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- Processor Platform:
Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub.
Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output.
- Fanless and Cable‑Free Design:
The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability.
- Expandable Architecture:
Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion.
- Triple Independent Display Support:
Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I).
- Comprehensive I/O Connectivity:
Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output.
- Storage Flexibility:
Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1.
Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation.
- Wide‑Range Power Input:
Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch.
- Industrial‑Grade Reliability:
Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM.
Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G.
- Software and OS Support:
Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.
Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub.
Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output.
- Fanless and Cable‑Free Design:
The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability.
- Expandable Architecture:
Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion.
- Triple Independent Display Support:
Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I).
- Comprehensive I/O Connectivity:
Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output.
- Storage Flexibility:
Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1.
Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation.
- Wide‑Range Power Input:
Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch.
- Industrial‑Grade Reliability:
Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM.
Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G.
- Software and OS Support:
Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.
Comprehensive Product Summary – ADLINK MXC‑6313D Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MXC‑6313D
Model: MXC‑6313D
Series: Matrix MXC‑6300/6310/6320 Series
Article Number: MXC‑6313D
Manufacturer: ADLINK Technology, Inc.
The ADLINK MXC‑6313D is a rugged, fanless, and cable‑free expandable embedded computer designed for industrial and automation applications. It belongs to ADLINK’s Matrix MXC‑6300/6310/6320 series, which integrates 3rd‑generation Intel® Core™ processors and the Intel® QM77 chipset. The MXC‑6313D variant specifically incorporates the Intel® Core™ i3‑3120ME dual‑core processor, providing a balance of performance, energy efficiency, and reliability for embedded control, machine vision, and industrial computing environments.
### 2. Key Features
- Processor Platform:
Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub.
Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output.
- Fanless and Cable‑Free Design:
The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability.
- Expandable Architecture:
Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion.
- Triple Independent Display Support:
Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I).
- Comprehensive I/O Connectivity:
Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output.
- Storage Flexibility:
Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1.
Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation.
- Wide‑Range Power Input:
Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch.
- Industrial‑Grade Reliability:
Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM.
Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G.
- Software and OS Support:
Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.
### 3. Technical Specifications
Processor: Intel® Core™ i3‑3120ME, dual‑core, 2.4 GHz, 3 MB L3 cache
Chipset: Intel® QM77 Mobile PCH
Memory: 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3 1600 MHz
Graphics: Intel® HD Graphics 4000, triple independent display (2 × DP + 1 × DVI‑I)
Display Resolutions:
• DP1 – 2560 × 1600 @ 60 Hz
• DP2 – 1920 × 1600 @ 60 Hz
• DVI‑I – 1920 × 1200 @ 60 Hz
Expansion Slots:
• 1 × PCI (32‑bit, 33/66 MHz)
• 1 × PCIe x16 (Gen 2, x16 or x8 link depending on configuration)
Ethernet:
• 3 × Gigabit LAN (1 × Intel I219, 2 × Intel I210IT)
• Supports Teaming, Wake‑on‑LAN, Intel AMT 11.0
Serial Ports:
• 2 × RS‑232/422/485 (COM 1–2, autoflow control)
• 2 × RS‑232 (COM 3–4)
USB:
• 4 × USB 3.0 (Type A)
• 2 × USB 2.0 (Type A)
• 1 × internal USB 2.0
Digital I/O: 16 × DI + 16 × DO, 1.5 kV isolation
Audio: 1 × Mic‑in, 1 × Line‑out (Realtek ALC269 HD Audio)
Keyboard/Mouse: 1 × PS/2 keyboard, 1 × PS/2 mouse
Watchdog Timer: Programmable 1 – 255 s/min intervals
Storage:
• 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1
• 2 × CFast sockets (1 internal + 1 external)
Power Input: 9 – 32 V DC wide‑range input, 3‑pin pluggable connector (GND, V–, V+)
Optional AC Adapter: 160 W external AC‑DC adapter
Dimensions: 154 (W) × 225 (D) × 213 (H) mm (6.06 × 8.86 × 8.39 in)
Weight: 3.8 kg (8.39 lb)
Mounting: Wall‑mount kit included
Environmental:
• Operating Temp: 0 – 50 °C (standard), –20 – 60 °C (industrial SSD/RAM)
• Storage Temp: –40 – 85 °C (excl. HDD)
• Humidity: 95 % @ 40 °C (non‑condensing)
• Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
• Shock: 50 G, 11 ms half‑sine (SSD/CFast)
EMC/Safety: CE & FCC Class A, UL/cUL, CB, KCC
### 4. Functionality
The MXC‑6313D functions as a compact, high‑reliability embedded controller for industrial automation, machine vision, and transportation systems. It operates fanlessly, using a solid aluminum heat‑sink chassis for passive cooling. The system supports multiple display outputs for visualization and monitoring, while its isolated digital I/O and serial interfaces enable direct connection to sensors, actuators, and industrial control devices.
Typical Use Cases:
- Factory automation and machine vision inspection systems
- Intelligent transportation and traffic control nodes
- Maritime and port automation controllers
- Surveillance and security video processing units
- High‑resolution medical imaging and diagnostic equipment
Compatibility:
Supports Windows 7/Embedded Standard 7/XP/XP Embedded and Linux. Drivers for chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, watchdog timer, and digital I/O are provided via ADLINK’s All‑in‑One DVD or download portal.
### 5. Components & Accessories
Included Items:
- MXC‑6313D controller unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (driver media)
Optional Accessories:
- Fan Module: Smart fan control module for PCI/PCIe heat dissipation
- Storage Options: Factory‑installed 500 GB/1 TB HDD or 32/64 GB MLC SSD
- Power Adapter: 160 W industrial AC‑DC adapter (–20 °C – 70 °C rating)
- DisplayPort Cables: DP‑to‑HDMI (P/N 30‑01119‑0000), DP‑to‑DVI (30‑01120‑0000), DP‑to‑VGA (30‑01121‑0000), Active DP‑to‑DVI (30‑01157‑0000)
- DIN‑68S‑01 and ACL‑10568‑1: Digital I/O cable and terminal board accessories
### 6. Installation & Setup
Power Connection:
Connect 9 – 32 V DC input to the 3‑pin connector (V+, GND, V–). Optional remote power switch available. Ensure stable DC supply to prevent system instability.
Storage Installation:
Supports two 2.5″ HDD/SSD drives mounted on a removable bracket and two CFast cards (internal and external). SATA ports support RAID 0/1 configuration via Intel Rapid Storage Technology.
Expansion Card Installation:
Remove top cover, insert PCI or PCIe card into designated slot, secure with brace, and reassemble. Optional fan module recommended for high‑power cards.
Mounting:
Wall‑mount brackets included. Maintain ≥ 5 cm clearance above unit for heat dissipation.
Driver Installation Order:
1. Chipset driver
2. Graphics driver
3. Ethernet driver
4. Audio driver
5. USB 3.0 driver
6. Intel Management Engine driver
7. Watchdog Timer driver
8. Digital I/O driver
### 7. Performance & Capabilities
Processing Performance:
Dual‑core Intel Core i3‑3120ME (2.4 GHz) delivers robust computing for control and visual applications with low thermal output. Supports Intel VT‑x virtualization and EIST power management.
Graphics Performance:
Integrated Intel HD Graphics 4000 supports DirectX 11 and OpenGL 3.1, enabling multi‑display visualization and high‑definition output.
Storage Performance:
SATA III 6 Gb/s interfaces with RAID 0/1 provide high throughput and data redundancy. CFast cards offer fast, vibration‑resistant boot media.
Power Efficiency:
Typical power consumption at 24 V DC: 16.08 W idle, 53.76 W full load. Recommended power supply capacity: 160 W.
Thermal Capability:
Fanless operation up to 60 °C with industrial SSD/RAM. Optional fan module extends thermal margin when using high‑power expansion cards.
Limitations:
Standard operating range limited to 0 – 50 °C with HDD; extended range requires solid‑state storage. PCIe x16 slot operates at x8 when both PCIe slots are populated.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant
- Safety: UL/cUL, CB, KCC certified
- Environmental: RoHS and WEEE compliant for hazardous substance restriction and recycling
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az Energy Efficient Ethernet, 802.1Q VLAN, 802.1p QoS
- RAID Support: Intel Rapid Storage Technology (RST) RAID 0/1
- BIOS: AMI UEFI BIOS with Intel AMT and VT‑d support
### 9. Additional Information
Warranty: Standard ADLINK limited warranty (typically 2 years, region‑dependent).
Support: Global technical support via ADLINK offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India.
Maintenance: No moving parts ensure minimal maintenance. Periodic dust inspection and connector tightening recommended.
Firmware & BIOS Updates: Available from ADLINK website for performance and security enhancements.
Environmental Responsibility: Manufactured in compliance with RoHS and WEEE directives to minimize environmental impact.
### Summary
The ADLINK MXC‑6313D is a compact, industrial‑grade, fanless embedded computer engineered for demanding automation and control environments. Combining a 3rd‑generation Intel® Core™ i3‑3120ME processor, Intel QM77 chipset, and extensive I/O capabilities, it delivers reliable performance for machine vision, transportation, and industrial monitoring applications. Its rugged design, wide temperature tolerance, and expandable architecture make it a versatile platform for long‑life embedded deployments where stability, longevity, and silent operation are paramount.
### 1. Product Overview
Product Name: MXC‑6313D
Model: MXC‑6313D
Series: Matrix MXC‑6300/6310/6320 Series
Article Number: MXC‑6313D
Manufacturer: ADLINK Technology, Inc.
The ADLINK MXC‑6313D is a rugged, fanless, and cable‑free expandable embedded computer designed for industrial and automation applications. It belongs to ADLINK’s Matrix MXC‑6300/6310/6320 series, which integrates 3rd‑generation Intel® Core™ processors and the Intel® QM77 chipset. The MXC‑6313D variant specifically incorporates the Intel® Core™ i3‑3120ME dual‑core processor, providing a balance of performance, energy efficiency, and reliability for embedded control, machine vision, and industrial computing environments.
### 2. Key Features
- Processor Platform:
Powered by a 3rd‑generation Intel® Core™ i3‑3120ME dual‑core CPU (2.4 GHz, 3 MB cache), paired with the Intel® QM77 Mobile Platform Controller Hub.
Supports Intel® HD Graphics 4000 integrated GPU for high‑definition visual output.
- Fanless and Cable‑Free Design:
The MXC‑6313D employs a completely fanless architecture with passive heat dissipation, ensuring silent operation and high reliability in dusty or vibration‑prone environments. The cable‑free internal layout enhances mechanical robustness and thermal stability.
- Expandable Architecture:
Provides one PCI slot and one PCI Express x16 slot (Gen 2), allowing integration of add‑on cards for motion control, data acquisition, or specialized I/O expansion.
- Triple Independent Display Support:
Two DisplayPort connectors and one DVI‑I port enable simultaneous operation of up to three independent displays with resolutions up to 2560 × 1600 (1st DP), 1920 × 1600 (2nd DP), and 1920 × 1200 (DVI‑I).
- Comprehensive I/O Connectivity:
Includes 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0; 2 × RS‑232/422/485 software‑selectable ports and 2 × RS‑232 ports; 3 × Gigabit Ethernet ports (1 × Intel I219, 2 × Intel I210IT) with teaming and Intel AMT 11.0 support; 16‑channel isolated digital input and 16‑channel isolated digital output.
- Storage Flexibility:
Two onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD installation, supporting RAID 0/1.
Dual CFast sockets (one internal, one external) for solid‑state storage or OS installation.
- Wide‑Range Power Input:
Accepts 9 – 32 V DC input via pluggable connector with latch and optional remote power switch.
- Industrial‑Grade Reliability:
Operating temperature range of 0 °C – 50 °C (standard) or –20 °C – 60 °C with industrial‑grade SSD/RAM.
Vibration tolerance up to 5 Grms (SSD/CFast) and shock resistance up to 50 G.
- Software and OS Support:
Compatible with Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, and Linux distributions.
### 3. Technical Specifications
Processor: Intel® Core™ i3‑3120ME, dual‑core, 2.4 GHz, 3 MB L3 cache
Chipset: Intel® QM77 Mobile PCH
Memory: 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3 1600 MHz
Graphics: Intel® HD Graphics 4000, triple independent display (2 × DP + 1 × DVI‑I)
Display Resolutions:
• DP1 – 2560 × 1600 @ 60 Hz
• DP2 – 1920 × 1600 @ 60 Hz
• DVI‑I – 1920 × 1200 @ 60 Hz
Expansion Slots:
• 1 × PCI (32‑bit, 33/66 MHz)
• 1 × PCIe x16 (Gen 2, x16 or x8 link depending on configuration)
Ethernet:
• 3 × Gigabit LAN (1 × Intel I219, 2 × Intel I210IT)
• Supports Teaming, Wake‑on‑LAN, Intel AMT 11.0
Serial Ports:
• 2 × RS‑232/422/485 (COM 1–2, autoflow control)
• 2 × RS‑232 (COM 3–4)
USB:
• 4 × USB 3.0 (Type A)
• 2 × USB 2.0 (Type A)
• 1 × internal USB 2.0
Digital I/O: 16 × DI + 16 × DO, 1.5 kV isolation
Audio: 1 × Mic‑in, 1 × Line‑out (Realtek ALC269 HD Audio)
Keyboard/Mouse: 1 × PS/2 keyboard, 1 × PS/2 mouse
Watchdog Timer: Programmable 1 – 255 s/min intervals
Storage:
• 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1
• 2 × CFast sockets (1 internal + 1 external)
Power Input: 9 – 32 V DC wide‑range input, 3‑pin pluggable connector (GND, V–, V+)
Optional AC Adapter: 160 W external AC‑DC adapter
Dimensions: 154 (W) × 225 (D) × 213 (H) mm (6.06 × 8.86 × 8.39 in)
Weight: 3.8 kg (8.39 lb)
Mounting: Wall‑mount kit included
Environmental:
• Operating Temp: 0 – 50 °C (standard), –20 – 60 °C (industrial SSD/RAM)
• Storage Temp: –40 – 85 °C (excl. HDD)
• Humidity: 95 % @ 40 °C (non‑condensing)
• Vibration: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
• Shock: 50 G, 11 ms half‑sine (SSD/CFast)
EMC/Safety: CE & FCC Class A, UL/cUL, CB, KCC
### 4. Functionality
The MXC‑6313D functions as a compact, high‑reliability embedded controller for industrial automation, machine vision, and transportation systems. It operates fanlessly, using a solid aluminum heat‑sink chassis for passive cooling. The system supports multiple display outputs for visualization and monitoring, while its isolated digital I/O and serial interfaces enable direct connection to sensors, actuators, and industrial control devices.
Typical Use Cases:
- Factory automation and machine vision inspection systems
- Intelligent transportation and traffic control nodes
- Maritime and port automation controllers
- Surveillance and security video processing units
- High‑resolution medical imaging and diagnostic equipment
Compatibility:
Supports Windows 7/Embedded Standard 7/XP/XP Embedded and Linux. Drivers for chipset, graphics, Ethernet, audio, USB 3.0, Intel Management Engine, watchdog timer, and digital I/O are provided via ADLINK’s All‑in‑One DVD or download portal.
### 5. Components & Accessories
Included Items:
- MXC‑6313D controller unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (driver media)
Optional Accessories:
- Fan Module: Smart fan control module for PCI/PCIe heat dissipation
- Storage Options: Factory‑installed 500 GB/1 TB HDD or 32/64 GB MLC SSD
- Power Adapter: 160 W industrial AC‑DC adapter (–20 °C – 70 °C rating)
- DisplayPort Cables: DP‑to‑HDMI (P/N 30‑01119‑0000), DP‑to‑DVI (30‑01120‑0000), DP‑to‑VGA (30‑01121‑0000), Active DP‑to‑DVI (30‑01157‑0000)
- DIN‑68S‑01 and ACL‑10568‑1: Digital I/O cable and terminal board accessories
### 6. Installation & Setup
Power Connection:
Connect 9 – 32 V DC input to the 3‑pin connector (V+, GND, V–). Optional remote power switch available. Ensure stable DC supply to prevent system instability.
Storage Installation:
Supports two 2.5″ HDD/SSD drives mounted on a removable bracket and two CFast cards (internal and external). SATA ports support RAID 0/1 configuration via Intel Rapid Storage Technology.
Expansion Card Installation:
Remove top cover, insert PCI or PCIe card into designated slot, secure with brace, and reassemble. Optional fan module recommended for high‑power cards.
Mounting:
Wall‑mount brackets included. Maintain ≥ 5 cm clearance above unit for heat dissipation.
Driver Installation Order:
1. Chipset driver
2. Graphics driver
3. Ethernet driver
4. Audio driver
5. USB 3.0 driver
6. Intel Management Engine driver
7. Watchdog Timer driver
8. Digital I/O driver
### 7. Performance & Capabilities
Processing Performance:
Dual‑core Intel Core i3‑3120ME (2.4 GHz) delivers robust computing for control and visual applications with low thermal output. Supports Intel VT‑x virtualization and EIST power management.
Graphics Performance:
Integrated Intel HD Graphics 4000 supports DirectX 11 and OpenGL 3.1, enabling multi‑display visualization and high‑definition output.
Storage Performance:
SATA III 6 Gb/s interfaces with RAID 0/1 provide high throughput and data redundancy. CFast cards offer fast, vibration‑resistant boot media.
Power Efficiency:
Typical power consumption at 24 V DC: 16.08 W idle, 53.76 W full load. Recommended power supply capacity: 160 W.
Thermal Capability:
Fanless operation up to 60 °C with industrial SSD/RAM. Optional fan module extends thermal margin when using high‑power expansion cards.
Limitations:
Standard operating range limited to 0 – 50 °C with HDD; extended range requires solid‑state storage. PCIe x16 slot operates at x8 when both PCIe slots are populated.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant
- Safety: UL/cUL, CB, KCC certified
- Environmental: RoHS and WEEE compliant for hazardous substance restriction and recycling
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az Energy Efficient Ethernet, 802.1Q VLAN, 802.1p QoS
- RAID Support: Intel Rapid Storage Technology (RST) RAID 0/1
- BIOS: AMI UEFI BIOS with Intel AMT and VT‑d support
### 9. Additional Information
Warranty: Standard ADLINK limited warranty (typically 2 years, region‑dependent).
Support: Global technical support via ADLINK offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India.
Maintenance: No moving parts ensure minimal maintenance. Periodic dust inspection and connector tightening recommended.
Firmware & BIOS Updates: Available from ADLINK website for performance and security enhancements.
Environmental Responsibility: Manufactured in compliance with RoHS and WEEE directives to minimize environmental impact.
### Summary
The ADLINK MXC‑6313D is a compact, industrial‑grade, fanless embedded computer engineered for demanding automation and control environments. Combining a 3rd‑generation Intel® Core™ i3‑3120ME processor, Intel QM77 chipset, and extensive I/O capabilities, it delivers reliable performance for machine vision, transportation, and industrial monitoring applications. Its rugged design, wide temperature tolerance, and expandable architecture make it a versatile platform for long‑life embedded deployments where stability, longevity, and silent operation are paramount.
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