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- Processor Platform:
6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset.
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication:
4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source).
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
- Operating Environment:
Fanless operation from 0 °C – 40 °C (with 65 W CPU).
- Mechanical Design:
Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance.
- Reliability:
Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.
6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset.
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication:
4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source).
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
- Operating Environment:
Fanless operation from 0 °C – 40 °C (with 65 W CPU).
- Mechanical Design:
Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance.
- Reliability:
Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.
Comprehensive Product Summary – ADLINK MVP‑6025 Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MVP‑6025
Article Number: MVP‑6025
Series: MVP‑6010/6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Manufacturer: ADLINK Technology, Inc.
Model Type: Fanless expandable embedded computer with Intel® Q170 chipset
Processor: Intel® Core™ i7‑6700 (65 W, Skylake architecture)
The ADLINK MVP‑6025 is a high‑performance, fanless, industrial‑grade embedded computer designed for automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 series, which integrates 6th‑generation Intel® Core™ i7/i5/i3 processors and provides flexible PCI/PCIe expansion options in a rugged, maintenance‑friendly chassis.
### 2. Key Features
- Processor Platform:
6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset.
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication:
4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source).
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
- Operating Environment:
Fanless operation from 0 °C – 40 °C (with 65 W CPU).
- Mechanical Design:
Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance.
- Reliability:
Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i7‑6700 (65 W, Skylake, LGA1151) |
| Chipset | Intel® Q170 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Intel® HD Graphics 530 integrated GPU |
| Display Interfaces | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × DB9 (COM1–4): 2 × RS‑232/422/485 (BIOS selectable), 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Mini‑PCIe | 1 × internal Mini‑PCIe slot with USIM socket |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 40 °C (65 W CPU) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6025 operates as a high‑reliability embedded controller for industrial automation and edge computing. It integrates a 6th‑generation Intel® Core™ CPU with Intel® HD Graphics 530, enabling both computational and graphical workloads.
Operation Principle:
The system’s fanless thermal design uses a heat‑spreading aluminum chassis to dissipate heat from the CPU and chipset. It supports wide‑range DC input (12–24 V) and can be deployed in environments with vibration, dust, or electrical noise.
Use Cases & Applications:
- Machine vision and inspection systems
- Motion control and robotics
- Industrial automation and process control
- Intelligent surveillance and security systems
- Edge data acquisition and gateway computing
Compatibility:
Supports Windows 10 (64‑bit), Windows 7 (32/64‑bit), and Linux distributions. BIOS and driver packages are available from ADLINK’s support portal.
### 5. Components & Accessories
Included Items:
- MVP‑6025 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD/SSD installation
Optional Accessories:
- Fan module (for extended thermal range)
- DDR4 SO‑DIMM memory modules (8 GB / 16 GB / 32 GB)
- 500 GB / 1 TB SATA HDD or 64 GB MLC SSD (pre‑installed options)
- 160 W industrial AC‑DC adapter
- Auxiliary power cable (CN23 to Molex 8981) for add‑on cards
Connectors & Interfaces:
- Front panel: Power button, reset, LED indicators, audio jacks, 2 × DisplayPort, 1 × DVI‑D, 1 × VGA, 4 × USB 3.0, 2 × USB 2.0, 3 × GbE, 4 × COM, DI/DO connectors, DC power input.
- Internal: SATA connector, Mini‑PCIe slot, USIM slot, USB 2.0 header, fan connectors (9 V and 12 V), +5 V/+12 V auxiliary power header, clear CMOS jumper, extended PWR/RESET header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (V+, GND, V–). Optional 160 W AC‑DC adapter for AC input.
Mounting Options:
- Wall‑mount (brackets and screws included)
- Upright or side deployment on stable surface
Storage Installation:
Supports 2.5″ HDD/SSD via SATA III 6 Gb/s interface and CFast card installation through rear socket.
Expansion Installation:
PCI/PCIe cards are installed by removing the bottom cover and inserting into the appropriate slot.
Driver Setup:
Drivers for chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and Serial I/O are available from ADLINK’s website.
BIOS Configuration:
Access via DEL key during POST; supports boot menu (F7), watchdog timer configuration, and advanced power management settings.
### 7. Performance & Capabilities
Processing Performance:
Intel® Core™ i7‑6700 (4 cores, 8 threads) with Intel® HD Graphics 530 GPU delivers robust computing and graphics capabilities for industrial applications.
Memory Bandwidth:
Dual‑channel DDR4 2133 MHz supports high data throughput for real‑time processing.
Storage Performance:
SATA III 6 Gb/s interface enables fast data access for SSD or HDD storage.
Network Throughput:
Three Intel® I211AT GbE ports support link aggregation (teaming) and Wake‑on‑LAN for redundant or high‑bandwidth network applications.
Power Consumption:
- Power off: 2.9 W
- Idle: 28.12 W
- Full load: 69.56 W (@ 24 V DC)
- Recommended power supply: 160 W
Thermal Efficiency:
Fanless operation up to 40 °C ambient with 65 W CPU; optional fan module extends thermal range.
Limitations:
Operating temperature limited to 40 °C for 65 W CPU configurations without fan module; add‑on cards may require additional cooling and power budget considerations.
### 8. Standards & Compliance
Electromagnetic Compatibility (EMC):
- CE & FCC Class A compliance
Safety Certifications:
- UL/cUL, CB, CCC
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances)
- WEEE (Waste Electrical and Electronic Equipment)
Reliability Standards:
- Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
- Shock: 100 Grms half‑sine 11 ms duration
- ESD: ±4 kV contact, ±8 kV air
Industry Standards:
- PCI Express Gen3, SATA III 6 Gb/s, USB 3.0, Gigabit Ethernet IEEE 802.3 compliance
### 9. Additional Information
Warranty & Support:
ADLINK provides standard manufacturer warranty and global technical support through regional offices and the Ask an Expert portal (http://askanexpert.adlinktech.com).
Maintenance:
Fanless design minimizes maintenance requirements. Periodic dust inspection and connector checks are recommended.
Software Updates:
BIOS and driver updates available from ADLINK’s official website (www.adlinktech.com).
Environmental Responsibility:
Compliant with EU RoHS and WEEE directives; ADLINK encourages proper recycling and disposal of electronic equipment.
Service Contacts:
- ADLINK Technology, Inc. (Taiwan) – +886‑2‑8226‑5877
- Ampro ADLINK Technology, Inc. (USA) – +1‑408‑360‑0200
- ADLINK Technology (China) – +86‑21‑5132‑8988
- LiPPERT ADLINK Technology GmbH (Germany) – +49‑621‑43214‑0
### Summary
The ADLINK MVP‑6025 is a robust, fanless, and expandable embedded computer engineered for industrial automation and edge computing. Powered by the Intel® Core™ i7‑6700 processor and Intel® Q170 chipset, it delivers high‑performance processing, versatile I/O, and multiple expansion options in a compact, rugged chassis. With support for dual independent displays, triple Gigabit Ethernet, and wide‑range DC input, the MVP‑6025 provides a reliable platform for mission‑critical applications in harsh environments.
Its compliance with CE, FCC, UL, and RoHS standards ensures dependable operation and long‑term availability for industrial system integrators seeking a cost‑effective yet powerful embedded computing solution.
### 1. Product Overview
Product Name: MVP‑6025
Article Number: MVP‑6025
Series: MVP‑6010/6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Manufacturer: ADLINK Technology, Inc.
Model Type: Fanless expandable embedded computer with Intel® Q170 chipset
Processor: Intel® Core™ i7‑6700 (65 W, Skylake architecture)
The ADLINK MVP‑6025 is a high‑performance, fanless, industrial‑grade embedded computer designed for automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6010/6020 series, which integrates 6th‑generation Intel® Core™ i7/i5/i3 processors and provides flexible PCI/PCIe expansion options in a rugged, maintenance‑friendly chassis.
### 2. Key Features
- Processor Platform:
6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset.
- Memory:
Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory.
- Display Support:
Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA.
Maximum resolutions:
- DisplayPort: 4096 × 2304 @ 60 Hz
- DVI‑D: 1920 × 1200 @ 60 Hz
- VGA: 1920 × 1080 @ 60 Hz
- Expansion Capability:
4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots.
- Networking:
3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support.
- Serial Communication:
4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines.
- Digital I/O:
8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source).
- USB Connectivity:
4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA).
- Storage Interfaces:
1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket.
- Audio:
1 × Mic‑in and 1 × Line‑out.
- Power Input:
Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–).
- Operating Environment:
Fanless operation from 0 °C – 40 °C (with 65 W CPU).
- Mechanical Design:
Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance.
- Reliability:
Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i7‑6700 (65 W, Skylake, LGA1151) |
| Chipset | Intel® Q170 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 MHz |
| Graphics | Intel® HD Graphics 530 integrated GPU |
| Display Interfaces | 2 × DisplayPort, 1 × DVI‑D, 1 × VGA |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × DB9 (COM1–4): 2 × RS‑232/422/485 (BIOS selectable), 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2–5.25 V VIH, 0–0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot |
| Mini‑PCIe | 1 × internal Mini‑PCIe slot with USIM socket |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector) |
| Optional AC Input | 160 W external AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 40 °C (65 W CPU) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6025 operates as a high‑reliability embedded controller for industrial automation and edge computing. It integrates a 6th‑generation Intel® Core™ CPU with Intel® HD Graphics 530, enabling both computational and graphical workloads.
Operation Principle:
The system’s fanless thermal design uses a heat‑spreading aluminum chassis to dissipate heat from the CPU and chipset. It supports wide‑range DC input (12–24 V) and can be deployed in environments with vibration, dust, or electrical noise.
Use Cases & Applications:
- Machine vision and inspection systems
- Motion control and robotics
- Industrial automation and process control
- Intelligent surveillance and security systems
- Edge data acquisition and gateway computing
Compatibility:
Supports Windows 10 (64‑bit), Windows 7 (32/64‑bit), and Linux distributions. BIOS and driver packages are available from ADLINK’s support portal.
### 5. Components & Accessories
Included Items:
- MVP‑6025 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD/SSD installation
Optional Accessories:
- Fan module (for extended thermal range)
- DDR4 SO‑DIMM memory modules (8 GB / 16 GB / 32 GB)
- 500 GB / 1 TB SATA HDD or 64 GB MLC SSD (pre‑installed options)
- 160 W industrial AC‑DC adapter
- Auxiliary power cable (CN23 to Molex 8981) for add‑on cards
Connectors & Interfaces:
- Front panel: Power button, reset, LED indicators, audio jacks, 2 × DisplayPort, 1 × DVI‑D, 1 × VGA, 4 × USB 3.0, 2 × USB 2.0, 3 × GbE, 4 × COM, DI/DO connectors, DC power input.
- Internal: SATA connector, Mini‑PCIe slot, USIM slot, USB 2.0 header, fan connectors (9 V and 12 V), +5 V/+12 V auxiliary power header, clear CMOS jumper, extended PWR/RESET header.
### 6. Installation & Setup
Power Requirements:
12 – 24 V DC input via 3‑pin connector (V+, GND, V–). Optional 160 W AC‑DC adapter for AC input.
Mounting Options:
- Wall‑mount (brackets and screws included)
- Upright or side deployment on stable surface
Storage Installation:
Supports 2.5″ HDD/SSD via SATA III 6 Gb/s interface and CFast card installation through rear socket.
Expansion Installation:
PCI/PCIe cards are installed by removing the bottom cover and inserting into the appropriate slot.
Driver Setup:
Drivers for chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, and Serial I/O are available from ADLINK’s website.
BIOS Configuration:
Access via DEL key during POST; supports boot menu (F7), watchdog timer configuration, and advanced power management settings.
### 7. Performance & Capabilities
Processing Performance:
Intel® Core™ i7‑6700 (4 cores, 8 threads) with Intel® HD Graphics 530 GPU delivers robust computing and graphics capabilities for industrial applications.
Memory Bandwidth:
Dual‑channel DDR4 2133 MHz supports high data throughput for real‑time processing.
Storage Performance:
SATA III 6 Gb/s interface enables fast data access for SSD or HDD storage.
Network Throughput:
Three Intel® I211AT GbE ports support link aggregation (teaming) and Wake‑on‑LAN for redundant or high‑bandwidth network applications.
Power Consumption:
- Power off: 2.9 W
- Idle: 28.12 W
- Full load: 69.56 W (@ 24 V DC)
- Recommended power supply: 160 W
Thermal Efficiency:
Fanless operation up to 40 °C ambient with 65 W CPU; optional fan module extends thermal range.
Limitations:
Operating temperature limited to 40 °C for 65 W CPU configurations without fan module; add‑on cards may require additional cooling and power budget considerations.
### 8. Standards & Compliance
Electromagnetic Compatibility (EMC):
- CE & FCC Class A compliance
Safety Certifications:
- UL/cUL, CB, CCC
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances)
- WEEE (Waste Electrical and Electronic Equipment)
Reliability Standards:
- Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
- Shock: 100 Grms half‑sine 11 ms duration
- ESD: ±4 kV contact, ±8 kV air
Industry Standards:
- PCI Express Gen3, SATA III 6 Gb/s, USB 3.0, Gigabit Ethernet IEEE 802.3 compliance
### 9. Additional Information
Warranty & Support:
ADLINK provides standard manufacturer warranty and global technical support through regional offices and the Ask an Expert portal (http://askanexpert.adlinktech.com).
Maintenance:
Fanless design minimizes maintenance requirements. Periodic dust inspection and connector checks are recommended.
Software Updates:
BIOS and driver updates available from ADLINK’s official website (www.adlinktech.com).
Environmental Responsibility:
Compliant with EU RoHS and WEEE directives; ADLINK encourages proper recycling and disposal of electronic equipment.
Service Contacts:
- ADLINK Technology, Inc. (Taiwan) – +886‑2‑8226‑5877
- Ampro ADLINK Technology, Inc. (USA) – +1‑408‑360‑0200
- ADLINK Technology (China) – +86‑21‑5132‑8988
- LiPPERT ADLINK Technology GmbH (Germany) – +49‑621‑43214‑0
### Summary
The ADLINK MVP‑6025 is a robust, fanless, and expandable embedded computer engineered for industrial automation and edge computing. Powered by the Intel® Core™ i7‑6700 processor and Intel® Q170 chipset, it delivers high‑performance processing, versatile I/O, and multiple expansion options in a compact, rugged chassis. With support for dual independent displays, triple Gigabit Ethernet, and wide‑range DC input, the MVP‑6025 provides a reliable platform for mission‑critical applications in harsh environments.
Its compliance with CE, FCC, UL, and RoHS standards ensures dependable operation and long‑term availability for industrial system integrators seeking a cost‑effective yet powerful embedded computing solution.
No accessories available.
