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- Processor Platform:
6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU.
Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series.
- Chipset:
Intel® H110 Express chipset (MVP‑6010 series).
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards.
1 × Mini‑PCIe slot with USIM socket for wireless or communication modules.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support.
- Serial Communication:
4 × COM ports (DB‑9):
- 2 × software‑selectable RS‑232/422/485 (COM1, COM2)
- 2 × RS‑232 (COM3, COM4)
- RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel.
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable).
- Storage Options:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
Optional 160 W AC‑DC adapter for AC input.
- Mechanical Design:
Fanless aluminum chassis with front‑accessible I/O for simplified maintenance.
Wall‑mount kit included.
- Operating Environment:
Fanless operation from 0 °C to 50 °C (with 35 W CPU).
Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast).
Humidity: 95 % @ 40 °C (non‑condensing).
6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU.
Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series.
- Chipset:
Intel® H110 Express chipset (MVP‑6010 series).
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards.
1 × Mini‑PCIe slot with USIM socket for wireless or communication modules.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support.
- Serial Communication:
4 × COM ports (DB‑9):
- 2 × software‑selectable RS‑232/422/485 (COM1, COM2)
- 2 × RS‑232 (COM3, COM4)
- RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel.
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable).
- Storage Options:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
Optional 160 W AC‑DC adapter for AC input.
- Mechanical Design:
Fanless aluminum chassis with front‑accessible I/O for simplified maintenance.
Wall‑mount kit included.
- Operating Environment:
Fanless operation from 0 °C to 50 °C (with 35 W CPU).
Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast).
Humidity: 95 % @ 40 °C (non‑condensing).
Comprehensive Product Summary – ADLINK MVP‑6013 Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MVP‑6013
Model: MVP‑6013
Series: MVP‑6010 / 6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6013
Manufacturer: ADLINK Technology, Inc.
The ADLINK MVP‑6013 is a rugged, fanless, and expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 Value Series, which combines high performance, cost efficiency, and robust mechanical design. The MVP‑6013 integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® H110 chipset, providing a balance of computing power and energy efficiency in a compact, fanless chassis.
### 2. Key Features
- Processor Platform:
6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU.
Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series.
- Chipset:
Intel® H110 Express chipset (MVP‑6010 series).
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards.
1 × Mini‑PCIe slot with USIM socket for wireless or communication modules.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support.
- Serial Communication:
4 × COM ports (DB‑9):
- 2 × software‑selectable RS‑232/422/485 (COM1, COM2)
- 2 × RS‑232 (COM3, COM4)
- RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel.
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable).
- Storage Options:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
Optional 160 W AC‑DC adapter for AC input.
- Mechanical Design:
Fanless aluminum chassis with front‑accessible I/O for simplified maintenance.
Wall‑mount kit included.
- Operating Environment:
Fanless operation from 0 °C to 50 °C (with 35 W CPU).
Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast).
Humidity: 95 % @ 40 °C (non‑condensing).
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, 2 cores / 4 threads, 2.7 GHz, 35 W TDP |
| Chipset | Intel® H110 Express |
| Graphics | Intel® HD Graphics 530, supports dual independent displays |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Expansion Slots | 1 × PCIe Gen3 x16, 3 × PCI 32‑bit, 1 × Mini‑PCIe with USIM socket |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB‑9): 2 × RS‑232/422/485 + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Power Input | 12 – 24 V DC (3‑pin connector with latch) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temp. | 0 °C to 50 °C (fanless operation) |
| Storage Temp. | –40 °C to 85 °C (excl. HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD | ±4 kV contact, ±8 kV air |
| EMC | CE & FCC Class A |
| Safety | UL/cUL, CB, CCC certified |
### 4. Functionality
The MVP‑6013 operates as a high‑reliability embedded controller for industrial and automation environments. Its fanless design ensures silent operation and resistance to dust and vibration. The system’s Intel® Core™ i3‑6100TE CPU delivers strong computing and graphics performance for real‑time control, data acquisition, and visualization tasks.
Typical Applications:
- Machine vision and inspection systems
- Industrial automation and process control
- Motion control and robotics
- Intelligent surveillance and security systems
- Data logging and edge computing gateways
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, and Linux.
- Supports standard PCI/PCIe Gen3 cards, USB devices, and Ethernet networks.
### 5. Components & Accessories
Included Items:
- MVP‑6013 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory modules (8 GB / 16 GB / 32 GB options)
- Factory‑installed 500 GB or 1 TB HDD
- Factory‑installed 64 GB MLC SATA SSD
- 160 W industrial‑grade AC‑DC adapter
Connectors:
- Front panel: 2 × DisplayPort, 1 × DVI‑D, 1 × VGA, 4 × USB 3.0, 2 × USB 2.0, 3 × RJ‑45 GbE, 4 × COM, 8 × DI, 8 × DO, audio jacks, DC power input.
- Internal: Mini‑PCIe, USIM slot, SATA connector, USB 2.0 header, fan connectors (9 V and 12 V), clear CMOS jumper, extended PWR/RESET header, +5 V and +12 V auxiliary power header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (V+, GND, V–). Ensure stable and low‑noise DC supply. Optional 160 W AC‑DC adapter available.
Mounting Options:
- Wall‑mount brackets included for underside or side installation.
- Can also be deployed upright on a stable surface.
- Maintain adequate ventilation and avoid blocking air vents.
Storage Device Installation:
Supports 2.5″ HDD/SSD via SATA III and CFast card installation through rear panel socket.
Expansion Card Installation:
Remove bottom cover to install PCI or PCIe cards. Align cards with guides and secure with screws.
Driver Installation:
Download drivers from [www.adlinktech.com](http://www.adlinktech.com): chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and serial I/O drivers.
### 7. Performance & Capabilities
Computing Performance:
- Intel® Core™ i3‑6100TE dual‑core processor (2.7 GHz) with Intel® HD Graphics 530.
- Supports hardware virtualization (VT‑x, VT‑d) and AES‑NI encryption.
- Dual‑channel DDR4 memory architecture for high bandwidth.
Graphics Performance:
- Intel® HD Graphics 530 supports DirectX 12 and OpenGL 4.4.
- Dual independent display output for multi‑monitor applications.
Network Performance:
- Three Intel® I211AT controllers support IEEE 802.3az Energy Efficient Ethernet, IEEE 1588 time synchronization, VLAN, jumbo frames, and PXE boot.
- Teaming function enables link aggregation and redundancy.
Power Consumption (24 V DC input):
- Power off: 2.9 W
- System idle: 17.9 W
- Full load: 50.66 W
- Recommended power supply: 160 W
Reliability & Durability:
- Fanless design eliminates moving parts, enhancing MTBF.
- Withstands vibration up to 5 Grms and shock up to 100 Grms.
- ESD protection ±4 kV (contact), ±8 kV (air).
Limitations:
- Operating temperature limited to 50 °C for 35 W CPU (40 °C for 65 W CPU).
- Add‑on cards may require additional cooling or power budget consideration.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, CCC certified.
- Environmental: RoHS and WEEE compliant.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az, 802.1AS, 802.1Qav.
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes.
### 9. Additional Information
Warranty & Support:
ADLINK provides standard warranty coverage and technical support through regional offices and the Ask an Expert portal ([http://askanexpert.adlinktech.com](http://askanexpert.adlinktech.com)). Firmware and BIOS updates are available on the official website.
Maintenance:
- Clean externally with dry cloth; avoid liquids and abrasives.
- Ensure adequate ventilation and dust‑free environment.
- Replace storage devices and memory modules only with qualified components.
- Optional fan module recommended for high‑temperature operation.
BIOS Features:
- AMI UEFI BIOS with configurable boot options, watchdog timer, and power management.
- Supports Intel® SpeedStep™, Hyper‑Threading, and virtualization technologies.
- Watchdog Timer (WDT) API available for Windows and Linux for system recovery automation.
Environmental Responsibility:
Compliant with EU RoHS and WEEE directives. ADLINK encourages proper recycling and disposal of electronic equipment at end of life.
Service Contacts:
- ADLINK Technology, Inc. (New Taipei City, Taiwan) Tel: +886‑2‑8226‑5877
- Ampro ADLINK Technology, Inc. (San Jose, USA) Tel: +1‑408‑360‑0200
- ADLINK Technology (China) Co., Ltd. (Shanghai, China) Tel: +86‑21‑5132‑8988
- LiPPERT ADLINK Technology GmbH (Mannheim, Germany) Tel: +49‑621‑43214‑0
### Summary
The ADLINK MVP‑6013 is a robust, fanless, and expandable embedded computer engineered for industrial environments requiring reliability, performance, and flexibility. Equipped with an Intel® Core™ i3‑6100TE processor and Intel® H110 chipset, it supports extensive I/O, multiple expansion slots, and dual independent displays. Its rugged design, wide‑range DC input, and comprehensive I/O make it ideal for automation control, machine vision, and edge computing applications where long‑term stability and low maintenance are critical.
### 1. Product Overview
Product Name: MVP‑6013
Model: MVP‑6013
Series: MVP‑6010 / 6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6013
Manufacturer: ADLINK Technology, Inc.
The ADLINK MVP‑6013 is a rugged, fanless, and expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 Value Series, which combines high performance, cost efficiency, and robust mechanical design. The MVP‑6013 integrates a 6th Generation Intel® Core™ i3‑6100TE processor with the Intel® H110 chipset, providing a balance of computing power and energy efficiency in a compact, fanless chassis.
### 2. Key Features
- Processor Platform:
6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU.
Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series.
- Chipset:
Intel® H110 Express chipset (MVP‑6010 series).
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards.
1 × Mini‑PCIe slot with USIM socket for wireless or communication modules.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support.
- Serial Communication:
4 × COM ports (DB‑9):
- 2 × software‑selectable RS‑232/422/485 (COM1, COM2)
- 2 × RS‑232 (COM3, COM4)
- RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel.
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable).
- Storage Options:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
Optional 160 W AC‑DC adapter for AC input.
- Mechanical Design:
Fanless aluminum chassis with front‑accessible I/O for simplified maintenance.
Wall‑mount kit included.
- Operating Environment:
Fanless operation from 0 °C to 50 °C (with 35 W CPU).
Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast).
Humidity: 95 % @ 40 °C (non‑condensing).
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑6100TE, 2 cores / 4 threads, 2.7 GHz, 35 W TDP |
| Chipset | Intel® H110 Express |
| Graphics | Intel® HD Graphics 530, supports dual independent displays |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Storage | 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Expansion Slots | 1 × PCIe Gen3 x16, 3 × PCI 32‑bit, 1 × Mini‑PCIe with USIM socket |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB‑9): 2 × RS‑232/422/485 + 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Power Input | 12 – 24 V DC (3‑pin connector with latch) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temp. | 0 °C to 50 °C (fanless operation) |
| Storage Temp. | –40 °C to 85 °C (excl. HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD | ±4 kV contact, ±8 kV air |
| EMC | CE & FCC Class A |
| Safety | UL/cUL, CB, CCC certified |
### 4. Functionality
The MVP‑6013 operates as a high‑reliability embedded controller for industrial and automation environments. Its fanless design ensures silent operation and resistance to dust and vibration. The system’s Intel® Core™ i3‑6100TE CPU delivers strong computing and graphics performance for real‑time control, data acquisition, and visualization tasks.
Typical Applications:
- Machine vision and inspection systems
- Industrial automation and process control
- Motion control and robotics
- Intelligent surveillance and security systems
- Data logging and edge computing gateways
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, and Linux.
- Supports standard PCI/PCIe Gen3 cards, USB devices, and Ethernet networks.
### 5. Components & Accessories
Included Items:
- MVP‑6013 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory modules (8 GB / 16 GB / 32 GB options)
- Factory‑installed 500 GB or 1 TB HDD
- Factory‑installed 64 GB MLC SATA SSD
- 160 W industrial‑grade AC‑DC adapter
Connectors:
- Front panel: 2 × DisplayPort, 1 × DVI‑D, 1 × VGA, 4 × USB 3.0, 2 × USB 2.0, 3 × RJ‑45 GbE, 4 × COM, 8 × DI, 8 × DO, audio jacks, DC power input.
- Internal: Mini‑PCIe, USIM slot, SATA connector, USB 2.0 header, fan connectors (9 V and 12 V), clear CMOS jumper, extended PWR/RESET header, +5 V and +12 V auxiliary power header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (V+, GND, V–). Ensure stable and low‑noise DC supply. Optional 160 W AC‑DC adapter available.
Mounting Options:
- Wall‑mount brackets included for underside or side installation.
- Can also be deployed upright on a stable surface.
- Maintain adequate ventilation and avoid blocking air vents.
Storage Device Installation:
Supports 2.5″ HDD/SSD via SATA III and CFast card installation through rear panel socket.
Expansion Card Installation:
Remove bottom cover to install PCI or PCIe cards. Align cards with guides and secure with screws.
Driver Installation:
Download drivers from [www.adlinktech.com](http://www.adlinktech.com): chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and serial I/O drivers.
### 7. Performance & Capabilities
Computing Performance:
- Intel® Core™ i3‑6100TE dual‑core processor (2.7 GHz) with Intel® HD Graphics 530.
- Supports hardware virtualization (VT‑x, VT‑d) and AES‑NI encryption.
- Dual‑channel DDR4 memory architecture for high bandwidth.
Graphics Performance:
- Intel® HD Graphics 530 supports DirectX 12 and OpenGL 4.4.
- Dual independent display output for multi‑monitor applications.
Network Performance:
- Three Intel® I211AT controllers support IEEE 802.3az Energy Efficient Ethernet, IEEE 1588 time synchronization, VLAN, jumbo frames, and PXE boot.
- Teaming function enables link aggregation and redundancy.
Power Consumption (24 V DC input):
- Power off: 2.9 W
- System idle: 17.9 W
- Full load: 50.66 W
- Recommended power supply: 160 W
Reliability & Durability:
- Fanless design eliminates moving parts, enhancing MTBF.
- Withstands vibration up to 5 Grms and shock up to 100 Grms.
- ESD protection ±4 kV (contact), ±8 kV (air).
Limitations:
- Operating temperature limited to 50 °C for 35 W CPU (40 °C for 65 W CPU).
- Add‑on cards may require additional cooling or power budget consideration.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, CCC certified.
- Environmental: RoHS and WEEE compliant.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az, 802.1AS, 802.1Qav.
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes.
### 9. Additional Information
Warranty & Support:
ADLINK provides standard warranty coverage and technical support through regional offices and the Ask an Expert portal ([http://askanexpert.adlinktech.com](http://askanexpert.adlinktech.com)). Firmware and BIOS updates are available on the official website.
Maintenance:
- Clean externally with dry cloth; avoid liquids and abrasives.
- Ensure adequate ventilation and dust‑free environment.
- Replace storage devices and memory modules only with qualified components.
- Optional fan module recommended for high‑temperature operation.
BIOS Features:
- AMI UEFI BIOS with configurable boot options, watchdog timer, and power management.
- Supports Intel® SpeedStep™, Hyper‑Threading, and virtualization technologies.
- Watchdog Timer (WDT) API available for Windows and Linux for system recovery automation.
Environmental Responsibility:
Compliant with EU RoHS and WEEE directives. ADLINK encourages proper recycling and disposal of electronic equipment at end of life.
Service Contacts:
- ADLINK Technology, Inc. (New Taipei City, Taiwan) Tel: +886‑2‑8226‑5877
- Ampro ADLINK Technology, Inc. (San Jose, USA) Tel: +1‑408‑360‑0200
- ADLINK Technology (China) Co., Ltd. (Shanghai, China) Tel: +86‑21‑5132‑8988
- LiPPERT ADLINK Technology GmbH (Mannheim, Germany) Tel: +49‑621‑43214‑0
### Summary
The ADLINK MVP‑6013 is a robust, fanless, and expandable embedded computer engineered for industrial environments requiring reliability, performance, and flexibility. Equipped with an Intel® Core™ i3‑6100TE processor and Intel® H110 chipset, it supports extensive I/O, multiple expansion slots, and dual independent displays. Its rugged design, wide‑range DC input, and comprehensive I/O make it ideal for automation control, machine vision, and edge computing applications where long‑term stability and low maintenance are critical.
No accessories available.
