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- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (Skylake, 4 cores, 35 W TDP)
- Chipset: Intel® Q170 Express
- Memory: Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133
- Display Support: Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA
- Expansion Capability:
- 2 × PCIe Gen3 x8 slots (x16 mechanical)
- 2 × PCI 32‑bit slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN
- I/O Interfaces:
- 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232)
- 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0
- 8 × Digital Input (DI) and 8 × Digital Output (DO) channels
- 1 × Mic‑in, 1 × Line‑out
- Storage:
- 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD
- 1 × Type II CFast socket
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation)
- Construction: Fanless aluminum chassis, front‑accessible I/O, wall‑mountable
- Dimensions: 220 (W) × 210 (D) × 208.7 (H) mm
- Weight: 4.7 kg
The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.
- Chipset: Intel® Q170 Express
- Memory: Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133
- Display Support: Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA
- Expansion Capability:
- 2 × PCIe Gen3 x8 slots (x16 mechanical)
- 2 × PCI 32‑bit slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN
- I/O Interfaces:
- 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232)
- 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0
- 8 × Digital Input (DI) and 8 × Digital Output (DO) channels
- 1 × Mic‑in, 1 × Line‑out
- Storage:
- 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD
- 1 × Type II CFast socket
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation)
- Construction: Fanless aluminum chassis, front‑accessible I/O, wall‑mountable
- Dimensions: 220 (W) × 210 (D) × 208.7 (H) mm
- Weight: 4.7 kg
The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.
Comprehensive Product Summary – ADLINK MVP‑6022 Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MVP‑6022
Model: MVP‑6022
Series: MVP‑6010/6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6022
Manufacturer: ADLINK Technology, Inc.
Part Number: 50‑1Z214‑1000
Revision: 1.0 (June 23, 2017)
The ADLINK MVP‑6022 is a rugged, fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6020 Series, which integrates Intel’s 6th Generation Core™ i5‑6500TE processor and Intel® Q170 chipset, offering high performance, reliability, and expandability in a compact, maintenance‑friendly chassis.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (Skylake, 4 cores, 35 W TDP)
- Chipset: Intel® Q170 Express
- Memory: Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133
- Display Support: Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA
- Expansion Capability:
- 2 × PCIe Gen3 x8 slots (x16 mechanical)
- 2 × PCI 32‑bit slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN
- I/O Interfaces:
- 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232)
- 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0
- 8 × Digital Input (DI) and 8 × Digital Output (DO) channels
- 1 × Mic‑in, 1 × Line‑out
- Storage:
- 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD
- 1 × Type II CFast socket
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation)
- Construction: Fanless aluminum chassis, front‑accessible I/O, wall‑mountable
- Dimensions: 220 (W) × 210 (D) × 208.7 (H) mm
- Weight: 4.7 kg
The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.
### 3. Technical Specifications
| Category | Specification |
|---------------|------------------|
| Processor | Intel® Core™ i5‑6500TE (4 cores, 4 threads, 2.3 GHz base, 3.3 GHz turbo, 35 W TDP) |
| Chipset | Intel® Q170 Express |
| Graphics | Integrated Intel® HD Graphics 530 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast socket |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit, 1 × Mini‑PCIe slot with USIM |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB9): 2 × RS‑232/422/485 (BIOS‑selectable), 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2 – 5.25 V VIH, 0 – 0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out (Realtek ALC262 codec) |
| Video Outputs | 2 × DisplayPort (4096 × 2304 @ 60 Hz), 1 × DVI‑D (1920 × 1200 @ 60 Hz), 1 × VGA (1920 × 1080 @ 60 Hz) |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector V+, GND, V–) |
| Optional AC Input | 160 W external industrial AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5 – 500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6022 operates as a high‑performance embedded controller for industrial automation and edge computing. It integrates Intel’s Skylake architecture for efficient multitasking and real‑time control. The fanless design ensures silent operation and resistance to dust and vibration, ideal for factory floors or harsh environments.
Use Cases & Applications:
- Machine vision and inspection systems
- Motion control and robotics
- Industrial data acquisition and process control
- Surveillance and security monitoring
- Edge computing and IoT gateway applications
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, Linux
- Supports BIOS‑level configuration for serial modes, LAN PXE boot, and watchdog timer control.
- Compatible with standard PCI/PCIe Gen3 cards and Mini‑PCIe modules (e.g., Wi‑Fi, LTE, GPS).
### 5. Components & Accessories
Included Items:
- MVP‑6022 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory modules (8 GB / 16 GB / 32 GB options)
- 500 GB / 1 TB SATA HDD or 64 GB MLC SSD (factory‑installed)
- 160 W industrial AC‑DC adapter
- DisplayPort to HDMI/DVI/VGA adapter cables (P/N 30‑01119‑0010 to 30‑01121‑0010)
Connectors:
- Front panel I/O includes DisplayPort × 2, DVI‑D, VGA, USB 2.0 × 2, USB 3.0 × 4, 3 × GbE, 4 × COM, 8 DI/8 DO, audio jacks, and DC power input.
- Internal connectors for Mini‑PCIe, SATA, USB 2.0, fan power (9 V and 12 V), and USIM slot.
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC power supply (160 W recommended)
- Stable mounting surface or wall mount brackets
- Adequate ventilation (clear airflow around chassis fins)
Mounting Options:
- Wall‑mount: Two configurations – underside or left‑side mounting using included brackets.
- Desktop Deployment: Can be placed upright or on its side on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast).
2. Install PCI/PCIe cards if required.
3. Connect power input and peripherals.
4. Power on and enter BIOS (DEL key) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
Driver Support: Available from [www.adlinktech.com](http://www.adlinktech.com)
### 7. Performance & Capabilities
| Mode | Power Consumption (24 V DC) | Notes |
|-----------|----------------------------------|-----------|
| Power Off | 2.9 W | Standby mode |
| System Idle | 18.26 W | Windows 7 desktop, no applications |
| Full Load | 52.18 W | 100 % CPU utilization + I/O access |
| Recommended PSU | 160 W | Additional power required for add‑on cards |
Performance Highlights:
- Supports up to 65 W CPU TDP with fanless operation (0 – 50 °C).
- Intel® HD Graphics 530 enables dual 4K DisplayPort outputs.
- Three Intel® I211AT LAN controllers support IEEE 1588 time sync and Energy Efficient Ethernet.
- Watchdog Timer (WDT) hardware reset function for system reliability.
- Digital I/O for real‑time machine control and signal monitoring.
Limitations:
- Fanless operation limited to ambient ≤ 50 °C (35 W CPU) or 40 °C (65 W CPU).
- Add‑on cards may require additional cooling and power budget.
### 8. Standards & Compliance
- EMC: CE & FCC Class A compliant
- Safety: UL/cUL, CB, CCC certified
- Environmental: RoHS and WEEE compliant
- Vibration Resistance: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
- Shock Resistance: 100 Grms half‑sine 11 ms
- ESD Protection: ±4 kV contact, ±8 kV air
ADLINK ensures environmental responsibility through compliance with EU RoHS and WEEE directives, minimizing hazardous substances and promoting recycling at end‑of‑life.
### 9. Additional Information
Warranty & Support:
- Standard manufacturer warranty (terms vary by region)
- Technical support via [Ask an Expert](http://askanexpert.adlinktech.com) and regional service centers
Maintenance:
- Fanless design minimizes moving parts and maintenance needs.
- Periodic dust inspection and connector checks recommended.
- BIOS updates and driver packages available from ADLINK website.
BIOS Features:
- Advanced configuration for CPU, memory, graphics, LAN, and power management.
- Watchdog Timer (WDT) API support for Windows and Linux.
- Digital I/O API library for custom application integration.
Safety Instructions:
- Operate within specified temperature and voltage ranges.
- Disconnect power before servicing or installing components.
- Use only qualified technicians for maintenance and repairs.
Regional Contacts:
- ADLINK Technology, Inc. – New Taipei City, Taiwan (+886‑2‑8226‑5877)
- Ampro ADLINK Technology, Inc. – San Jose, CA, USA (+1‑408‑360‑0200)
- ADLINK Technology (China) Co., Ltd. – Shanghai, China (+86‑21‑5132‑8988)
- LiPPERT ADLINK Technology GmbH – Mannheim, Germany (+49‑621‑43214‑0)
### Summary
The ADLINK MVP‑6022 is a robust, fanless, and highly expandable embedded computer built for industrial automation and edge computing. Powered by the Intel® Core™ i5‑6500TE processor and Q170 chipset, it provides exceptional performance, flexible I/O, and reliable operation in harsh environments. With dual PCIe x8 and dual PCI slots, three Gigabit Ethernet ports, and comprehensive I/O support, the MVP‑6022 is ideal for machine vision, motion control, and data acquisition applications requiring long‑term stability and expandability.
Its fanless design, wide temperature tolerance, and industrial‑grade certifications make it a cost‑effective yet high‑performance solution for demanding automation and edge computing deployments.
### 1. Product Overview
Product Name: MVP‑6022
Model: MVP‑6022
Series: MVP‑6010/6020 Series – Value Family 6th Generation Intel® Core™ Processor‑Based Expandable Fanless Embedded Computers
Article Number: MVP‑6022
Manufacturer: ADLINK Technology, Inc.
Part Number: 50‑1Z214‑1000
Revision: 1.0 (June 23, 2017)
The ADLINK MVP‑6022 is a rugged, fanless, expandable embedded computer designed for industrial automation, machine vision, motion control, and surveillance applications. It belongs to ADLINK’s MVP‑6020 Series, which integrates Intel’s 6th Generation Core™ i5‑6500TE processor and Intel® Q170 chipset, offering high performance, reliability, and expandability in a compact, maintenance‑friendly chassis.
### 2. Key Features
- Processor Platform: 6th Generation Intel® Core™ i5‑6500TE (Skylake, 4 cores, 35 W TDP)
- Chipset: Intel® Q170 Express
- Memory: Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133
- Display Support: Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA
- Expansion Capability:
- 2 × PCIe Gen3 x8 slots (x16 mechanical)
- 2 × PCI 32‑bit slots
- 1 × Mini‑PCIe slot with USIM socket
- Networking: 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN
- I/O Interfaces:
- 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232)
- 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0
- 8 × Digital Input (DI) and 8 × Digital Output (DO) channels
- 1 × Mic‑in, 1 × Line‑out
- Storage:
- 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD
- 1 × Type II CFast socket
- Power Input: 12 – 24 V DC wide‑range input via 3‑pin pluggable connector
- Operating Temperature: 0 °C – 50 °C (fanless operation)
- Construction: Fanless aluminum chassis, front‑accessible I/O, wall‑mountable
- Dimensions: 220 (W) × 210 (D) × 208.7 (H) mm
- Weight: 4.7 kg
The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.
### 3. Technical Specifications
| Category | Specification |
|---------------|------------------|
| Processor | Intel® Core™ i5‑6500TE (4 cores, 4 threads, 2.3 GHz base, 3.3 GHz turbo, 35 W TDP) |
| Chipset | Intel® Q170 Express |
| Graphics | Integrated Intel® HD Graphics 530 |
| Memory | 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133 |
| Storage | 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast socket |
| Expansion Slots | 2 × PCIe Gen3 x8 (x16 mechanical), 2 × PCI 32‑bit, 1 × Mini‑PCIe slot with USIM |
| Ethernet | 3 × Intel® I211AT GbE ports with WOL and teaming |
| Serial Ports | 4 × COM (DB9): 2 × RS‑232/422/485 (BIOS‑selectable), 2 × RS‑232 |
| USB Ports | 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 |
| Digital I/O | 8 × DI (2 – 5.25 V VIH, 0 – 0.8 V VIL), 8 × DO (open‑drain MOSFET, 24 mA sink/source) |
| Audio | 1 × Mic‑in, 1 × Line‑out (Realtek ALC262 codec) |
| Video Outputs | 2 × DisplayPort (4096 × 2304 @ 60 Hz), 1 × DVI‑D (1920 × 1200 @ 60 Hz), 1 × VGA (1920 × 1080 @ 60 Hz) |
| Power Input | 12 – 24 V DC wide‑range input (3‑pin pluggable connector V+, GND, V–) |
| Optional AC Input | 160 W external industrial AC‑DC adapter |
| Dimensions | 220 (W) × 210 (D) × 208.7 (H) mm (8.67″ × 8.27″ × 8.21″) |
| Weight | 4.7 kg (10.36 lb) |
| Mounting | Wall‑mount kit included |
| Operating Temperature | 0 °C – 50 °C (fanless operation) |
| Storage Temperature | –40 °C – 85 °C (excluding HDD/SSD/CFast) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast), 0.5 Grms (HDD), 5 – 500 Hz, 3 axes |
| Shock | 100 Grms, half‑sine 11 ms duration (SSD/CFast) |
| ESD Protection | ±4 kV (contact), ±8 kV (air) |
| EMC Compliance | CE & FCC Class A |
| Safety Certifications | UL/cUL, CB, CCC |
### 4. Functionality
The MVP‑6022 operates as a high‑performance embedded controller for industrial automation and edge computing. It integrates Intel’s Skylake architecture for efficient multitasking and real‑time control. The fanless design ensures silent operation and resistance to dust and vibration, ideal for factory floors or harsh environments.
Use Cases & Applications:
- Machine vision and inspection systems
- Motion control and robotics
- Industrial data acquisition and process control
- Surveillance and security monitoring
- Edge computing and IoT gateway applications
Compatibility:
- Operating Systems: Windows 10 (64‑bit), Windows 7 (32/64‑bit), Windows Embedded Standard 7, Linux
- Supports BIOS‑level configuration for serial modes, LAN PXE boot, and watchdog timer control.
- Compatible with standard PCI/PCIe Gen3 cards and Mini‑PCIe modules (e.g., Wi‑Fi, LTE, GPS).
### 5. Components & Accessories
Included Items:
- MVP‑6022 main unit
- Wall‑mount kit and screw pack
- Accessory pack for HDD installation
- User manual and driver CD
Optional Accessories:
- Fan module (for enhanced cooling in high‑temperature environments)
- DDR4 memory modules (8 GB / 16 GB / 32 GB options)
- 500 GB / 1 TB SATA HDD or 64 GB MLC SSD (factory‑installed)
- 160 W industrial AC‑DC adapter
- DisplayPort to HDMI/DVI/VGA adapter cables (P/N 30‑01119‑0010 to 30‑01121‑0010)
Connectors:
- Front panel I/O includes DisplayPort × 2, DVI‑D, VGA, USB 2.0 × 2, USB 3.0 × 4, 3 × GbE, 4 × COM, 8 DI/8 DO, audio jacks, and DC power input.
- Internal connectors for Mini‑PCIe, SATA, USB 2.0, fan power (9 V and 12 V), and USIM slot.
### 6. Installation & Setup
Requirements:
- 12 – 24 V DC power supply (160 W recommended)
- Stable mounting surface or wall mount brackets
- Adequate ventilation (clear airflow around chassis fins)
Mounting Options:
- Wall‑mount: Two configurations – underside or left‑side mounting using included brackets.
- Desktop Deployment: Can be placed upright or on its side on a stable surface.
Configuration Steps:
1. Install storage device (2.5″ HDD/SSD or CFast).
2. Install PCI/PCIe cards if required.
3. Connect power input and peripherals.
4. Power on and enter BIOS (DEL key) for system configuration.
5. Install drivers (chipset, graphics, Ethernet, audio, USB 3.0, Intel ME, serial I/O).
Driver Support: Available from [www.adlinktech.com](http://www.adlinktech.com)
### 7. Performance & Capabilities
| Mode | Power Consumption (24 V DC) | Notes |
|-----------|----------------------------------|-----------|
| Power Off | 2.9 W | Standby mode |
| System Idle | 18.26 W | Windows 7 desktop, no applications |
| Full Load | 52.18 W | 100 % CPU utilization + I/O access |
| Recommended PSU | 160 W | Additional power required for add‑on cards |
Performance Highlights:
- Supports up to 65 W CPU TDP with fanless operation (0 – 50 °C).
- Intel® HD Graphics 530 enables dual 4K DisplayPort outputs.
- Three Intel® I211AT LAN controllers support IEEE 1588 time sync and Energy Efficient Ethernet.
- Watchdog Timer (WDT) hardware reset function for system reliability.
- Digital I/O for real‑time machine control and signal monitoring.
Limitations:
- Fanless operation limited to ambient ≤ 50 °C (35 W CPU) or 40 °C (65 W CPU).
- Add‑on cards may require additional cooling and power budget.
### 8. Standards & Compliance
- EMC: CE & FCC Class A compliant
- Safety: UL/cUL, CB, CCC certified
- Environmental: RoHS and WEEE compliant
- Vibration Resistance: 5 Grms (SSD/CFast), 0.5 Grms (HDD)
- Shock Resistance: 100 Grms half‑sine 11 ms
- ESD Protection: ±4 kV contact, ±8 kV air
ADLINK ensures environmental responsibility through compliance with EU RoHS and WEEE directives, minimizing hazardous substances and promoting recycling at end‑of‑life.
### 9. Additional Information
Warranty & Support:
- Standard manufacturer warranty (terms vary by region)
- Technical support via [Ask an Expert](http://askanexpert.adlinktech.com) and regional service centers
Maintenance:
- Fanless design minimizes moving parts and maintenance needs.
- Periodic dust inspection and connector checks recommended.
- BIOS updates and driver packages available from ADLINK website.
BIOS Features:
- Advanced configuration for CPU, memory, graphics, LAN, and power management.
- Watchdog Timer (WDT) API support for Windows and Linux.
- Digital I/O API library for custom application integration.
Safety Instructions:
- Operate within specified temperature and voltage ranges.
- Disconnect power before servicing or installing components.
- Use only qualified technicians for maintenance and repairs.
Regional Contacts:
- ADLINK Technology, Inc. – New Taipei City, Taiwan (+886‑2‑8226‑5877)
- Ampro ADLINK Technology, Inc. – San Jose, CA, USA (+1‑408‑360‑0200)
- ADLINK Technology (China) Co., Ltd. – Shanghai, China (+86‑21‑5132‑8988)
- LiPPERT ADLINK Technology GmbH – Mannheim, Germany (+49‑621‑43214‑0)
### Summary
The ADLINK MVP‑6022 is a robust, fanless, and highly expandable embedded computer built for industrial automation and edge computing. Powered by the Intel® Core™ i5‑6500TE processor and Q170 chipset, it provides exceptional performance, flexible I/O, and reliable operation in harsh environments. With dual PCIe x8 and dual PCI slots, three Gigabit Ethernet ports, and comprehensive I/O support, the MVP‑6022 is ideal for machine vision, motion control, and data acquisition applications requiring long‑term stability and expandability.
Its fanless design, wide temperature tolerance, and industrial‑grade certifications make it a cost‑effective yet high‑performance solution for demanding automation and edge computing deployments.
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