configuration: Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads.
- Clock Speed: Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments.
- Cache: 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency.
- Integrated Graphics: Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz.
- Memory Support: Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems.
- Thermal Design Power (TDP): 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical.
- Socket Compatibility: LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170).
- Virtualization Support: Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments.
- Security Features: Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity.
- Display Capabilities: Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI.
- Energy Efficiency: Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.
- Core Configuration: Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads.
- Clock Speed: Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments.
- Cache: 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency.
- Integrated Graphics: Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz.
- Memory Support: Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems.
- Thermal Design Power (TDP): 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical.
- Socket Compatibility: LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170).
- Virtualization Support: Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments.
- Security Features: Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity.
- Display Capabilities: Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI.
- Energy Efficiency: Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.
1. Product Overview
Product Name: Intel® Core™ i3-6100TE Processor
Model: i3-6100TE
Series: 6th Generation Intel® Core™ Processors (Skylake Architecture)
Article Number: i3-6100TE
Manufacturer: Intel Corporation
The Intel® Core™ i3-6100TE is a dual-core desktop processor designed as part of Intel’s 6th Generation Core family, known under the codename *Skylake*. It is engineered for embedded, industrial, and energy-efficient computing environments that require a balance between performance and low power consumption. With a base frequency of 2.70 GHz and 4 MB of Intel® Smart Cache, the i3-6100TE delivers reliable multitasking and responsive performance for a wide range of applications, including digital signage, industrial automation, retail systems, and compact desktop PCs.
2. Key Features
- Architecture: Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations.
- Core Configuration: Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads.
- Clock Speed: Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments.
- Cache: 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency.
- Integrated Graphics: Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz.
- Memory Support: Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems.
- Thermal Design Power (TDP): 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical.
- Socket Compatibility: LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170).
- Virtualization Support: Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments.
- Security Features: Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity.
- Display Capabilities: Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI.
- Energy Efficiency: Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.
3. Technical Specifications
- Processor Number: i3-6100TE
- Cores / Threads: 2 cores / 4 threads
- Base Frequency: 2.70 GHz
- Cache: 4 MB Intel® Smart Cache
- Bus Speed: 8 GT/s DMI3
- Lithography: 14 nm process technology
- TDP: 35 W
- Socket Type: FCLGA1151
- Instruction Set: 64-bit
- Instruction Set Extensions: Intel® SSE4.1, SSE4.2, AVX2
- Scalability: 1S only (single-socket systems)
- Max Memory Size: 64 GB
- Memory Types: DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V
- Memory Channels: 2
- Max Memory Bandwidth: 34.1 GB/s
- ECC Memory Support: No
- Integrated Graphics: Intel® HD Graphics 530
- Base Frequency: 350 MHz
- Max Dynamic Frequency: 1.00 GHz
- Graphics Video Max Memory: 1.7 GB
- 4K Support: Yes, at 60 Hz
- Max Resolution (HDMI 1.4): 4096x2304 @ 24 Hz
- Max Resolution (DP): 4096x2304 @ 60 Hz
- Max Resolution (eDP - Integrated Flat Panel): 4096x2304 @ 60 Hz
- DirectX Support: 12
- OpenGL Support: 4.4
- Intel® Quick Sync Video, Intel® Clear Video HD Technology supported
- PCI Express Revision: 3.0
- PCI Express Configurations: Up to 1x16, 2x8, 1x8+2x4
- Max PCI Express Lanes: 16
- Package Size: 37.5 mm x 37.5 mm
- Weight: Approx. 25–30 g (processor only, without packaging)
- Thermal Solution Specification: PCG 2015C (requires compatible cooling solution)
4. Functionality
The Intel® Core™ i3-6100TE operates as a general-purpose CPU optimized for embedded and industrial computing. It integrates both CPU and GPU on a single die, enabling efficient processing and graphics rendering without the need for a discrete GPU in many use cases.
Use Cases and Applications:
- Industrial Automation: Reliable performance for control systems, programmable logic controllers (PLCs), and human-machine interfaces (HMIs).
- Digital Signage: Supports high-resolution video playback and multiple display outputs for advertising and information systems.
- Retail and Point-of-Sale (POS): Efficient operation in compact systems requiring consistent uptime and low power draw.
- Medical and Laboratory Equipment: Stable operation under continuous workloads with low thermal output.
- Embedded Systems: Ideal for fanless or small form factor designs where thermal and power constraints are critical.
- Office and Business PCs: Suitable for standard productivity tasks, web applications, and multimedia playback.
Compatibility:
Compatible with Intel® 100-series chipsets and motherboards using the LGA1151 socket. Supports Windows, Linux, and other x86-64 operating systems.
5. Components & Accessories
Included Items:
- Intel® Core™ i3-6100TE Processor (OEM or tray version)
- Documentation and warranty information (retail package only)
Optional Add-ons and Accessories:
- Compatible LGA1151 motherboard (H110, B150, Q170, etc.)
- Cooling solution (low-profile or standard heatsink/fan assembly compatible with PCG 2015C)
- DDR4 or DDR3L memory modules
- Storage devices (SSD/HDD)
- Power supply unit (PSU) with adequate 12V rail support
- Display cables (HDMI, DisplayPort, DVI)
Connectors and Interfaces:
- LGA1151 socket interface for CPU installation
- PCI Express 3.0 lanes for expansion cards
- Integrated graphics outputs via motherboard connectors (HDMI, DP, DVI, VGA depending on board design)
6. Installation & Setup
Requirements:
- Compatible LGA1151 motherboard with updated BIOS supporting 6th Gen Intel® Core™ processors
- Adequate cooling solution rated for 35 W TDP
- Proper thermal interface material (TIM) between CPU and heatsink
- Supported memory modules (DDR4 or DDR3L) installed in dual-channel configuration for optimal performance
Mounting Options:
- Standard desktop socket installation using LGA1151 retention mechanism
- Embedded or industrial boards with soldered or socketed CPU support
Configuration:
- BIOS/UEFI configuration for enabling virtualization, power management, and integrated graphics settings
- Operating system installation with Intel® chipset and graphics drivers
- Optional tuning of power profiles for energy efficiency or performance optimization
7. Performance & Capabilities
Processing Performance:
The i3-6100TE delivers solid dual-core performance with Hyper-Threading, allowing it to handle up to four concurrent threads efficiently. Its 2.70 GHz base frequency ensures consistent performance across workloads without dynamic turbo boost, making it predictable and stable for embedded applications.
Graphics Performance:
The integrated Intel® HD Graphics 530 provides sufficient power for 4K video playback, multi-display setups, and light 3D rendering. It supports hardware-accelerated video decoding and encoding, reducing CPU load during multimedia tasks.
Memory and I/O Performance:
Dual-channel memory architecture enhances data throughput, while PCIe 3.0 support ensures high-speed connectivity for expansion cards and peripherals.
Efficiency:
With a 35 W TDP, the processor is optimized for low-power operation, making it ideal for systems requiring continuous operation with minimal cooling.
Limitations:
- No Turbo Boost Technology (fixed frequency operation)
- No ECC memory support (not suitable for mission-critical error-sensitive applications)
- Limited to two physical cores (may not be ideal for highly parallel workloads)
8. Standards & Compliance
Certifications and Compliance:
- RoHS Compliant: Restriction of Hazardous Substances Directive compliance for environmental safety
- REACH Compliant: Conforms to EU chemical safety regulations
- Halogen-Free (depending on SKU): Designed for reduced environmental impact
- Industry Standards:
- PCI Express 3.0
- DDR4/DDR3L memory standards
- DirectX 12, OpenGL 4.4, OpenCL 2.0 graphics standards
- x86-64 instruction set architecture
Security and Virtualization Standards:
- Intel® Virtualization Technology (VT-x)
- Intel® Virtualization Technology for Directed I/O (VT-d)
- Intel® 64 Architecture
- Intel® AES New Instructions (AES-NI)
- Intel® Secure Key
- Intel® OS Guard
- Intel® Identity Protection Technology (Intel® IPT)
9. Additional Information
Warranty:
Typically covered under Intel’s standard 3-year limited warranty for boxed processors. OEM/tray versions may have different warranty terms depending on the distributor or integrator.
Support:
Intel provides extensive technical documentation, driver updates, and BIOS support through its official website and partner network. Developer resources and embedded design guides are available for system integrators.
Maintenance:
- Ensure adequate cooling and airflow to maintain thermal stability.
- Keep BIOS and chipset drivers updated for optimal compatibility and performance.
- Periodic cleaning of cooling components recommended for long-term reliability.
Product Lifecycle and Availability:
The i3-6100TE is part of Intel’s embedded product line with extended availability, ensuring long-term supply for industrial and embedded applications.
Software and Firmware Updates:
Intel regularly releases microcode updates to enhance security and stability. These updates are distributed through motherboard BIOS updates or operating system patches.
Summary
The Intel® Core™ i3-6100TE is a 6th Generation dual-core processor designed for embedded, industrial, and energy-efficient computing environments. With a 2.70 GHz base frequency, 4 MB Smart Cache, and integrated Intel® HD Graphics 530, it offers a balanced combination of performance, power efficiency, and reliability. Its 35 W TDP and LGA1151 compatibility make it ideal for compact systems, digital signage, and industrial control applications. Supporting modern instruction sets, virtualization, and advanced security features, the i3-6100TE remains a versatile and dependable choice for long-life embedded and desktop solutions.
Product Name: Intel® Core™ i3-6100TE Processor
Model: i3-6100TE
Series: 6th Generation Intel® Core™ Processors (Skylake Architecture)
Article Number: i3-6100TE
Manufacturer: Intel Corporation
The Intel® Core™ i3-6100TE is a dual-core desktop processor designed as part of Intel’s 6th Generation Core family, known under the codename *Skylake*. It is engineered for embedded, industrial, and energy-efficient computing environments that require a balance between performance and low power consumption. With a base frequency of 2.70 GHz and 4 MB of Intel® Smart Cache, the i3-6100TE delivers reliable multitasking and responsive performance for a wide range of applications, including digital signage, industrial automation, retail systems, and compact desktop PCs.
2. Key Features
- Architecture: Based on Intel’s 14 nm Skylake microarchitecture, offering improved performance-per-watt and enhanced integrated graphics compared to previous generations.
- Core Configuration: Dual-core, four-thread processor with Intel® Hyper-Threading Technology, enabling efficient parallel processing for multitasking workloads.
- Clock Speed: Fixed base frequency of 2.70 GHz, optimized for consistent performance in thermally constrained environments.
- Cache: 4 MB Intel® Smart Cache shared dynamically between cores for faster data access and reduced latency.
- Integrated Graphics: Intel® HD Graphics 530, supporting DirectX 12, OpenGL 4.4, and OpenCL 2.0, with a base frequency of 350 MHz and a maximum dynamic frequency up to 1.00 GHz.
- Memory Support: Dual-channel DDR4-2133/DDR3L-1600 memory support, up to 64 GB, providing flexibility for both legacy and modern systems.
- Thermal Design Power (TDP): 35 W, making it suitable for compact and fanless systems where thermal efficiency is critical.
- Socket Compatibility: LGA 1151 socket, compatible with Intel® 100-series chipsets (e.g., H110, Q170, B150, H170).
- Virtualization Support: Intel® VT-x and VT-d technologies for hardware-assisted virtualization and efficient resource allocation in virtualized environments.
- Security Features: Intel® AES-NI for accelerated encryption, Intel® Secure Key, and Intel® OS Guard for enhanced data protection and system integrity.
- Display Capabilities: Supports up to three independent displays with resolutions up to 4096x2304 @ 60 Hz via DisplayPort or HDMI.
- Energy Efficiency: Optimized for low-power embedded and industrial applications, maintaining performance while minimizing heat output.
3. Technical Specifications
- Processor Number: i3-6100TE
- Cores / Threads: 2 cores / 4 threads
- Base Frequency: 2.70 GHz
- Cache: 4 MB Intel® Smart Cache
- Bus Speed: 8 GT/s DMI3
- Lithography: 14 nm process technology
- TDP: 35 W
- Socket Type: FCLGA1151
- Instruction Set: 64-bit
- Instruction Set Extensions: Intel® SSE4.1, SSE4.2, AVX2
- Scalability: 1S only (single-socket systems)
- Max Memory Size: 64 GB
- Memory Types: DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V
- Memory Channels: 2
- Max Memory Bandwidth: 34.1 GB/s
- ECC Memory Support: No
- Integrated Graphics: Intel® HD Graphics 530
- Base Frequency: 350 MHz
- Max Dynamic Frequency: 1.00 GHz
- Graphics Video Max Memory: 1.7 GB
- 4K Support: Yes, at 60 Hz
- Max Resolution (HDMI 1.4): 4096x2304 @ 24 Hz
- Max Resolution (DP): 4096x2304 @ 60 Hz
- Max Resolution (eDP - Integrated Flat Panel): 4096x2304 @ 60 Hz
- DirectX Support: 12
- OpenGL Support: 4.4
- Intel® Quick Sync Video, Intel® Clear Video HD Technology supported
- PCI Express Revision: 3.0
- PCI Express Configurations: Up to 1x16, 2x8, 1x8+2x4
- Max PCI Express Lanes: 16
- Package Size: 37.5 mm x 37.5 mm
- Weight: Approx. 25–30 g (processor only, without packaging)
- Thermal Solution Specification: PCG 2015C (requires compatible cooling solution)
4. Functionality
The Intel® Core™ i3-6100TE operates as a general-purpose CPU optimized for embedded and industrial computing. It integrates both CPU and GPU on a single die, enabling efficient processing and graphics rendering without the need for a discrete GPU in many use cases.
Use Cases and Applications:
- Industrial Automation: Reliable performance for control systems, programmable logic controllers (PLCs), and human-machine interfaces (HMIs).
- Digital Signage: Supports high-resolution video playback and multiple display outputs for advertising and information systems.
- Retail and Point-of-Sale (POS): Efficient operation in compact systems requiring consistent uptime and low power draw.
- Medical and Laboratory Equipment: Stable operation under continuous workloads with low thermal output.
- Embedded Systems: Ideal for fanless or small form factor designs where thermal and power constraints are critical.
- Office and Business PCs: Suitable for standard productivity tasks, web applications, and multimedia playback.
Compatibility:
Compatible with Intel® 100-series chipsets and motherboards using the LGA1151 socket. Supports Windows, Linux, and other x86-64 operating systems.
5. Components & Accessories
Included Items:
- Intel® Core™ i3-6100TE Processor (OEM or tray version)
- Documentation and warranty information (retail package only)
Optional Add-ons and Accessories:
- Compatible LGA1151 motherboard (H110, B150, Q170, etc.)
- Cooling solution (low-profile or standard heatsink/fan assembly compatible with PCG 2015C)
- DDR4 or DDR3L memory modules
- Storage devices (SSD/HDD)
- Power supply unit (PSU) with adequate 12V rail support
- Display cables (HDMI, DisplayPort, DVI)
Connectors and Interfaces:
- LGA1151 socket interface for CPU installation
- PCI Express 3.0 lanes for expansion cards
- Integrated graphics outputs via motherboard connectors (HDMI, DP, DVI, VGA depending on board design)
6. Installation & Setup
Requirements:
- Compatible LGA1151 motherboard with updated BIOS supporting 6th Gen Intel® Core™ processors
- Adequate cooling solution rated for 35 W TDP
- Proper thermal interface material (TIM) between CPU and heatsink
- Supported memory modules (DDR4 or DDR3L) installed in dual-channel configuration for optimal performance
Mounting Options:
- Standard desktop socket installation using LGA1151 retention mechanism
- Embedded or industrial boards with soldered or socketed CPU support
Configuration:
- BIOS/UEFI configuration for enabling virtualization, power management, and integrated graphics settings
- Operating system installation with Intel® chipset and graphics drivers
- Optional tuning of power profiles for energy efficiency or performance optimization
7. Performance & Capabilities
Processing Performance:
The i3-6100TE delivers solid dual-core performance with Hyper-Threading, allowing it to handle up to four concurrent threads efficiently. Its 2.70 GHz base frequency ensures consistent performance across workloads without dynamic turbo boost, making it predictable and stable for embedded applications.
Graphics Performance:
The integrated Intel® HD Graphics 530 provides sufficient power for 4K video playback, multi-display setups, and light 3D rendering. It supports hardware-accelerated video decoding and encoding, reducing CPU load during multimedia tasks.
Memory and I/O Performance:
Dual-channel memory architecture enhances data throughput, while PCIe 3.0 support ensures high-speed connectivity for expansion cards and peripherals.
Efficiency:
With a 35 W TDP, the processor is optimized for low-power operation, making it ideal for systems requiring continuous operation with minimal cooling.
Limitations:
- No Turbo Boost Technology (fixed frequency operation)
- No ECC memory support (not suitable for mission-critical error-sensitive applications)
- Limited to two physical cores (may not be ideal for highly parallel workloads)
8. Standards & Compliance
Certifications and Compliance:
- RoHS Compliant: Restriction of Hazardous Substances Directive compliance for environmental safety
- REACH Compliant: Conforms to EU chemical safety regulations
- Halogen-Free (depending on SKU): Designed for reduced environmental impact
- Industry Standards:
- PCI Express 3.0
- DDR4/DDR3L memory standards
- DirectX 12, OpenGL 4.4, OpenCL 2.0 graphics standards
- x86-64 instruction set architecture
Security and Virtualization Standards:
- Intel® Virtualization Technology (VT-x)
- Intel® Virtualization Technology for Directed I/O (VT-d)
- Intel® 64 Architecture
- Intel® AES New Instructions (AES-NI)
- Intel® Secure Key
- Intel® OS Guard
- Intel® Identity Protection Technology (Intel® IPT)
9. Additional Information
Warranty:
Typically covered under Intel’s standard 3-year limited warranty for boxed processors. OEM/tray versions may have different warranty terms depending on the distributor or integrator.
Support:
Intel provides extensive technical documentation, driver updates, and BIOS support through its official website and partner network. Developer resources and embedded design guides are available for system integrators.
Maintenance:
- Ensure adequate cooling and airflow to maintain thermal stability.
- Keep BIOS and chipset drivers updated for optimal compatibility and performance.
- Periodic cleaning of cooling components recommended for long-term reliability.
Product Lifecycle and Availability:
The i3-6100TE is part of Intel’s embedded product line with extended availability, ensuring long-term supply for industrial and embedded applications.
Software and Firmware Updates:
Intel regularly releases microcode updates to enhance security and stability. These updates are distributed through motherboard BIOS updates or operating system patches.
Summary
The Intel® Core™ i3-6100TE is a 6th Generation dual-core processor designed for embedded, industrial, and energy-efficient computing environments. With a 2.70 GHz base frequency, 4 MB Smart Cache, and integrated Intel® HD Graphics 530, it offers a balanced combination of performance, power efficiency, and reliability. Its 35 W TDP and LGA1151 compatibility make it ideal for compact systems, digital signage, and industrial control applications. Supporting modern instruction sets, virtualization, and advanced security features, the i3-6100TE remains a versatile and dependable choice for long-life embedded and desktop solutions.
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