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- Processor Support: 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture).
MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache.
- Chipset: Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Display: Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz).
- Expansion: 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2).
- Storage: Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external).
- Networking: 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0.
- I/O Interfaces:
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio)
- PS/2 keyboard and mouse ports
- Power Input: 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch.
- Design: Completely fanless and cable‑free for high reliability in harsh environments.
- Operating Temperature:
- Standard: 0 °C – 50 °C (with HDD)
- Extended: –20 °C – 60 °C (with industrial SSD/CFast)
- Certifications: CE, FCC Class A, UL/cUL, CB, KCC.
- Mounting: Wall‑mount kit included.
MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache.
- Chipset: Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Display: Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz).
- Expansion: 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2).
- Storage: Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external).
- Networking: 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0.
- I/O Interfaces:
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio)
- PS/2 keyboard and mouse ports
- Power Input: 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch.
- Design: Completely fanless and cable‑free for high reliability in harsh environments.
- Operating Temperature:
- Standard: 0 °C – 50 °C (with HDD)
- Extended: –20 °C – 60 °C (with industrial SSD/CFast)
- Certifications: CE, FCC Class A, UL/cUL, CB, KCC.
- Mounting: Wall‑mount kit included.
Comprehensive Product Summary: ADLINK MXC‑6303D Fanless Expandable Embedded Computer
### 1. Product Overview
Product Name: MXC‑6303D
Model: MXC‑6303D
Series: Matrix MXC‑6300/6310/6320 Series
Article Number: MXC‑6303D
Manufacturer: ADLINK Technology, Inc.
Product Type: Fanless expandable embedded computer with PCI/PCIe expansion slots
Processor Platform: Intel® Core™ i3‑3120ME (3rd Generation Ivy Bridge)
Chipset: Intel® QM77 Mobile Platform Controller Hub
The MXC‑6303D is part of ADLINK’s Matrix MXC‑6300 series of rugged, fanless embedded computers designed for industrial automation, machine vision, transportation, and other mission‑critical applications. It integrates a 3rd‑generation Intel® Core™ i3 processor and QM77 chipset, providing high computing performance, multiple expansion options, and wide‑range DC power input in a compact, cable‑free chassis.
### 2. Key Features
- Processor Support: 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture).
MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache.
- Chipset: Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Display: Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz).
- Expansion: 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2).
- Storage: Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external).
- Networking: 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0.
- I/O Interfaces:
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio)
- PS/2 keyboard and mouse ports
- Power Input: 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch.
- Design: Completely fanless and cable‑free for high reliability in harsh environments.
- Operating Temperature:
- Standard: 0 °C – 50 °C (with HDD)
- Extended: –20 °C – 60 °C (with industrial SSD/CFast)
- Certifications: CE, FCC Class A, UL/cUL, CB, KCC.
- Mounting: Wall‑mount kit included.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑3120ME, Dual Core 2.4 GHz, 3 MB cache |
| Chipset | Intel® QM77 Mobile PCH |
| Memory | 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3‑1600 |
| Graphics | Intel® HD Graphics 4000 integrated GPU |
| Display Outputs | 2 × DisplayPort (2560×1600 / 1920×1200) + 1 × DVI‑I (1920×1200) |
| Expansion Slots | 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (Gen 2) |
| Ethernet | 2 × Intel GbE (I210IT + 82579LM), teaming, Wake‑on‑LAN, iAMT 8.0 |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2) + 2 × RS‑232 (COM3/4) |
| USB Ports | 4 × USB 3.0 + 2 × USB 2.0 (external) + 1 × USB 2.0 (internal) |
| Digital I/O | 16 × DI + 16 × DO (1.5 kV isolation, MOSFET outputs 100 mA sustained) |
| Audio | Realtek ALC269 HD Audio (24‑bit/192 kHz), Mic‑in + Line‑out |
| Storage | 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, RAID 0/1; 2 × CFast sockets |
| Power Input | 9 – 32 V DC input (3‑pin pluggable connector with latch) |
| Optional AC Adapter | 160 W AC‑DC adapter (–20 °C to 70 °C rated) |
| Dimensions | 172.5 (W) × 225 (D) × 213 (H) mm (6.79″ × 8.86″ × 8.39″) |
| Weight | 4.3 kg (9.48 lb) |
| Operating Temperature | 0 °C – 50 °C standard; –20 °C – 60 °C with industrial SSD/CFast |
| Storage Temperature | –40 °C – 85 °C (excluding HDD) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast) / 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 50 G, 11 ms half‑sine (SSD/CFast) |
| ESD Protection | ±4 kV contact, ±8 kV air |
| EMC/Safety | CE, FCC Class A, UL/cUL, CB, KCC |
### 4. Functionality
The MXC‑6303D operates as a high‑performance embedded controller for industrial and automation systems. Its fanless design ensures silent, maintenance‑free operation in environments with dust, vibration, or temperature extremes. The system’s modular expansion architecture allows integration of PCI/PCIe cards for motion control, frame grabbers, data acquisition, or communication interfaces.
Typical Applications:
- Factory and machine automation
- Machine vision and image processing
- Intelligent transportation and surveillance
- Maritime and navigation control
- High‑resolution medical imaging
Compatibility:
- Operating Systems: Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, Linux.
- Supports Intel® AMT 8.0/11.0 for remote management and diagnostics.
- RAID 0/1 support for data redundancy or performance optimization.
- BIOS configurable for IDE, AHCI, or RAID modes.
### 5. Components & Accessories
Included Items:
- MXC‑6303D main unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (drivers & utilities)
Optional Accessories:
- Fan Module: Smart‑controlled fan for additional cooling when high‑power PCI/PCIe cards are installed.
- Storage Options: Factory‑installed 500 GB/1 TB HDD or 32/64 GB MLC SSD.
- Power Adapter: 160 W industrial AC‑DC adapter (–20 °C to 70 °C).
- Cabling: DIN‑68S‑01 and ACL‑10568‑1 for digital I/O connection; DisplayPort to HDMI/DVI/VGA adapters.
### 6. Installation & Setup
Power Requirements:
9 – 32 V DC input via 3‑pin connector (V+, GND, V–). Optional remote power switch (2‑pin). Ensure stable DC supply ≥ 100 W at 24 V for full operation.
Mounting Options:
Wall‑mount kit included; brackets attach to chassis using M4 screws (84 mm spacing). Maintain ≥ 5 cm clearance above unit for heat dissipation.
Storage Installation:
Supports two 2.5″ HDD/SSD drives mounted on internal bracket with SATA connectors and RAID configuration via Intel Rapid Storage Technology.
Expansion Card Installation:
Remove top cover, insert PCI/PCIe card into designated slot, secure with brace and screw. Optional fan module recommended for high‑power cards.
CFast Installation:
One internal and one external Type II CFast socket (push‑push type) support PIO/DMA modes and SATA interface up to 3 Gb/s.
Driver Setup:
Drivers for chipset, graphics, LAN, audio, USB 3.0, Intel Management Engine, Watchdog Timer, and Digital I/O are provided on the ADLINK DVD.
Installation sequence: Chipset → Graphics → LAN → Audio → USB 3.0 → ME → WDT → DIO.
### 7. Performance & Capabilities
Processing Performance:
Dual‑core Intel Core i3‑3120ME (2.4 GHz) delivers robust computing for industrial control and vision applications. Integrated Intel HD Graphics 4000 supports triple display output and hardware acceleration for video and 2D/3D graphics.
Storage Performance:
SATA III 6 Gb/s interfaces enable high‑speed data transfer and RAID 0/1 for redundancy or throughput. CFast cards provide solid‑state boot and data storage options.
Network Performance:
Dual Intel Gigabit Ethernet ports support teaming for redundancy or load balancing, Wake‑on‑LAN, and remote management via Intel AMT.
Power Efficiency:
Measured power consumption at 24 V DC: 2.16 W (off), 16.08 W (idle), 53.76 W (full load). Recommended 160 W power supply for systems with add‑on cards.
Environmental Robustness:
Fanless operation from –20 °C to 60 °C (with industrial SSD/CFast), vibration resistance up to 5 Grms, and shock tolerance of 50 G ensure reliable performance in industrial and mobile environments.
Limitations:
Extended temperature operation requires industrial‑grade storage; high‑power PCIe cards may necessitate optional fan module.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, KCC certified.
- Environmental: RoHS and WEEE compliant for hazardous substance restriction and recycling.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az (Energy Efficient Ethernet), 802.1Q VLAN, 802.1p QoS.
- Power Protection: ESD ±4 kV contact, ±8 kV air; isolation 1.5 kV for digital I/O.
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes.
### 9. Additional Information
Warranty:
Standard ADLINK limited warranty (typically 2 years) covering manufacturing defects and hardware failures under normal use.
Support & Maintenance:
- Global technical support via ADLINK offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India.
- Firmware and BIOS updates available from ADLINK website.
- Driver and API libraries for Windows and Linux provided for Watchdog Timer and Digital I/O functions.
- Optional RAID configuration and BIOS customization supported.
Maintenance Guidelines:
- Ensure adequate ventilation (≥ 5 cm clearance above unit).
- Use industrial‑grade SSD/CFast for extended temperature operation.
- Clean external surfaces with dry cloth; avoid liquids and solvents.
- Disconnect power before installing or removing components.
Environmental Responsibility:
ADLINK complies with RoHS and WEEE directives to minimize environmental impact. Products should be disposed of through authorized recycling channels at end of life.
### Summary
The ADLINK MXC‑6303D is a rugged, fanless, and highly expandable embedded computer engineered for industrial and mission‑critical applications requiring reliable performance, multiple I/O interfaces, and flexible expansion. Powered by an Intel Core i3‑3120ME processor and QM77 chipset, it supports triple independent displays, dual Gigabit Ethernet, isolated digital I/O, and wide‑range DC power input. Its cable‑free, vibration‑resistant design ensures long‑term stability in harsh environments. With comprehensive driver support, RAID capability, and optional accessories, the MXC‑6303D provides a robust platform for automation, vision, and control systems demanding high reliability and scalability.
### 1. Product Overview
Product Name: MXC‑6303D
Model: MXC‑6303D
Series: Matrix MXC‑6300/6310/6320 Series
Article Number: MXC‑6303D
Manufacturer: ADLINK Technology, Inc.
Product Type: Fanless expandable embedded computer with PCI/PCIe expansion slots
Processor Platform: Intel® Core™ i3‑3120ME (3rd Generation Ivy Bridge)
Chipset: Intel® QM77 Mobile Platform Controller Hub
The MXC‑6303D is part of ADLINK’s Matrix MXC‑6300 series of rugged, fanless embedded computers designed for industrial automation, machine vision, transportation, and other mission‑critical applications. It integrates a 3rd‑generation Intel® Core™ i3 processor and QM77 chipset, providing high computing performance, multiple expansion options, and wide‑range DC power input in a compact, cable‑free chassis.
### 2. Key Features
- Processor Support: 3rd Generation Intel® Core™ i7/i5/i3 and Celeron processors (Ivy Bridge architecture).
MXC‑6303D specifically integrates the Intel® Core™ i3‑3120ME dual‑core 2.4 GHz CPU with 3 MB cache.
- Chipset: Intel® QM77 Mobile PCH supporting SATA III, USB 3.0, and Intel® AMT 8.0/11.0.
- Memory: Two DDR3 SO‑DIMM sockets supporting up to 16 GB DDR3‑1600 MHz memory.
- Display: Three independent displays via 2 × DisplayPort and 1 × DVI‑I (up to 2560 × 1600 @ 60 Hz).
- Expansion: 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (auto‑switching, PCIe Gen 2).
- Storage: Two onboard SATA III ports (6 Gb/s) for 2.5″ HDD/SSD with RAID 0/1 support; dual CFast sockets (internal + external).
- Networking: 2 × Intel GbE ports (Intel I210IT + 82579LM) with teaming, Wake‑on‑LAN, and iAMT 8.0.
- I/O Interfaces:
- 4 × USB 3.0, 2 × USB 2.0 (external), 1 × USB 2.0 (internal)
- 2 × RS‑232/422/485 (software‑selectable) + 2 × RS‑232
- 16‑channel isolated digital input and 16‑channel isolated digital output (1.5 kV isolation)
- Audio: Mic‑in + Line‑out (Realtek ALC269 HD Audio)
- PS/2 keyboard and mouse ports
- Power Input: 9 – 32 V DC wide‑range input with pluggable 3‑pin connector and optional remote power switch.
- Design: Completely fanless and cable‑free for high reliability in harsh environments.
- Operating Temperature:
- Standard: 0 °C – 50 °C (with HDD)
- Extended: –20 °C – 60 °C (with industrial SSD/CFast)
- Certifications: CE, FCC Class A, UL/cUL, CB, KCC.
- Mounting: Wall‑mount kit included.
### 3. Technical Specifications
| Parameter | Specification |
|----------------|------------------|
| Processor | Intel® Core™ i3‑3120ME, Dual Core 2.4 GHz, 3 MB cache |
| Chipset | Intel® QM77 Mobile PCH |
| Memory | 2 × DDR3 SO‑DIMM sockets, up to 16 GB DDR3‑1600 |
| Graphics | Intel® HD Graphics 4000 integrated GPU |
| Display Outputs | 2 × DisplayPort (2560×1600 / 1920×1200) + 1 × DVI‑I (1920×1200) |
| Expansion Slots | 1 × PCI + 2 × PCIe x8 or 1 × PCI + 1 × PCIe x16 (Gen 2) |
| Ethernet | 2 × Intel GbE (I210IT + 82579LM), teaming, Wake‑on‑LAN, iAMT 8.0 |
| Serial Ports | 2 × RS‑232/422/485 (COM1/2) + 2 × RS‑232 (COM3/4) |
| USB Ports | 4 × USB 3.0 + 2 × USB 2.0 (external) + 1 × USB 2.0 (internal) |
| Digital I/O | 16 × DI + 16 × DO (1.5 kV isolation, MOSFET outputs 100 mA sustained) |
| Audio | Realtek ALC269 HD Audio (24‑bit/192 kHz), Mic‑in + Line‑out |
| Storage | 2 × SATA III (6 Gb/s) for 2.5″ HDD/SSD, RAID 0/1; 2 × CFast sockets |
| Power Input | 9 – 32 V DC input (3‑pin pluggable connector with latch) |
| Optional AC Adapter | 160 W AC‑DC adapter (–20 °C to 70 °C rated) |
| Dimensions | 172.5 (W) × 225 (D) × 213 (H) mm (6.79″ × 8.86″ × 8.39″) |
| Weight | 4.3 kg (9.48 lb) |
| Operating Temperature | 0 °C – 50 °C standard; –20 °C – 60 °C with industrial SSD/CFast |
| Storage Temperature | –40 °C – 85 °C (excluding HDD) |
| Humidity | 95 % @ 40 °C (non‑condensing) |
| Vibration | 5 Grms (SSD/CFast) / 0.5 Grms (HDD), 5–500 Hz, 3 axes |
| Shock | 50 G, 11 ms half‑sine (SSD/CFast) |
| ESD Protection | ±4 kV contact, ±8 kV air |
| EMC/Safety | CE, FCC Class A, UL/cUL, CB, KCC |
### 4. Functionality
The MXC‑6303D operates as a high‑performance embedded controller for industrial and automation systems. Its fanless design ensures silent, maintenance‑free operation in environments with dust, vibration, or temperature extremes. The system’s modular expansion architecture allows integration of PCI/PCIe cards for motion control, frame grabbers, data acquisition, or communication interfaces.
Typical Applications:
- Factory and machine automation
- Machine vision and image processing
- Intelligent transportation and surveillance
- Maritime and navigation control
- High‑resolution medical imaging
Compatibility:
- Operating Systems: Windows 7, Windows Embedded Standard 7, Windows XP, XP Embedded, Linux.
- Supports Intel® AMT 8.0/11.0 for remote management and diagnostics.
- RAID 0/1 support for data redundancy or performance optimization.
- BIOS configurable for IDE, AHCI, or RAID modes.
### 5. Components & Accessories
Included Items:
- MXC‑6303D main unit
- Wall‑mount brackets and screw pack
- User manual and ADLINK All‑in‑One DVD (drivers & utilities)
Optional Accessories:
- Fan Module: Smart‑controlled fan for additional cooling when high‑power PCI/PCIe cards are installed.
- Storage Options: Factory‑installed 500 GB/1 TB HDD or 32/64 GB MLC SSD.
- Power Adapter: 160 W industrial AC‑DC adapter (–20 °C to 70 °C).
- Cabling: DIN‑68S‑01 and ACL‑10568‑1 for digital I/O connection; DisplayPort to HDMI/DVI/VGA adapters.
### 6. Installation & Setup
Power Requirements:
9 – 32 V DC input via 3‑pin connector (V+, GND, V–). Optional remote power switch (2‑pin). Ensure stable DC supply ≥ 100 W at 24 V for full operation.
Mounting Options:
Wall‑mount kit included; brackets attach to chassis using M4 screws (84 mm spacing). Maintain ≥ 5 cm clearance above unit for heat dissipation.
Storage Installation:
Supports two 2.5″ HDD/SSD drives mounted on internal bracket with SATA connectors and RAID configuration via Intel Rapid Storage Technology.
Expansion Card Installation:
Remove top cover, insert PCI/PCIe card into designated slot, secure with brace and screw. Optional fan module recommended for high‑power cards.
CFast Installation:
One internal and one external Type II CFast socket (push‑push type) support PIO/DMA modes and SATA interface up to 3 Gb/s.
Driver Setup:
Drivers for chipset, graphics, LAN, audio, USB 3.0, Intel Management Engine, Watchdog Timer, and Digital I/O are provided on the ADLINK DVD.
Installation sequence: Chipset → Graphics → LAN → Audio → USB 3.0 → ME → WDT → DIO.
### 7. Performance & Capabilities
Processing Performance:
Dual‑core Intel Core i3‑3120ME (2.4 GHz) delivers robust computing for industrial control and vision applications. Integrated Intel HD Graphics 4000 supports triple display output and hardware acceleration for video and 2D/3D graphics.
Storage Performance:
SATA III 6 Gb/s interfaces enable high‑speed data transfer and RAID 0/1 for redundancy or throughput. CFast cards provide solid‑state boot and data storage options.
Network Performance:
Dual Intel Gigabit Ethernet ports support teaming for redundancy or load balancing, Wake‑on‑LAN, and remote management via Intel AMT.
Power Efficiency:
Measured power consumption at 24 V DC: 2.16 W (off), 16.08 W (idle), 53.76 W (full load). Recommended 160 W power supply for systems with add‑on cards.
Environmental Robustness:
Fanless operation from –20 °C to 60 °C (with industrial SSD/CFast), vibration resistance up to 5 Grms, and shock tolerance of 50 G ensure reliable performance in industrial and mobile environments.
Limitations:
Extended temperature operation requires industrial‑grade storage; high‑power PCIe cards may necessitate optional fan module.
### 8. Standards & Compliance
- EMC: CE and FCC Class A compliant.
- Safety: UL/cUL, CB, KCC certified.
- Environmental: RoHS and WEEE compliant for hazardous substance restriction and recycling.
- Ethernet Standards: IEEE 802.3, 802.3u, 802.3ab, 802.3az (Energy Efficient Ethernet), 802.1Q VLAN, 802.1p QoS.
- Power Protection: ESD ±4 kV contact, ±8 kV air; isolation 1.5 kV for digital I/O.
- Quality Assurance: Manufactured under ADLINK’s ISO 9001 certified processes.
### 9. Additional Information
Warranty:
Standard ADLINK limited warranty (typically 2 years) covering manufacturing defects and hardware failures under normal use.
Support & Maintenance:
- Global technical support via ADLINK offices in Taiwan, USA, China, Europe, Japan, Korea, Singapore, and India.
- Firmware and BIOS updates available from ADLINK website.
- Driver and API libraries for Windows and Linux provided for Watchdog Timer and Digital I/O functions.
- Optional RAID configuration and BIOS customization supported.
Maintenance Guidelines:
- Ensure adequate ventilation (≥ 5 cm clearance above unit).
- Use industrial‑grade SSD/CFast for extended temperature operation.
- Clean external surfaces with dry cloth; avoid liquids and solvents.
- Disconnect power before installing or removing components.
Environmental Responsibility:
ADLINK complies with RoHS and WEEE directives to minimize environmental impact. Products should be disposed of through authorized recycling channels at end of life.
### Summary
The ADLINK MXC‑6303D is a rugged, fanless, and highly expandable embedded computer engineered for industrial and mission‑critical applications requiring reliable performance, multiple I/O interfaces, and flexible expansion. Powered by an Intel Core i3‑3120ME processor and QM77 chipset, it supports triple independent displays, dual Gigabit Ethernet, isolated digital I/O, and wide‑range DC power input. Its cable‑free, vibration‑resistant design ensures long‑term stability in harsh environments. With comprehensive driver support, RAID capability, and optional accessories, the MXC‑6303D provides a robust platform for automation, vision, and control systems demanding high reliability and scalability.
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