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- Processor Support: Intel® Core™ i7‑2710QE, i5‑2510E, i3‑2330E, and Celeron® B810 (Socket G2, rPGA988B package).
- Chipset: Intel® QM67 Express Chipset.
- Graphics: Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA).
- Memory: Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB.
- Storage: Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design.
- Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot (for SSD or wireless module)
- Networking: Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN.
- I/O Interfaces:
- 6 × USB 2.0 (2 front, 4 rear)
- 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485)
- 3 × Audio jacks (Mic‑in, Line‑in, Line‑out)
- Power Supply: 250 W FlexATX AC PSU (100–240 V AC input).
- Cooling: Dual 60 mm fans with replaceable air filters.
- Mounting: Wall‑mount brackets included; optional antenna hole for WLAN.
- Operating Temperature: 0 °C – 50 °C.
- Certifications: CE, FCC Class A, RoHS compliant.
- Form Factor: Compact 2U chassis (330 × 222 × 88 mm).
- Chipset: Intel® QM67 Express Chipset.
- Graphics: Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA).
- Memory: Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB.
- Storage: Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design.
- Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot (for SSD or wireless module)
- Networking: Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN.
- I/O Interfaces:
- 6 × USB 2.0 (2 front, 4 rear)
- 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485)
- 3 × Audio jacks (Mic‑in, Line‑in, Line‑out)
- Power Supply: 250 W FlexATX AC PSU (100–240 V AC input).
- Cooling: Dual 60 mm fans with replaceable air filters.
- Mounting: Wall‑mount brackets included; optional antenna hole for WLAN.
- Operating Temperature: 0 °C – 50 °C.
- Certifications: CE, FCC Class A, RoHS compliant.
- Form Factor: Compact 2U chassis (330 × 222 × 88 mm).
Comprehensive Product Summary: ADLINK MIX‑220‑NNN‑00 Embedded System Barebone
### 1. Product Overview
Product Name: MIX‑220 Embedded Computer System
Model: MIX‑220‑NNN‑00
Series: MIX‑220 Series (based on MI‑220 Mini‑ITX Industrial Motherboard)
Article Number: MIX‑220‑NNN‑00
Manufacturer: ADLINK Technology Inc.
Product Type: Compact fanless embedded computer barebone system (without CPU, RAM, or HDD)
Chassis Model: MK‑122
Riser Card: 2U‑E1S1
Power Supply: APS‑925XU FlexATX 250 W AC PSU
The ADLINK MIX‑220‑NNN‑00 is a modular embedded barebone system designed for industrial and embedded computing applications. It integrates the MI‑220 Mini‑ITX motherboard and provides a robust, compact, and configurable platform supporting Intel® Core™ i7/i5/i3 and Celeron® processors. The system is engineered for reliability, expandability, and long‑term operation in industrial environments.
### 2. Key Features
- Processor Support: Intel® Core™ i7‑2710QE, i5‑2510E, i3‑2330E, and Celeron® B810 (Socket G2, rPGA988B package).
- Chipset: Intel® QM67 Express Chipset.
- Graphics: Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA).
- Memory: Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB.
- Storage: Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design.
- Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot (for SSD or wireless module)
- Networking: Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN.
- I/O Interfaces:
- 6 × USB 2.0 (2 front, 4 rear)
- 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485)
- 3 × Audio jacks (Mic‑in, Line‑in, Line‑out)
- Power Supply: 250 W FlexATX AC PSU (100–240 V AC input).
- Cooling: Dual 60 mm fans with replaceable air filters.
- Mounting: Wall‑mount brackets included; optional antenna hole for WLAN.
- Operating Temperature: 0 °C – 50 °C.
- Certifications: CE, FCC Class A, RoHS compliant.
- Form Factor: Compact 2U chassis (330 × 222 × 88 mm).
### 3. Technical Specifications
Processor Options (supported):
- Intel® Core™ i7‑2710QE (2.1 GHz, 6 MB L2 Cache, 45 W TDP, 32 nm)
- Intel® Core™ i5‑2510E (2.5 GHz, 3 MB L2 Cache, 35 W TDP, 32 nm)
- Intel® Core™ i3‑2330E (2.2 GHz, 3 MB L2 Cache, 35 W TDP, 32 nm)
- Intel® Celeron® B810 (1.6 GHz, 2 MB L2 Cache, 35 W TDP, 32 nm)
Chipset: Intel® QM67 Express
BIOS: AMI 32 Mb SPI Flash
Memory: 2 × 204‑pin SO‑DIMM DDR3 1066/1333 MHz, up to 8 GB
Graphics: Integrated Intel® HD Graphics (CPU‑dependent)
Audio: Realtek ALC892 HD Audio Codec
Ethernet: 2 × GbE (Intel 82579LM + 82574L)
Watchdog Timer: 1–255 s/min programmable
Hardware Monitor: CPU temperature and voltage monitoring
External I/O Interfaces:
- Front: 2 × USB 2.0, Power and HDD LEDs, Power and Reset buttons
- Rear: 2 × RJ‑45 LAN, 4 × USB 2.0, 1 × VGA (DB‑15), 1 × DVI‑D, 1 × HDMI, 4 × Serial (DB‑9), 3 × Audio jacks, AC power input, PCI/PCIe slots
Storage:
- 2 × 2.5″ SATA 6 Gb/s drive bays (RAID 0/1 supported)
- 1 × SD card socket (up to 8 GB)
Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot
Power Supply:
- Input: 100–240 V AC (50/60 Hz)
- Output: 250 W FlexATX PSU
Mechanical:
- Dimensions: 330 mm (W) × 222 mm (D) × 88 mm (H)
- Weight: 4.35 kg (9.6 lb)
- Material: Steel chassis with anti‑shock drive mounts
Environmental:
- Operating Temperature: 0 °C to +50 °C
- Storage Temperature: –20 °C to +75 °C
- Relative Humidity: 10 % – 90 %, non‑condensing
### 4. Functionality
The MIX‑220‑NNN‑00 functions as a configurable embedded computing platform for industrial automation, digital signage, machine control, and data acquisition. It operates as a barebone system—users can install their preferred Intel® CPU, DDR3 memory, and storage devices.
Operation:
The MI‑220 Mini‑ITX motherboard provides the processing core, while the chassis integrates power, cooling, and I/O access. The system supports multiple display outputs for multi‑monitor setups and can interface with industrial equipment via serial ports and digital I/O. Dual GbE ports enable network redundancy or segmentation.
Use Cases:
- Industrial control and monitoring
- Machine vision and automation
- Digital signage and kiosk systems
- Transportation and fleet management
- Data logging and edge computing
Compatibility:
Supports Windows XP/7 (32/64‑bit), Fedora 14, and Red Hat Enterprise Linux 5. Drivers are available for chipset, LAN, audio, and RAID controllers.
### 5. Components & Accessories
Included Items:
- MIX‑220 barebone system (chassis with MI‑220 motherboard and 250 W PSU)
- Accessory kit (drive bay mounting hardware, wall‑mount brackets, AC power cord)
- Driver CD
- MI‑220 Quick Reference Guide
Optional Add‑ons:
- Intel® Core™ i7/i5/i3 or Celeron® CPU modules
- DDR3 SO‑DIMM memory (up to 8 GB)
- 2.5″ SATA HDD/SSD (up to 2 drives)
- Mini PCIe Wi‑Fi module (antenna hole provided)
- Additional riser cards or I/O modules
Connectors & Ports:
- VGA (DB‑15), DVI‑D, HDMI
- 6 × USB 2.0
- 4 × Serial (DB‑9)
- 2 × RJ‑45 LAN
- 3 × Audio jacks
- AC power input
### 6. Installation & Setup
Requirements:
- Compatible Intel® Socket G2 CPU
- DDR3 SO‑DIMM memory modules
- SATA storage devices
- Supported operating system
Mounting Options:
- Wall mount brackets (included)
- Rubber feet for desktop use
Configuration Steps:
1. Remove chassis cover (secured by two screws).
2. Install CPU into Socket G2 and lock securely.
3. Attach approved CPU cooler with thermal compound.
4. Install DDR3 SO‑DIMM modules (up to 8 GB).
5. Mount 2.5″ SATA drives using anti‑shock bracket and connect SATA cables.
6. Install PCIe/PCI expansion cards (max length 190 mm).
7. Connect peripherals to front/rear I/O ports.
8. Connect AC power cord and power on the system.
9. Install drivers from the provided CD or ADLINK website.
Driver Installation Sequence (Windows XP example):
1. Chipset driver → 2. Display driver → 3. LAN driver → 4. Audio driver → 5. RAID driver → 6. Management Engine driver.
### 7. Performance & Capabilities
Processing Performance:
Dependent on installed CPU model. The Core i7‑2710QE (quad‑core, 2.1 GHz) offers high multi‑thread performance for industrial applications, while the Celeron B810 provides a low‑power option.
Graphics Performance:
Integrated Intel® HD Graphics supports VGA, DVI‑D, and HDMI outputs for multi‑display configurations (up to three independent monitors).
Storage Performance:
SATA 6 Gb/s interfaces enable high‑speed SSD/HDD operation with RAID 0/1 support for redundancy or performance.
Networking:
Dual Gigabit Ethernet ports provide redundant or segmented network connectivity with Wake‑on‑LAN support.
Reliability & Cooling:
Dual 60 mm fans with replaceable filters ensure stable thermal management in industrial environments. Fan modules are easily removable for maintenance.
Limitations:
- No native USB 3.0 support (USB 2.0 only).
- Operating temperature limited to 0 °C – 50 °C.
- Barebone configuration requires user‑supplied CPU, RAM, and storage.
### 8. Standards & Compliance
- CE Certification: Conforms to European EMC and safety standards.
- FCC Class A: Complies with U.S. Federal Communications Commission requirements for industrial equipment.
- RoHS Compliance: Manufactured in accordance with the Restriction of Hazardous Substances Directive.
- WEEE Directive: Designed for environmentally responsible disposal and recycling.
- Quality Assurance: ADLINK manufacturing processes adhere to ISO 9001 standards.
### 9. Additional Information
Warranty & Support:
ADLINK provides standard limited warranty coverage for manufacturing defects. Technical support and RMA services are available through ADLINK’s global offices.
Maintenance:
- Regularly clean air filters and ensure unobstructed ventilation.
- Replace fans as needed to maintain cooling efficiency.
- Use only approved replacement parts and power supplies.
Software Updates:
BIOS and driver updates are available from [www.adlinktech.com](http://www.adlinktech.com). Users should periodically check for firmware revisions to ensure optimal performance and security.
Environmental Responsibility:
ADLINK is committed to sustainable manufacturing and compliance with global environmental standards. Products are designed for minimal environmental impact and safe end‑of‑life disposal.
Service Contacts:
ADLINK Technology Inc., 9F, No. 166 Jian Yi Road, Zhonghe District, New Taipei City 235, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com
Regional support available in the U.S., Europe, China, Japan, Korea, Singapore, and India.
### Summary
The ADLINK MIX‑220‑NNN‑00 is a versatile, industrial‑grade embedded barebone system built around the MI‑220 Mini‑ITX motherboard. It offers a balance of performance, expandability, and reliability for embedded and automation applications. With support for Intel® Core™ and Celeron® processors, dual Gigabit Ethernet, multiple display outputs, and comprehensive I/O interfaces, the MIX‑220 series delivers a robust platform for industrial control, data processing, and edge computing deployments.
Its modular design, wide I/O range, and industrial certifications make it suitable for OEM integration and long‑term operation in demanding environments.
### 1. Product Overview
Product Name: MIX‑220 Embedded Computer System
Model: MIX‑220‑NNN‑00
Series: MIX‑220 Series (based on MI‑220 Mini‑ITX Industrial Motherboard)
Article Number: MIX‑220‑NNN‑00
Manufacturer: ADLINK Technology Inc.
Product Type: Compact fanless embedded computer barebone system (without CPU, RAM, or HDD)
Chassis Model: MK‑122
Riser Card: 2U‑E1S1
Power Supply: APS‑925XU FlexATX 250 W AC PSU
The ADLINK MIX‑220‑NNN‑00 is a modular embedded barebone system designed for industrial and embedded computing applications. It integrates the MI‑220 Mini‑ITX motherboard and provides a robust, compact, and configurable platform supporting Intel® Core™ i7/i5/i3 and Celeron® processors. The system is engineered for reliability, expandability, and long‑term operation in industrial environments.
### 2. Key Features
- Processor Support: Intel® Core™ i7‑2710QE, i5‑2510E, i3‑2330E, and Celeron® B810 (Socket G2, rPGA988B package).
- Chipset: Intel® QM67 Express Chipset.
- Graphics: Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA).
- Memory: Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB.
- Storage: Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design.
- Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot (for SSD or wireless module)
- Networking: Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN.
- I/O Interfaces:
- 6 × USB 2.0 (2 front, 4 rear)
- 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485)
- 3 × Audio jacks (Mic‑in, Line‑in, Line‑out)
- Power Supply: 250 W FlexATX AC PSU (100–240 V AC input).
- Cooling: Dual 60 mm fans with replaceable air filters.
- Mounting: Wall‑mount brackets included; optional antenna hole for WLAN.
- Operating Temperature: 0 °C – 50 °C.
- Certifications: CE, FCC Class A, RoHS compliant.
- Form Factor: Compact 2U chassis (330 × 222 × 88 mm).
### 3. Technical Specifications
Processor Options (supported):
- Intel® Core™ i7‑2710QE (2.1 GHz, 6 MB L2 Cache, 45 W TDP, 32 nm)
- Intel® Core™ i5‑2510E (2.5 GHz, 3 MB L2 Cache, 35 W TDP, 32 nm)
- Intel® Core™ i3‑2330E (2.2 GHz, 3 MB L2 Cache, 35 W TDP, 32 nm)
- Intel® Celeron® B810 (1.6 GHz, 2 MB L2 Cache, 35 W TDP, 32 nm)
Chipset: Intel® QM67 Express
BIOS: AMI 32 Mb SPI Flash
Memory: 2 × 204‑pin SO‑DIMM DDR3 1066/1333 MHz, up to 8 GB
Graphics: Integrated Intel® HD Graphics (CPU‑dependent)
Audio: Realtek ALC892 HD Audio Codec
Ethernet: 2 × GbE (Intel 82579LM + 82574L)
Watchdog Timer: 1–255 s/min programmable
Hardware Monitor: CPU temperature and voltage monitoring
External I/O Interfaces:
- Front: 2 × USB 2.0, Power and HDD LEDs, Power and Reset buttons
- Rear: 2 × RJ‑45 LAN, 4 × USB 2.0, 1 × VGA (DB‑15), 1 × DVI‑D, 1 × HDMI, 4 × Serial (DB‑9), 3 × Audio jacks, AC power input, PCI/PCIe slots
Storage:
- 2 × 2.5″ SATA 6 Gb/s drive bays (RAID 0/1 supported)
- 1 × SD card socket (up to 8 GB)
Expansion:
- 1 × PCI Express x16 slot
- 1 × PCI slot (via riser card)
- 1 × Mini PCI Express slot
Power Supply:
- Input: 100–240 V AC (50/60 Hz)
- Output: 250 W FlexATX PSU
Mechanical:
- Dimensions: 330 mm (W) × 222 mm (D) × 88 mm (H)
- Weight: 4.35 kg (9.6 lb)
- Material: Steel chassis with anti‑shock drive mounts
Environmental:
- Operating Temperature: 0 °C to +50 °C
- Storage Temperature: –20 °C to +75 °C
- Relative Humidity: 10 % – 90 %, non‑condensing
### 4. Functionality
The MIX‑220‑NNN‑00 functions as a configurable embedded computing platform for industrial automation, digital signage, machine control, and data acquisition. It operates as a barebone system—users can install their preferred Intel® CPU, DDR3 memory, and storage devices.
Operation:
The MI‑220 Mini‑ITX motherboard provides the processing core, while the chassis integrates power, cooling, and I/O access. The system supports multiple display outputs for multi‑monitor setups and can interface with industrial equipment via serial ports and digital I/O. Dual GbE ports enable network redundancy or segmentation.
Use Cases:
- Industrial control and monitoring
- Machine vision and automation
- Digital signage and kiosk systems
- Transportation and fleet management
- Data logging and edge computing
Compatibility:
Supports Windows XP/7 (32/64‑bit), Fedora 14, and Red Hat Enterprise Linux 5. Drivers are available for chipset, LAN, audio, and RAID controllers.
### 5. Components & Accessories
Included Items:
- MIX‑220 barebone system (chassis with MI‑220 motherboard and 250 W PSU)
- Accessory kit (drive bay mounting hardware, wall‑mount brackets, AC power cord)
- Driver CD
- MI‑220 Quick Reference Guide
Optional Add‑ons:
- Intel® Core™ i7/i5/i3 or Celeron® CPU modules
- DDR3 SO‑DIMM memory (up to 8 GB)
- 2.5″ SATA HDD/SSD (up to 2 drives)
- Mini PCIe Wi‑Fi module (antenna hole provided)
- Additional riser cards or I/O modules
Connectors & Ports:
- VGA (DB‑15), DVI‑D, HDMI
- 6 × USB 2.0
- 4 × Serial (DB‑9)
- 2 × RJ‑45 LAN
- 3 × Audio jacks
- AC power input
### 6. Installation & Setup
Requirements:
- Compatible Intel® Socket G2 CPU
- DDR3 SO‑DIMM memory modules
- SATA storage devices
- Supported operating system
Mounting Options:
- Wall mount brackets (included)
- Rubber feet for desktop use
Configuration Steps:
1. Remove chassis cover (secured by two screws).
2. Install CPU into Socket G2 and lock securely.
3. Attach approved CPU cooler with thermal compound.
4. Install DDR3 SO‑DIMM modules (up to 8 GB).
5. Mount 2.5″ SATA drives using anti‑shock bracket and connect SATA cables.
6. Install PCIe/PCI expansion cards (max length 190 mm).
7. Connect peripherals to front/rear I/O ports.
8. Connect AC power cord and power on the system.
9. Install drivers from the provided CD or ADLINK website.
Driver Installation Sequence (Windows XP example):
1. Chipset driver → 2. Display driver → 3. LAN driver → 4. Audio driver → 5. RAID driver → 6. Management Engine driver.
### 7. Performance & Capabilities
Processing Performance:
Dependent on installed CPU model. The Core i7‑2710QE (quad‑core, 2.1 GHz) offers high multi‑thread performance for industrial applications, while the Celeron B810 provides a low‑power option.
Graphics Performance:
Integrated Intel® HD Graphics supports VGA, DVI‑D, and HDMI outputs for multi‑display configurations (up to three independent monitors).
Storage Performance:
SATA 6 Gb/s interfaces enable high‑speed SSD/HDD operation with RAID 0/1 support for redundancy or performance.
Networking:
Dual Gigabit Ethernet ports provide redundant or segmented network connectivity with Wake‑on‑LAN support.
Reliability & Cooling:
Dual 60 mm fans with replaceable filters ensure stable thermal management in industrial environments. Fan modules are easily removable for maintenance.
Limitations:
- No native USB 3.0 support (USB 2.0 only).
- Operating temperature limited to 0 °C – 50 °C.
- Barebone configuration requires user‑supplied CPU, RAM, and storage.
### 8. Standards & Compliance
- CE Certification: Conforms to European EMC and safety standards.
- FCC Class A: Complies with U.S. Federal Communications Commission requirements for industrial equipment.
- RoHS Compliance: Manufactured in accordance with the Restriction of Hazardous Substances Directive.
- WEEE Directive: Designed for environmentally responsible disposal and recycling.
- Quality Assurance: ADLINK manufacturing processes adhere to ISO 9001 standards.
### 9. Additional Information
Warranty & Support:
ADLINK provides standard limited warranty coverage for manufacturing defects. Technical support and RMA services are available through ADLINK’s global offices.
Maintenance:
- Regularly clean air filters and ensure unobstructed ventilation.
- Replace fans as needed to maintain cooling efficiency.
- Use only approved replacement parts and power supplies.
Software Updates:
BIOS and driver updates are available from [www.adlinktech.com](http://www.adlinktech.com). Users should periodically check for firmware revisions to ensure optimal performance and security.
Environmental Responsibility:
ADLINK is committed to sustainable manufacturing and compliance with global environmental standards. Products are designed for minimal environmental impact and safe end‑of‑life disposal.
Service Contacts:
ADLINK Technology Inc., 9F, No. 166 Jian Yi Road, Zhonghe District, New Taipei City 235, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com
Regional support available in the U.S., Europe, China, Japan, Korea, Singapore, and India.
### Summary
The ADLINK MIX‑220‑NNN‑00 is a versatile, industrial‑grade embedded barebone system built around the MI‑220 Mini‑ITX motherboard. It offers a balance of performance, expandability, and reliability for embedded and automation applications. With support for Intel® Core™ and Celeron® processors, dual Gigabit Ethernet, multiple display outputs, and comprehensive I/O interfaces, the MIX‑220 series delivers a robust platform for industrial control, data processing, and edge computing deployments.
Its modular design, wide I/O range, and industrial certifications make it suitable for OEM integration and long‑term operation in demanding environments.
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MIX-220_Datasheet_en_1.pdf
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