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Embedded Systems

Industrial Computers und Embedded Systems sind leistungsstarke Geräte, die speziell für industrielle Anwendungen entwickelt wurden. Sie sind leistungsstark, robust und zuverlässig, und sie können eine Vielzahl von Aufgaben erfüllen, einschließlich der Steuerung und Überwachung industrieller Anlagen. Industrial Computers und Embedded Systems sind auch energieeffizienter als herkömmliche Computer, und sie können in einer Vielzahl von Umgebungen eingesetzt werden.

Unterkategorien

2.2.1 - (Core i7/i5/i3 Embedded) Industrial Computers mit Core i7/i5/i3 Embedded Systemen
2.2.1.1 - (Adlink M-Series) Industriecomputer mit Core i7/i5/i3 Embedded und Adlink M-Series für eingebettete Systeme
2.2.1.2 - (Nuvo-6000/7000/8000-Series) Revolutionizing Industrial Computing with Nuvo-6000/7000/8000-Series Core i7/i5/i3 Embedded Systems
2.2.1.3 - (Nuvo-5000-Series) Erweiterte Leistungsfähigkeit mit Core i7/i5/i3 Embedded Industrial Computers der Nuvo-5000-Serie
2.2.1.4 - (Nuvo-3000-Series) Revolutionizing Industrial Embedded Computing with Nuvo-3000-Series Core i7/i5/i3 Computers
2.2.1.5 - (Nuvo-4000-Series) Maximieren Sie Ihre Leistung mit Core i7/i5/i3 Embedded Industrial Computers und Nuvo-4000-Series Embedded Systems
2.2.1.6 - (Nuvo-2000-Series and others) Revolutionizing Industrial Computing with Core i7/i5/i3 Embedded and Nuvo-2000-Series Solutions
2.2.1.7 - (Embedded with GPU) Industriecomputer mit Core i7/i5/i3 Prozessor und integrierter GPU
2.2.1.8 - (Nuvo-9000-Series) Optimierung industrieller Computertechnik mit Intel® Core™ i9/i7/i5/i3 Embedded-Systemen der Nuvo-9000-Serie
2.2.2 - (Atom Powered Embedded) Industriecomputer mit Atom-Betriebenen Embedded-Systemen
2.2.3 - (ARM Embedded Systems) Industrial Computers und ARM Embedded Systems: Einführung in die Welt der Embedded Systems
2.2.3.1 - (LCD HMI) Revolutionizing Industrial Computer Systems with ARM Embedded Systems and LCD HMIs
2.2.3.2 - (IoT Gateway) Industrial Computers, ARM Embedded Systems & IoT Gateway - Eine Einführung in Embedded Systems
2.2.3.3 - (Automation Controller) Revolutionizing Industrial Automation with ARM Embedded Systems and Industrial Computers
2.2.3.4 - (SBC Modules) Industrial Computers: Exploring ARM Embedded Systems and SBC Modules
2.2.3.5 - (Accessories) Industrial Computing mit Embedded Systems und ARM Embedded Systems - Eine Einführung in die Welt der Zubehörteile
2.2.4 - (IPC Embedded System) Industrielle Computer und eingebettete Systeme: Ein Einblick in das IPC eingebettete System
2.2.5 - (HMI) Revolutionizing Industrial Embedded Systems with Industrial Computers and HMIs
2.2.6 - (Handheld Android 5.0) Revolutionizing Industrial Computing with Embedded Systems and Handheld Android 5.0.
2.2.7 - (Power Modules) Revolutionizing Industrial Computing with Embedded Systems and Power Modules

Produkte

502 Produkte

Nr. Code Produkt Preis Menge
2.2.1.1 Embedded System Cel. 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232 MIX-220-B810M4G500-00
Embedded System Cel. 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232

- **Processor Support:** Intel® Core™ i7/i5/i3 and Celeron® processors (Socket G2, rPGA988B). This model is equipped with an Intel® Celeron® B810 dual‑core CPU at 1.6 GHz, 2 MB L2 cache, 32 nm process, 35 W TDP. - **Chipset:** Intel® QM67 Express Chipset for embedded and industrial applications. - **Graphics:** Integrated Intel® HD Graphics with simultaneous HDMI, DVI‑D, and VGA outputs. - **Memory:** 4 GB DDR3L‑1066 MHz SO‑DIMM (expandable up to 8 GB, dual‑channel). - **Storage:** 1× SD socket (up to 8 GB) and dual 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1. - **Expansion Slots:** 1× PCIe x16, 1× PCI (via riser card), and 1× Mini PCIe slot for wireless or SSD modules. - **Networking:** Dual Intel® Gigabit Ethernet ports (Intel® 82579LM and 82574L controllers) with Wake‑on‑LAN support. - **Serial Communication:** 4× COM ports (3× RS‑232, 1× RS‑232/422/485). - **USB Connectivity:** 6× USB 2.0 ports (2 front, 4 rear). - **Audio:** Realtek ALC892 HD Audio with Mic‑in, Line‑in, and Line‑out. - **Power Supply:** Integrated 250 W FlexATX AC power supply (100–240 VAC input). - **Cooling:** Dual 60 mm fans with removable air filters for easy maintenance. - **Mounting:** Wall‑mount brackets included; optional desktop or rack integration. - **Environmental Compliance:** CE, FCC Class A, and RoHS compliant. - **Operating Temperature:** 0 °C – 50 °C; storage –20 °C – 75 °C. - **Dimensions:** 330 mm (W) × 222 mm (D) × 88 mm (H). - **Weight:** Approx. 4.35 kg (9.6 lb).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Embedded System i7 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232 MIX-220-i727M8G500-00
Embedded System i7 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232

- **Processor Support:** Intel® Core™ i7-2710QE (2.1GHz, 6MB L2 Cache, 45W TDP), with options for i5-2510E, i3-2330E, and Celeron® B810. - **Chipset:** Intel® QM67 Express Chipset for enhanced I/O and graphics integration. - **Graphics:** Integrated Intel® HD Graphics with triple display output (HDMI, DVI-D, VGA). - **Memory:** Dual-channel DDR3 1066/1333MHz SO-DIMM, up to 8GB. - **Storage:** Two 2.5” SATA 6Gb/s drive bays supporting RAID 0/1; anti-shock mounting design. - **Expansion:** 1× PCIe x16 slot, 1× PCI slot (via riser card), and 1× Mini PCIe slot for wireless or SSD modules. - **Networking:** Dual Gigabit Ethernet ports (Intel® 82579LM and 82574L controllers) with Wake-on-LAN support. - **Serial Communication:** Four COM ports (1× RS-232/422/485, 3× RS-232). - **USB Connectivity:** Six USB 2.0 ports (2 front, 4 rear). - **Audio:** Realtek ALC892 HD Audio with Mic-in, Line-in, and Line-out. - **Power Supply:** Integrated 250W FlexATX AC PSU (100–240V AC input). - **Cooling:** Dual 6cm fans with removable air filters for easy maintenance. - **Mounting:** Wall-mount brackets included; optional rack or panel mounting. - **Environmental Tolerance:** Operating temperature 0°C to +50°C; storage -20°C to +75°C. - **Certifications:** CE, FCC Class A, RoHS compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Embedded System Barebone 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232 MIX-220-NNN-00
Embedded System Barebone 1*PCIe*16 1*PCI 6*USB 2*GbE 4*RS232

- **Processor Support:** Intel® Core™ i7‑2710QE, i5‑2510E, i3‑2330E, and Celeron® B810 (Socket G2, rPGA988B package). - **Chipset:** Intel® QM67 Express Chipset. - **Graphics:** Integrated Intel® HD Graphics with triple display output (HDMI, DVI‑D, VGA). - **Memory:** Dual‑channel DDR3 1066/1333 MHz SO‑DIMM, up to 8 GB. - **Storage:** Two 2.5″ SATA 6 Gb/s drive bays supporting RAID 0/1; anti‑shock mounting design. - **Expansion:** - 1 × PCI Express x16 slot - 1 × PCI slot (via riser card) - 1 × Mini PCI Express slot (for SSD or wireless module) - **Networking:** Dual Intel® Gigabit Ethernet ports (82579LM and 82574L controllers) with Wake‑on‑LAN. - **I/O Interfaces:** - 6 × USB 2.0 (2 front, 4 rear) - 4 × Serial ports (3 × RS‑232, 1 × RS‑232/422/485) - 3 × Audio jacks (Mic‑in, Line‑in, Line‑out) - **Power Supply:** 250 W FlexATX AC PSU (100–240 V AC input). - **Cooling:** Dual 60 mm fans with replaceable air filters. - **Mounting:** Wall‑mount brackets included; optional antenna hole for WLAN. - **Operating Temperature:** 0 °C – 50 °C. - **Certifications:** CE, FCC Class A, RoHS compliant. - **Form Factor:** Compact 2U chassis (330 × 222 × 88 mm).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO MVP-5001
Core i7-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO

- **Processor:** 6th Generation Intel® Core™ i7‑6700TE, Quad‑Core, 2.4 GHz (Turbo up to 3.4 GHz), 8 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (2 × 16 GB). - **Graphics:** Integrated Intel® HD Graphics 530 supporting up to three independent displays. - **Display Interfaces:** - 2 × DisplayPort 1.2 (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (1920 × 1080 @ 60 Hz) - 1 × VGA (1920 × 1200 @ 60 Hz) - **Ethernet:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN. - **Serial Communication:** - 2 × software‑selectable RS‑232/422/485 (COM1 & COM2) with auto‑flow control - 2 × RS‑232 (COM3 & COM4) - 2 kV surge protection on RS‑422/485 lines - **USB Connectivity:** - 4 × USB 3.0 (Type A) - 2 × USB 2.0 (Type A) - 1 × internal USB 2.0 (optional) - Each port supports up to 1.6 A current output. - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **Expansion:** 1 × Mini PCIe slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Storage:** - 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD - 1 × Type II CFast slot (external, rear‑mounted) - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Fanless Design:** Passive cooling for silent, dust‑resistant operation. - **Mounting:** Wall‑mount kit included. - **Software Support:** Windows 7 Pro, Windows Embedded Standard 7, Windows 10 IoT Enterprise, and Linux (Ubuntu 12.04/Fedora 18 on request). - **Certifications:** CE, FCC Class A, UL/cUL, CB, RoHS, WEEE compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO MVP-5002
Core i5-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO

- **Processor:** 6th Generation Intel® Core™ i5‑6500TE, Quad‑Core, 2.3 GHz (Turbo up to 3.3 GHz), 6 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual DDR4‑2133 MHz SO‑DIMM sockets, up to 32 GB total capacity. - **Graphics:** Integrated Intel® HD Graphics 530 supporting up to three independent displays. - **Display Interfaces:** - 2 × DisplayPort 1.2 (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (1920 × 1080 @ 60 Hz) - 1 × VGA (1920 × 1200 @ 60 Hz) - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN. - **Serial Communication:** 2 × software‑selectable RS‑232/422/485 ports (COM1/2) and 2 × RS‑232 ports (COM3/4). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 (optional). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output. - **Expansion:** 1 × Mini PCIe slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Storage:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector. - **Cooling:** Fanless passive thermal design for silent, dust‑resistant operation. - **Mounting:** Wall‑mount kit included. - **Operating Temperature:** 0 °C – 50 °C (industrial SSD recommended). - **Software Support:** Windows 7 Pro, Windows 10 IoT Enterprise, Linux (Ubuntu 12.04/Fedora 18 on request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO MVP-5003/M4G
Core i3-H110 fanless 2*Dport 3*GbE 6*USB 8*DIO

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake) dual‑core CPU, 2.7 GHz, 4 MB L3 cache. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Dual‑channel DDR4‑2133 MHz SO‑DIMM sockets, supporting up to 32 GB (4 GB standard). - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to three independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. - **Fanless Design:** Completely fanless thermal solution for silent operation and high reliability in dusty or vibration‑prone environments. - **Networking:** Three Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN (WOL) support. - **Serial Communication:** Four COM ports (2 × software‑selectable RS‑232/422/485 with auto‑flow control, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports (1.6 A each), and 1 × internal USB 2.0 (optional). - **Storage Options:** 1 × SATA III (6 Gb/s) port for 2.5″ HDD/SSD, 1 × Type II CFast slot (rear‑mounted). - **Expansion:** 1 × Mini PCI Express slot with USIM socket for wireless modules (Wi‑Fi, 3G, 4G/LTE). - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Mounting:** Wall‑mount kit included. - **Construction:** Compact, industrial‑grade aluminum chassis with front‑accessible I/O.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Coffee Lake-S Fanless Embedded IPC MVP-5100
Coffee Lake-S Fanless Embedded IPC

- **Fanless Industrial Design:** Completely fanless architecture ensures silent operation, reduced maintenance, and enhanced reliability in dusty or vibration-prone environments. - **Intel® Coffee Lake-S Platform:** Supports 8th and 9th Generation Intel® Core™ i7/i5/i3 and Xeon® E processors (LGA1151 socket), delivering high computing performance for industrial workloads. - **High Expandability:** Offers multiple PCI/PCIe expansion slots for add-on cards such as frame grabbers, motion controllers, or data acquisition modules. - **Rich I/O Connectivity:** Includes multiple Gigabit Ethernet ports, USB 3.1/2.0, serial ports (RS-232/422/485), and display outputs (DisplayPort, HDMI, DVI, or VGA depending on configuration). - **Wide Operating Temperature Range:** Designed for reliable operation in extended temperature environments, typically from -20°C to +60°C (depending on CPU and storage configuration). - **Shock and Vibration Resistance:** Built to meet industrial-grade mechanical standards for deployment in factory floors, vehicles, or outdoor enclosures. - **Flexible Storage Options:** Supports 2.5" SATA drives, M.2, and mSATA SSDs for flexible storage configurations. - **Dual Independent Display Support:** Enables simultaneous output to two displays for monitoring or control interfaces. - **Long Lifecycle Support:** Industrial-grade components and extended product availability ensure long-term deployment stability. - **Power Efficiency:** Optimized thermal design and power management for continuous 24/7 operation.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE MVP-6001/M4G
Core i7-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE

- **Processor:** 6th Generation Intel® Core™ i7‑6700TE (Skylake) Quad‑Core CPU, 2.4 GHz base frequency, 8 MB cache, up to 3.4 GHz Turbo Boost. - **Chipset:** Intel® H110 Platform Controller Hub. - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Graphics:** Integrated Intel® HD Graphics 530 with support for dual independent displays. - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion:** - 1 × PCIe x16 (Gen 3) - 1 × PCI (32‑bit, 33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE boot, and IEEE 1588 support. - **Storage:** - 1 × internal SATA III (6 Gb/s) for 2.5″ HDD/SSD - 1 × rear CFast slot (Type II, SATA interface) - **USB Connectivity:** - 4 × USB 3.0 (front) - 2 × USB 2.0 (front) - 1 × internal USB 2.0 (Type A) - **Serial Communication:** - 2 × software‑selectable RS‑232/422/485 (COM1, COM2) - 2 × RS‑232 (COM3, COM4) - **Digital I/O:** 8 × DI and 8 × DO channels (non‑isolated). - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector. - **Cooling:** Fanless design with optional smart fan module for PCI/PCIe card heat dissipation. - **Operating Temperature:** 0 °C – 50 °C (with industrial SSD). - **Mounting:** Wall‑mount kit included. - **Dimensions:** 220 (W) × 210 (D) × 170 (H) mm. - **Weight:** 4.5 kg.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE MVP-6002/M4G
Core i5-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE

- **Processor:** Intel® Core™ i5‑6500TE Quad‑Core CPU (2.3 GHz base, 3.3 GHz Turbo, 6 MB cache) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz - **Graphics:** Integrated Intel® HD Graphics 530 with support for dual independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion:** - 1 × PCIe x16 Gen3 slot - 1 × PCI 32‑bit slot (33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE boot, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast Type II socket (SATA interface, 3.0 Gb/s) - **I/O Interfaces:** - 4 × USB 3.0 (Type A) - 2 × USB 2.0 (Type A) + 1 × internal USB 2.0 - 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232) - 8 × Digital Input + 8 × Digital Output channels - 1 × Mic‑in and 1 × Line‑out audio - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C to 50 °C (fanless, with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Fanless aluminum chassis for dust‑resistant, low‑noise operation

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE MVP-6003/M4G
Core i3-H110 fanless 2*Dport, 1*PCI 1*PCIe*16 3*GbE

- **Processor:** 6th Generation Intel® Core™ i3‑6100TE (2.7 GHz, 4 MB cache, dual‑core) - **Chipset:** Intel® H110 Mobile Platform Controller Hub - **Memory:** Two DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 - **Graphics:** Integrated Intel® HD Graphics 530 with support for up to two independent displays - **Display Interfaces:** - 2 × DisplayPort (up to 4096 × 2304 @ 60 Hz) - 1 × DVI‑D (up to 4096 × 2160 @ 60 Hz) - 1 × VGA (up to 1920 × 1200 @ 60 Hz) - **Expansion Slots:** - 1 × PCIe x16 (Gen 3) - 1 × PCI (32‑bit, 33 MHz) - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211‑AT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, PXE, and IEEE 1588 support - **Storage:** - 1 × internal SATA III (6 Gb/s) port for 2.5″ HDD/SSD - 1 × rear CFast slot (Type II, SATA interface) - **USB Connectivity:** - 4 × USB 3.0 (external, Type A) - 2 × USB 2.0 (external, Type A) - 1 × internal USB 2.0 (Type A) - **Serial Communication:** - 2 × software‑programmable RS‑232/422/485 ports (COM1, COM2) - 2 × RS‑232 ports (COM3, COM4) - **Digital I/O:** 8 × DI and 8 × DO channels (non‑isolated, open‑drain MOSFET outputs) - **Audio:** 1 × Mic‑in, 1 × Line‑out - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C – 50 °C (fanless operation with industrial SSD) - **Mounting:** Wall‑mount kit included - **Construction:** Rugged aluminum chassis, fanless thermal design

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i7-6700TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6011
i7-6700TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700TE (quad-core, 2.4 GHz, 35W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance in harsh industrial environments. - **Memory:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Support:** Up to two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA ports. - **Expansion Capability:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit expansion slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 50°C (fanless operation). - **Mounting:** Wall-mount kit included. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg. - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i5-6500TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6012
i5-6500TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6500TE (quad‑core, 2.3 GHz, 35 W TDP) with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust‑resistant, and maintenance‑free performance. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Graphics:** Integrated Intel® HD Graphics 530 supporting dual independent displays. - **Display Interfaces:** 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA, supporting resolutions up to 4096 × 2304 @ 60 Hz. - **Expansion Capability:** - 1 × PCIe Gen3 x16 slot - 3 × PCI 32‑bit slots - 1 × Mini PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD and 1 × Type II CFast socket. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (fanless operation). - **Mounting:** Wall‑mount kit included. - **Construction:** Rugged aluminum chassis for industrial environments. - **Software Support:** Windows 10 / 7 / Embedded Standard 7 and Linux.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i3-6100TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6013
i3-6100TE H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i3‑6100TE (Skylake architecture, dual‑core, 35 W TDP) with Intel® HD Graphics 530 GPU. Supports Intel® Core™ i5‑6500TE and i7‑6700TE variants in the same series. - **Chipset:** Intel® H110 Express chipset (MVP‑6010 series). - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. Maximum resolutions: - DisplayPort: 4096 × 2304 @ 60 Hz - DVI‑D: 1920 × 1200 @ 60 Hz - VGA: 1920 × 1080 @ 60 Hz - **Expansion Capability:** 1 × PCIe Gen3 x16 slot and 3 × PCI 32‑bit slots for legacy and modern add‑on cards. 1 × Mini‑PCIe slot with USIM socket for wireless or communication modules. - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with Wake‑on‑LAN (WOL) and teaming support. - **Serial Communication:** 4 × COM ports (DB‑9): - 2 × software‑selectable RS‑232/422/485 (COM1, COM2) - 2 × RS‑232 (COM3, COM4) - RS‑485 auto‑flow control and 2 kV surge protection on RS‑422/485 lines. - **Digital I/O:** 8‑channel digital input (DI) and 8‑channel digital output (DO), open‑drain MOSFET type, 24 mA per channel. - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external ports, and 1 × internal USB 2.0 port (all 1600 mA capable). - **Storage Options:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, and 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–). Optional 160 W AC‑DC adapter for AC input. - **Mechanical Design:** Fanless aluminum chassis with front‑accessible I/O for simplified maintenance. Wall‑mount kit included. - **Operating Environment:** Fanless operation from 0 °C to 50 °C (with 35 W CPU). Storage temperature: –40 °C to 85 °C (excluding HDD/SSD/CFast). Humidity: 95 % @ 40 °C (non‑condensing).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i7-6700 H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE MVP-6015
i7-6700 H110 fanless 2*Dport, 3*PCI 1*PCIe*16 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7-6700 (65W) Skylake CPU with Intel® H110 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance. - **Memory Support:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Capability:** Supports two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA outputs. - **Expansion Slots:** - 1× PCIe Gen3 x16 slot - 3× PCI 32-bit slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio Interface:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 40°C (for 65W CPU). - **Mounting:** Wall-mount kit included for flexible installation. - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm. - **Weight:** 4.7 kg (10.36 lbs). - **Certifications:** CE, FCC Class A, UL/cUL, CB, CCC compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i7-6700TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6021
i7-6700TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors with Intel® Q170 chipset. - **Memory:** Dual-channel DDR4 SO-DIMM sockets supporting up to 32 GB DDR4 2133 MHz memory. - **Display Support:** Up to two independent displays via 2× DisplayPort, 1× DVI-D, and 1× VGA ports. - **Expansion Capability:** - 2× PCIe Gen3 x8 slots - 2× PCI 32-bit slots - 1× internal Mini PCIe slot with USIM socket - **Networking:** 3× Intel® I211AT Gigabit Ethernet ports with teaming and Wake-on-LAN (WOL) support. - **Serial Communication:** 4× COM ports (2× RS-232/422/485 software-selectable, 2× RS-232). - **Digital I/O:** 8-channel digital input and 8-channel digital output. - **USB Connectivity:** 4× USB 3.0, 2× USB 2.0 external ports, and 1× internal USB 2.0 port. - **Storage Options:** 1× SATA III (6 Gb/s) port for 2.5" HDD/SSD and 1× Type II CFast socket. - **Audio:** 1× Mic-in and 1× Line-out. - **Power Input:** Wide-range 12–24 VDC input via 3-pin pluggable connector with latch. - **Operating Temperature:** 0°C to 50°C (fanless operation). - **Mounting:** Wall-mount kit included. - **Construction:** Rugged, fanless aluminum chassis for industrial environments. - **Software Support:** Windows® 10/7/Embedded Standard 7 and Linux. - **Optional Accessories:** Fan module, DDR4 memory upgrades, HDD/SSD options, and 160W AC-DC adapter.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i5-6500TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6022
i5-6500TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i5‑6500TE (Skylake, 4 cores, 35 W TDP) - **Chipset:** Intel® Q170 Express - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets, up to 32 GB DDR4‑2133 - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA - **Expansion Capability:** - 2 × PCIe Gen3 x8 slots (x16 mechanical) - 2 × PCI 32‑bit slots - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN - **I/O Interfaces:** - 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232) - 4 × USB 3.0, 2 × USB 2.0 external, 1 × internal USB 2.0 - 8 × Digital Input (DI) and 8 × Digital Output (DO) channels - 1 × Mic‑in, 1 × Line‑out - **Storage:** - 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD - 1 × Type II CFast socket - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector - **Operating Temperature:** 0 °C – 50 °C (fanless operation) - **Construction:** Fanless aluminum chassis, front‑accessible I/O, wall‑mountable - **Dimensions:** 220 (W) × 210 (D) × 208.7 (H) mm - **Weight:** 4.7 kg The MVP‑6022 delivers high computing performance with Intel® HD Graphics 530, supports dual independent displays, and provides robust I/O and expansion options for industrial environments requiring reliability and long lifecycle operation.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i3-6100TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6023
i3-6100TE Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Support:** 6th Generation Intel® Core™ i7/i5/i3 (Skylake) processors; MVP‑6023 specifically equipped with Intel® Core™ i3‑6100TE (dual‑core, 3.2 GHz, 35 W TDP). - **Chipset:** Intel® Q170 Express for extended I/O and industrial‑grade reliability. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz. - **Display Capability:** Supports two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA; maximum resolution up to 4096 × 2304 @ 60 Hz. - **Expansion Slots:** - 2 × PCIe Gen3 x8 (mechanical x16 slots with x8 signals) - 2 × PCI 32‑bit/33 MHz slots - 1 × Mini‑PCIe slot with USIM socket - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232). - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (non‑isolated). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Interfaces:** 1 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, 1 × Type II CFast slot. - **Audio:** 1 × Mic‑in, 1 × Line‑out. - **Power Input:** 12 – 24 V DC wide‑range input via 3‑pin pluggable connector with latch. - **Operating Temperature:** 0 °C – 50 °C (fanless operation with 35 W CPU). - **Mounting:** Wall‑mount kit included. - **Construction:** Rugged fanless aluminum chassis for high MTBF and silent operation.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 i7-6700 Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE MVP-6025
i7-6700 Q170 fanless 2*Dport, 2*PCI 2*PCIe*8 3*GbE

- **Processor Platform:** 6th Generation Intel® Core™ i7‑6700 (quad‑core, 3.4 GHz base, 4.0 GHz turbo, 65 W TDP) with Intel® Q170 chipset. - **Memory:** Dual‑channel DDR4 SO‑DIMM sockets supporting up to 32 GB DDR4‑2133 MHz memory. - **Display Support:** Up to two independent displays via 2 × DisplayPort, 1 × DVI‑D, and 1 × VGA. Maximum resolutions: - DisplayPort: 4096 × 2304 @ 60 Hz - DVI‑D: 1920 × 1200 @ 60 Hz - VGA: 1920 × 1080 @ 60 Hz - **Expansion Capability:** 4 total slots: 2 × PCIe Gen3 x8 (x16 mechanical) and 2 × PCI 32‑bit slots. - **Networking:** 3 × Intel® I211AT Gigabit Ethernet ports with teaming and Wake‑on‑LAN support. - **Serial Communication:** 4 × COM ports (2 × RS‑232/422/485 software‑selectable, 2 × RS‑232), with 2 kV surge protection on RS‑422/485 lines. - **Digital I/O:** 8‑channel digital input and 8‑channel digital output (open‑drain MOSFET, 24 mA sink/source). - **USB Connectivity:** 4 × USB 3.0, 2 × USB 2.0 external, and 1 × internal USB 2.0 port (all 1600 mA). - **Storage Interfaces:** 1 × SATA III 6 Gb/s port for 2.5″ HDD/SSD, 1 × Type II CFast slot, and 1 × Mini‑PCIe slot with USIM socket. - **Audio:** 1 × Mic‑in and 1 × Line‑out. - **Power Input:** Wide‑range 12 – 24 V DC input via 3‑pin pluggable connector (V+, GND, V–). - **Operating Environment:** Fanless operation from 0 °C – 40 °C (with 65 W CPU). - **Mechanical Design:** Rugged aluminum chassis with wall‑mount kit included; front‑accessible I/O for simplified maintenance. - **Reliability:** Fanless design eliminates moving parts, improving MTBF and reducing maintenance in harsh environments.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Coffee Lake-S Fanless Configurable IPC with PCIe / PCI MVP-6100
Coffee Lake-S Fanless Configurable IPC with PCIe / PCI

- **Processor Platform:** Supports Intel® 8th/9th Generation Core™ i7/i5/i3 and Pentium®/Celeron® processors (Coffee Lake-S) with Intel® Q370 chipset. - **Fanless Design:** Completely fanless thermal solution for silent operation and enhanced reliability in dusty or vibration-prone environments. - **Flexible Expansion:** Configurable with PCIe and/or PCI slots for add-on cards, supporting legacy and modern industrial interfaces. - **High Performance:** Up to 6-core/12-thread CPU support with integrated Intel® UHD Graphics 630 for advanced visual computing. - **Rich I/O Connectivity:** Multiple Gigabit Ethernet ports, USB 3.1/2.0, serial ports, and display outputs (DisplayPort, DVI, VGA). - **Wide Operating Temperature:** Typically -20°C to +60°C (depending on configuration and storage type). - **Industrial-Grade Reliability:** Shock and vibration resistance, wide voltage input, and long product lifecycle support. - **Storage Flexibility:** Supports 2.5" SATA drives, M.2, and optional RAID configurations. - **Power Input:** 9–36 VDC wide-range power input with over-voltage and reverse polarity protection. - **Mounting Options:** Wall-mount, DIN-rail, or desktop installation. - **Software Compatibility:** Supports Windows 10 IoT Enterprise, Linux, and other industrial OS environments.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM57 fanless 2*PCI MXC-6101D
Core i7-QM57 fanless 2*PCI

- **Processor & Chipset:** Intel® Core™ i7‑620LE 2.0 GHz dual‑core CPU with Intel® QM57 chipset. - **Fanless Operation:** Completely fanless design for silent, maintenance‑free operation; optional hot‑pluggable fan module for high‑power PCI cards. - **Expansion Capability:** Two full‑length PCI slots for add‑on cards (MXC‑6101D variant). - **Display Support:** DVI‑I connector supporting both digital DVI‑D and analog VGA output (up to QXGA 2048 × 1536 resolution). - **Memory:** One DDR3 SO‑DIMM socket, supporting up to 4 GB DDR3‑800/1066 MHz. - **Storage:** Dual SATA ports for 2.5″ HDD/SSD, one eSATA port, and dual CompactFlash sockets (internal and external). - **Networking:** Dual Intel® 82574L Gigabit Ethernet ports (10/100/1000 Mbps). - **Serial Communication:** Four COM ports — two RS‑232/422/485 software‑selectable and two RS‑232. - **USB Connectivity:** Four external USB 2.0 ports and one internal USB 2.0 port on riser card. - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (2500 V RMS isolation). - **Audio:** Realtek ALC262 HD Audio codec (mic‑in and line‑out). - **Power Input:** 9 VDC – 32 VDC wide‑range input with 3‑pin pluggable connector. - **Environmental Robustness:** Operating temperature 0 – 50 °C (standard) or ‑10 – 60 °C (with industrial SSD/RAM). - **Mechanical Design:** Cable‑free internal layout, vibration‑resistant structure, wall‑mountable chassis. - **Certifications:** CE and FCC compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM57 fanless 1*PCI 1*PCIe MXC-6201D
Core i7-QM57 fanless 1*PCI 1*PCIe

- **Processor & Chipset:** Intel® Core™ i7‑620LE 2.0 GHz dual‑core CPU with Intel® QM57 chipset. - **Fanless, Cable‑Free Design:** Passive cooling architecture for silent, maintenance‑free operation. - **Expansion Capability:** One PCI 32‑bit slot and one PCIe x4 slot for add‑on cards. - **Wide‑Range Power Input:** 9 V DC – 32 V DC input with AT/ATX mode support. - **Display Interfaces:** DVI‑I connector supporting both DVI‑D and analog VGA via Y‑cable; optional 48‑bit LVDS internal header. - **Networking:** Dual Intel® 82574L Gigabit Ethernet controllers supporting 10/100/1000 Mbps. - **Serial Communication:** Two software‑selectable RS‑232/422/485 ports and two RS‑232 ports. - **USB Connectivity:** Four external USB 2.0 ports and one internal USB 2.0 port on riser card. - **Digital I/O:** 16‑channel isolated digital input and 16‑channel isolated digital output (2500 V RMS isolation). - **Storage Options:** Two SATA II/III ports for 2.5″ HDD/SSD, one eSATA port, and dual CompactFlash sockets (internal and external). - **Audio:** Realtek ALC262 HD audio codec with mic‑in and line‑out. - **Environmental Robustness:** Operating temperature 0 – 50 °C (standard) or –10 – 60 °C (extended with industrial SSD/CF). - **Mechanical Reliability:** 5 Grms vibration resistance (SSD/CF), 50 G shock tolerance, CE/FCC compliance. - **Optional Cooling:** Hot‑pluggable fan module for high‑power PCI/PCIe cards. - **Mounting:** Wall‑mount kit included. - **Security:** Internal USB port for license dongles or encryption keys.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6301D
Core i7-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Platform:** 3rd Generation Intel® Core™ i7/i5/i3 (Ivy Bridge) processors with Intel® QM77 Mobile PCH. - **CPU Model:** Intel® Core™ i7‑3610QE, Quad‑Core, 2.3 GHz (Turbo up to 3.3 GHz), 6 MB cache. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz. - **Expansion:** Configurable 1 × PCI + 2 × PCIe ×8 or 1 × PCI + 1 × PCIe ×16 (Gen 2) slots. - **Display:** Triple independent display support via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600). - **Storage:** Dual onboard SATA III (6 Gb/s) ports for 2.5″ HDD/SSD with RAID 0/1; dual CFast sockets (internal + external). - **Networking:** Two Intel® Gigabit Ethernet ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and Intel AMT 8.0/11.0 support. - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - 1 × Mic‑in, 1 × Line‑out (Realtek ALC269 HD Audio) - 1 × PS/2 keyboard, 1 × PS/2 mouse - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off. - **Design:** Fanless, cable‑free architecture for high reliability and low maintenance. - **Operating Temperature:** - Standard: 0 °C – 50 °C (with HDD) - Extended: –20 °C – 55 °C (with industrial SSD/CFast) - **Certifications:** CE/FCC Class A, UL/cUL, CB, KCC, RoHS, WEEE compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6302D
Core i5-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **High‑Performance CPU:** Intel® Core™ i5‑3610ME dual‑core processor, 2.7 GHz base frequency (3.3 GHz Turbo), 3 MB cache. - **Chipset:** Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3 1600 MHz. - **Fanless Design:** Completely fanless and cable‑free architecture for silent operation and high reliability in harsh environments. - **Expansion Flexibility:** - 1 × PCI slot - 2 × PCIe x8 slots or 1 × PCIe x16 slot (auto‑switching, PCIe Gen 2) - **Triple Independent Display:** Two DisplayPort 1.1a and one DVI‑I port supporting up to three simultaneous displays. - **Storage:** - 2 × SATA III (6 Gb/s) ports for 2.5″ HDD/SSD - RAID 0/1 support - 2 × CFast sockets (1 external + 1 internal) - **Networking:** - 2 × Intel GbE ports (Intel I210IT + 82579LM) - Teaming, Wake‑on‑LAN, and Intel iAMT 8.0/11.0 support - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated DI + 16‑channel isolated DO (1.5 kV isolation) - 1 × Mic‑in, 1 × Line‑out, 1 × PS/2 keyboard, 1 × PS/2 mouse - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off. - **Operating Temperature:** - Standard: 0 °C – 50 °C - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Rugged Construction:** Aluminum alloy chassis, vibration‑resistant, shock‑resistant, and EMC‑compliant. - **Optional Fan Module:** Smart‑controlled fan for additional cooling when high‑power PCI/PCIe cards are installed.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6303D
Core i3-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Support:** 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture). MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache. - **Chipset:** Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0. - **Memory:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Display:** Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz). - **Expansion:** 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2). - **Storage:** Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external). - **Networking:** 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0. - **I/O Interfaces:** - 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal) - 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation) - Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio) - PS/2 keyboard and mouse ports - **Power Input:** 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch. - **Design:** Completely fanless and cable‑free for high reliability in harsh environments. - **Operating Temperature:** - Standard: 0 °C – 50 °C (with HDD) - Extended: –20 °C – 60 °C (with industrial SSD/CFast) - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC. - **Mounting:** Wall‑mount kit included.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Celeron-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16 MXC-6305D
Celeron-QM77 fanless 2*Dport, 1*PCI 2*PCIe*8 or 1*PCIe*16

- **Processor Platform:** Intel® Celeron® 1020E (2.2 GHz, 2 MB cache) with Intel® QM77 Mobile Platform Controller Hub. - **Fanless Architecture:** Completely fanless and cable‑free design for enhanced reliability and silent operation. - **Memory Support:** Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory. - **Expansion Flexibility:** - 1 × PCI slot - 2 × PCIe ×8 slots or 1 × PCIe ×16 slot (auto‑switching) - PCIe Gen 2 compliance for high‑bandwidth add‑on cards. - **Triple Independent Display:** - 2 × DisplayPort and 1 × DVI‑I output - Resolutions up to 2560 × 1600 (DP1), 1920 × 1600 (DP2), and 1920 × 1200 (DVI‑I). - **Storage Options:** - 2 × SATA III ports for 2.5″ HDD/SSD (6 Gb/s) - RAID 0/1 support for performance or redundancy - 2 × CFast sockets (1 external, 1 internal). - **Networking:** - 1 × Intel® I219 and 2 × Intel® I210IT Gigabit Ethernet ports - Teaming function, Wake‑on‑LAN, and Intel® AMT 11.0 support. - **Rich I/O Interface:** - 2 × RS‑232/422/485 (software‑selectable) - 2 × RS‑232 - 4 × USB 3.0, 2 × USB 2.0, 1 × internal USB 2.0 - 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation). - **Audio & Peripheral Support:** - Realtek ALC269 HD Audio (Mic‑in, Line‑out) - PS/2 keyboard and mouse ports. - **Power Input:** Wide‑range 9 – 32 V DC input with pluggable connector and remote on/off switch. - **Environmental Robustness:** - Operating temperature: 0 – 50 °C (standard) - Extended: –20 – 55 °C (with industrial SSD/RAM) - Vibration: 5 Grms (SSD/CFast) - Shock: 50 G, 11 ms half‑sine. - **Compact Rugged Design:** 172.5 (W) × 225 (D) × 213 (H) mm, weight 4.3 kg. - **Certifications:** CE, FCC Class A, UL/cUL, CB, KCC.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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