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- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset.
- Fanless Design: Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Graphics: Integrated Intel® HD Graphics 530 supporting dual independent displays.
- Display Interfaces: 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz.
- Expansion Capability:
- 1 × PCIe Gen3 x16 slot
- 3 × PCI 32‑bit slots
- 1 × Mini PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Options: 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket.
- Audio: 1 × Mic‑in and 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation).
- Mounting: Wall‑mount kit included.
- Construction: Rugged aluminum chassis for industrial environments.
- Software Support: Windows 10 / 7 / Embedded Standard 7 and Linux.
- Fanless Design: Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Graphics: Integrated Intel® HD Graphics 530 supporting dual independent displays.
- Display Interfaces: 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz.
- Expansion Capability:
- 1 × PCIe Gen3 x16 slot
- 3 × PCI 32‑bit slots
- 1 × Mini PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Options: 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket.
- Audio: 1 × Mic‑in and 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation).
- Mounting: Wall‑mount kit included.
- Construction: Rugged aluminum chassis for industrial environments.
- Software Support: Windows 10 / 7 / Embedded Standard 7 and Linux.
Comprehensive Product Summary – ADLINK MVP‑6012 Fanless Embedded Computer
### 1. Product Overview
Product Name: MVP‑6012
Model: MVP‑6012
Series: MVP‑6010 / 6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6012
Manufacturer: ADLINK Technology, Inc.
Part Number: 50‑1Z214‑1000
Revision: 1.0 (June 23, 2017)
The ADLINK MVP‑6012 is a rugged, fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 series, a cost‑effective line of fanless systems built around 6th Generation Intel® Core™ processors (Skylake architecture) and Intel® H110 chipset. The MVP‑6012 integrates an Intel® Core™ i5‑6500TE processor, providing high performance, energy efficiency, and long‑term reliability in harsh industrial environments.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset.
- Fanless Design: Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Graphics: Integrated Intel® HD Graphics 530 supporting dual independent displays.
- Display Interfaces: 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz.
- Expansion Capability:
- 1 × PCIe Gen3 x16 slot
- 3 × PCI 32‑bit slots
- 1 × Mini PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Options: 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket.
- Audio: 1 × Mic‑in and 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation).
- Mounting: Wall‑mount kit included.
- Construction: Rugged aluminum chassis for industrial environments.
- Software Support: Windows 10 / 7 / Embedded Standard 7 and Linux.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i5‑6500TE (Skylake, 4 cores, 2.3 GHz, 35 W TDP) |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Max Resolution | DisplayPort 4096 × 2304 @ 60 Hz; DVI‑D 1920 × 1200 @ 60 Hz; VGA 1920 × 1080 @ 60 Hz |
| Expansion Slots | 1 × PCIe Gen3 x16, 3 × PCI 32‑bit, 1 × Mini PCIe (Full size) |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × DB9 (COM1–4): 2 × RS‑232/422/485 (BIOS selectable) + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0 + 2 × USB 2.0 (external) + 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL) + 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD + 1 × Type II CFast socket |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector with latch) |
| Optional AC Adapter | 160 W industrial grade AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation) |
| Storage Temperature | −40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration Resistance | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock Resistance | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6012 operates as a high‑performance embedded controller for industrial automation and edge computing. Its fanless architecture ensures reliable operation in dusty or vibration‑prone environments. The system’s Intel® Core™ i5‑6500TE CPU delivers strong multi‑threaded performance for real‑time control, data acquisition, and machine vision tasks.
Typical Applications:
- Factory automation and process control
- Machine vision and inspection systems
- Motion control and robotics
- Industrial networking gateways
- Surveillance and security systems
- Edge computing and data logging
Compatibility:
- Operating Systems: Windows 10 / 7 / Embedded Standard 7, Linux
- Supports PCI/PCIe Gen3 cards, Mini PCIe modules, and standard USB devices.
- Dual independent display output for HMI or monitoring.
### 5. Components & Accessories
Included Items:
- MVP‑6012 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory upgrades (8 GB / 16 GB / 32 GB)
- 500 GB / 1 TB HDD or 64 GB SSD (pre‑installed options)
- 160 W AC‑DC adapter for AC input operation
Connectors:
- Front panel I/O includes DisplayPort × 2, DVI‑D, VGA, USB 2.0 × 2, USB 3.0 × 4, 3 × GbE, 4 × COM, 8 DI/8 DO, audio jacks, and DC power input.
- Internal connectors for Mini PCIe, USIM, SATA, USB 2.0, fan headers (9 V and 12 V), and power headers (+5 V / +12 V).
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC power supply (160 W recommended).
- Stable mounting surface or wall mount brackets (included).
- Adequate ventilation for passive heat dissipation.
Mounting Options:
- Wall‑mount: Two configurations – underside or left‑side mounting using M4 screws and brackets.
- Surface deployment: Upright or side orientation on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast).
2. Install PCI/PCIe expansion cards if required.
3. Connect power input and I/O devices.
4. Power on and enter BIOS (DEL key) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
### 7. Performance & Capabilities
| Mode | Power Consumption (24 V DC) |
|-----------|--------------------------------|
| Power Off | 2.9 W |
| System Idle | 18.26 W |
| Full Load (100 % CPU + I/O activity) | 52.18 W |
| Recommended Power Supply | 160 W DC adapter |
Performance Highlights:
- Supports up to 65 W CPU TDP in fanless operation (0 – 40 °C).
- High I/O bandwidth with PCIe Gen3 and USB 3.0.
- Triple Gigabit Ethernet with teaming for network redundancy and load balancing.
- Dual independent display support for multi‑monitor applications.
- Reliable operation under vibration (5 Grms) and shock (100 Grms).
Limitations:
- Operating temperature limited to 50 °C for 35 W CPU and 40 °C for 65 W CPU.
- HDD operation not recommended beyond 40 °C due to thermal constraints.
### 8. Standards & Compliance
- EMC: CE & FCC Class A
- Safety: UL/cUL, CB, CCC
- Environmental: RoHS and WEEE compliant
- ESD Protection: ±4 kV (contact), ±8 kV (air)
- Vibration & Shock: 5 Grms / 100 Grms tested to industrial standards
- Reliability: Fanless design enhances MTBF and reduces maintenance requirements.
ADLINK emphasizes environmental responsibility through compliance with RoHS and WEEE directives, ensuring minimal environmental impact throughout the product life cycle.
### 9. Additional Information
Warranty & Support:
- Standard manufacturer warranty (terms vary by region).
- Technical support available via ADLINK’s “Ask an Expert” portal and regional offices.
- BIOS and driver updates available at [www.adlinktech.com](https://www.adlinktech.com).
Maintenance:
- Fanless design minimizes dust accumulation and mechanical wear.
- Periodic inspection of connectors and power input recommended.
- Replace storage devices and memory modules as needed for system upgrades.
BIOS Features:
- Advanced configuration for CPU, memory, graphics, and power management.
- Watchdog Timer (WDT) support for system recovery in critical applications.
- Digital I/O API libraries for Windows and Linux integration.
Environmental and Safety Notes:
- Operate within specified temperature and humidity ranges.
- Ensure proper grounding and stable DC power supply.
- Avoid mounting with ventilation holes facing up or down to maintain thermal efficiency.
Manufacturer Contact:
- ADLINK Technology, Inc. – New Taipei City, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com
- ADLINK USA: San Jose, CA
### 1. Product Overview
Product Name: MVP‑6012
Model: MVP‑6012
Series: MVP‑6010 / 6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6012
Manufacturer: ADLINK Technology, Inc.
Part Number: 50‑1Z214‑1000
Revision: 1.0 (June 23, 2017)
The ADLINK MVP‑6012 is a rugged, fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 series, a cost‑effective line of fanless systems built around 6th Generation Intel® Core™ processors (Skylake architecture) and Intel® H110 chipset. The MVP‑6012 integrates an Intel® Core™ i5‑6500TE processor, providing high performance, energy efficiency, and long‑term reliability in harsh industrial environments.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset.
- Fanless Design: Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance.
- Memory: Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz.
- Graphics: Integrated Intel® HD Graphics 530 supporting dual independent displays.
- Display Interfaces: 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz.
- Expansion Capability:
- 1 × PCIe Gen3 x16 slot
- 3 × PCI 32‑bit slots
- 1 × Mini PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication: 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232).
- Digital I/O: 8‑channel digital input and 8‑channel digital output (non‑isolated).
- USB Connectivity: 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Options: 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket.
- Audio: 1 × Mic‑in and 1 × Line‑out.
- Power Input: Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch.
- Operating Temperature: 0 °C – 50 °C (fanless operation).
- Mounting: Wall‑mount kit included.
- Construction: Rugged aluminum chassis for industrial environments.
- Software Support: Windows 10 / 7 / Embedded Standard 7 and Linux.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i5‑6500TE (Skylake, 4 cores, 2.3 GHz, 35 W TDP) |
| Chipset | Intel® H110 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Intel® HD Graphics 530 |
| Display Outputs | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Max Resolution | DisplayPort 4096 × 2304 @ 60 Hz; DVI‑D 1920 × 1200 @ 60 Hz; VGA 1920 × 1080 @ 60 Hz |
| Expansion Slots | 1 × PCIe Gen3 x16, 3 × PCI 32‑bit, 1 × Mini PCIe (Full size) |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × DB9 (COM1–4): 2 × RS‑232/422/485 (BIOS selectable) + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0 + 2 × USB 2.0 (external) + 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL) + 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD + 1 × Type II CFast socket |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector with latch) |
| Optional AC Adapter | 160 W industrial grade AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation) |
| Storage Temperature | −40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration Resistance | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock Resistance | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6012 operates as a high‑performance embedded controller for industrial automation and edge computing. Its fanless architecture ensures reliable operation in dusty or vibration‑prone environments. The system’s Intel® Core™ i5‑6500TE CPU delivers strong multi‑threaded performance for real‑time control, data acquisition, and machine vision tasks.
Typical Applications:
- Factory automation and process control
- Machine vision and inspection systems
- Motion control and robotics
- Industrial networking gateways
- Surveillance and security systems
- Edge computing and data logging
Compatibility:
- Operating Systems: Windows 10 / 7 / Embedded Standard 7, Linux
- Supports PCI/PCIe Gen3 cards, Mini PCIe modules, and standard USB devices.
- Dual independent display output for HMI or monitoring.
### 5. Components & Accessories
Included Items:
- MVP‑6012 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory upgrades (8 GB / 16 GB / 32 GB)
- 500 GB / 1 TB HDD or 64 GB SSD (pre‑installed options)
- 160 W AC‑DC adapter for AC input operation
Connectors:
- Front panel I/O includes DisplayPort × 2, DVI‑D, VGA, USB 2.0 × 2, USB 3.0 × 4, 3 × GbE, 4 × COM, 8 DI/8 DO, audio jacks, and DC power input.
- Internal connectors for Mini PCIe, USIM, SATA, USB 2.0, fan headers (9 V and 12 V), and power headers (+5 V / +12 V).
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC power supply (160 W recommended).
- Stable mounting surface or wall mount brackets (included).
- Adequate ventilation for passive heat dissipation.
Mounting Options:
- Wall‑mount: Two configurations – underside or left‑side mounting using M4 screws and brackets.
- Surface deployment: Upright or side orientation on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast).
2. Install PCI/PCIe expansion cards if required.
3. Connect power input and I/O devices.
4. Power on and enter BIOS (DEL key) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
### 7. Performance & Capabilities
| Mode | Power Consumption (24 V DC) |
|-----------|--------------------------------|
| Power Off | 2.9 W |
| System Idle | 18.26 W |
| Full Load (100 % CPU + I/O activity) | 52.18 W |
| Recommended Power Supply | 160 W DC adapter |
Performance Highlights:
- Supports up to 65 W CPU TDP in fanless operation (0 – 40 °C).
- High I/O bandwidth with PCIe Gen3 and USB 3.0.
- Triple Gigabit Ethernet with teaming for network redundancy and load balancing.
- Dual independent display support for multi‑monitor applications.
- Reliable operation under vibration (5 Grms) and shock (100 Grms).
Limitations:
- Operating temperature limited to 50 °C for 35 W CPU and 40 °C for 65 W CPU.
- HDD operation not recommended beyond 40 °C due to thermal constraints.
### 8. Standards & Compliance
- EMC: CE & FCC Class A
- Safety: UL/cUL, CB, CCC
- Environmental: RoHS and WEEE compliant
- ESD Protection: ±4 kV (contact), ±8 kV (air)
- Vibration & Shock: 5 Grms / 100 Grms tested to industrial standards
- Reliability: Fanless design enhances MTBF and reduces maintenance requirements.
ADLINK emphasizes environmental responsibility through compliance with RoHS and WEEE directives, ensuring minimal environmental impact throughout the product life cycle.
### 9. Additional Information
Warranty & Support:
- Standard manufacturer warranty (terms vary by region).
- Technical support available via ADLINK’s “Ask an Expert” portal and regional offices.
- BIOS and driver updates available at [www.adlinktech.com](https://www.adlinktech.com).
Maintenance:
- Fanless design minimizes dust accumulation and mechanical wear.
- Periodic inspection of connectors and power input recommended.
- Replace storage devices and memory modules as needed for system upgrades.
BIOS Features:
- Advanced configuration for CPU, memory, graphics, and power management.
- Watchdog Timer (WDT) support for system recovery in critical applications.
- Digital I/O API libraries for Windows and Linux integration.
Environmental and Safety Notes:
- Operate within specified temperature and humidity ranges.
- Ensure proper grounding and stable DC power supply.
- Avoid mounting with ventilation holes facing up or down to maintain thermal efficiency.
Manufacturer Contact:
- ADLINK Technology, Inc. – New Taipei City, Taiwan
Tel: +886‑2‑8226‑5877 Email: service@adlinktech.com
- ADLINK USA: San Jose, CA
No accessories available.
