1. Product Overview

Product Name: Nuvo‑5002E
Model/Article Number: Nuvo‑5002E
Series: Nuvo‑5000E/P Series
Manufacturer: Neousys Technology Inc.
Product Type: Rugged fanless embedded controller / industrial PC
Description: Intel® 6th‑Generation Core™ i3/i5/i7 Skylake fanless barebone system with Intel® Q170 chipset, dual Gigabit Ethernet, PCIe expansion cassette, and MezIO™ modular I/O interface.

The Nuvo‑5002E belongs to Neousys’ Nuvo‑5000 series of rugged fanless controllers designed for industrial automation, machine vision, transportation, and edge computing applications. It integrates Intel’s 6th‑generation Skylake processors in a compact, thermally optimized chassis capable of wide‑temperature operation and high mechanical resilience.

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2. Key Features

- Processor Flexibility: Supports socket‑type Intel® 6th‑Gen Core™ i7/i5/i3, Pentium®, and Celeron® CPUs (LGA1151), allowing performance scaling from entry‑level to high‑end computing.
- Fanless Thermal Design: Patented heat‑dissipating architecture enables true ‑25 °C to +70 °C operation (with 35 W CPUs) without active cooling.
- Intel® Q170 Chipset: Provides advanced I/O, AMT 11.0 remote management, and TPM 2.0 hardware security.
- Dual Gigabit Ethernet: Two independent Intel® controllers (I219‑LM and I210‑IT) for reliable network connectivity and AMT/WOL support.
- PCIe Expansion Cassette: Integrated modular cassette with one PCIe x16 slot (Gen3, 8‑lane bandwidth) for add‑on cards such as frame grabbers, GPUs, or I/O boards.
- MezIO™ Interface: Proprietary mezzanine expansion port for Neousys MezIO™ modules, enabling application‑specific I/O such as serial, digital, PoE, or ignition control.
- Rich I/O Connectivity: 4 × USB 3.0, 4 × USB 2.0, 3 × COM ports (2 × RS‑232/422/485 software‑selectable, 1 × RS‑232), audio I/O, and dual DisplayPort + VGA + DVI‑D triple‑display outputs.
- Storage Flexibility: Two internal 2.5″ SATA III bays supporting RAID 0/1, plus one full‑size mSATA (muxed with mini‑PCIe).
- Expansion Options: Two mini‑PCIe sockets (one with front‑accessible SIM, one internal) for wireless, GPS, or CAN modules.
- Rugged Reliability: Vibration tolerance up to 5 Grms and shock resistance up to 50 Grms (SSD configuration) per IEC 60068‑2‑64/‑27.
- Wide Power Input: 8 – 35 V DC input via 3‑pin terminal block; optional 120 W AC/DC adapter.
- Compact Industrial Form Factor: 240 × 225 × 90 mm aluminum chassis, wall‑ or DIN‑rail mountable.

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3. Technical Specifications

| Parameter | Specification |
|----------------|------------------|
| Processor Options | Intel® Core™ i7‑6700 (3.4/4.0 GHz, 65 W), i5‑6500 (3.2/3.6 GHz, 65 W), i3‑6100 (3.7 GHz, 51 W), Pentium® G4400 (3.3 GHz, 54 W), Celeron® G3900 (2.8 GHz, 51 W); low‑power TE variants (35 W TDP) supported |
| Chipset | Intel® Q170 PCH |
| Graphics | Integrated Intel® HD Graphics 530/510; VGA + DVI‑D + 2 × DisplayPort (4K2K support) |
| Memory | Up to 32 GB DDR4‑2133 via 2 × SO‑DIMM |
| Storage | 2 × 2.5″ SATA III (6 Gb/s) with RAID 0/1; 1 × full‑size mSATA (mux with mini‑PCIe) |
| Ethernet | 2 × GbE (Intel® I219‑LM + I210‑IT) |
| USB | 4 × USB 3.0 (SuperSpeed), 4 × USB 2.0 |
| Serial Ports | 2 × RS‑232/422/485 (software‑selectable), 1 × RS‑232 |
| Audio | 1 × Mic‑in, 1 × Speaker‑out (Realtek ALC262 codec) |
| Expansion | 1 × PCIe x16 (Gen3 8‑lane) in Cassette; 2 × Mini‑PCIe (1 front SIM, 1 internal SIM); 1 × MezIO™ port |
| Power Input | 8 – 35 V DC via 3‑pin terminal block; remote on/off and status LED connector |
| Dimensions | 240 (W) × 225 (D) × 90 (H) mm |
| Weight | 4.4 kg (incl. HDD and RAM) |
| Mounting | Wall‑mount (standard) / DIN‑rail (optional) |
| Operating Temperature | ‑25 °C to +70 °C (35 W CPU); ‑25 °C to +50 °C (65 W CPU mode) |
| Storage Temperature | ‑40 °C to +85 °C |
| Humidity | 10 – 90 % non‑condensing |
| Vibration | 5 Grms (5–500 Hz, 3 axes, SSD per IEC 60068‑2‑64) |
| Shock | 50 Grms (half‑sine 11 ms, SSD per IEC 60068‑2‑27) |
| EMC/Compliance | CE/FCC Class A (EN 55022, EN 55024, EN 55032, EN 60950) |
| Weight (bare) | ~3.6 kg without HDD (optional configurations) |

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4. Functionality

The Nuvo‑5002E operates as a rugged embedded controller for industrial and field‑deployed computing. Its fanless architecture uses conduction‑cooled heat dissipation through the aluminum chassis, ensuring silent and maintenance‑free operation in dusty or vibration‑prone environments.

Use Cases & Applications:
- Industrial automation and machine vision (frame grabber via PCIe slot)
- Transportation and in‑vehicle computing (with MezIO‑V20 ignition control)
- Edge data acquisition and control (multiple COM, USB, and digital I/O options)
- Surveillance and networking (dual GbE, optional PoE modules)
- Laboratory or factory data logging and visualization (multi‑display support)

Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and major Linux distributions (Ubuntu, Fedora, Debian, openSUSE). BIOS supports both legacy and UEFI boot modes, RAID configuration, and AMT remote management.

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5. Components & Accessories

Included Items:
- Nuvo‑5002E fanless controller (barebone or configured with CPU/RAM/HDD)
- Wall‑mounting brackets and screws
- 3‑pin pluggable DC terminal block
- Foot pads
- HDD thermal pad (for 2.5″ drive)
- Screw pack
- Neousys Drivers & Utilities DVD

Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting kit
- FANKIT‑25: 25 × 25 × 10 mm fan assembly for cassette cooling
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C)
- DmpbrNuvo5000_7000: Damping bracket assembly
- Cassette Modules:
- CSM‑PoE354 – PCIe PoE+ module (4 × IEEE 802.3at ports)
- CSM‑USB380 – PCIe USB 3.0 expansion module
- CSM‑NV750 – NVIDIA® GTX 750 Ti graphics module with fan
- CSM‑R800 – 4‑bay 2.5″ HDD/SSD RAID module
- MezIO™ Modules:
- MezIO‑C180 – 4 × RS‑232/422/485 + 4 × RS‑232
- MezIO‑C181 – 4 × RS‑232/422/485 + 4 × RS‑422/485
- MezIO‑D220 – 8 × isolated DI + 8 × isolated DO
- MezIO‑D230 – 16 × isolated DI + 16 × isolated DO
- MezIO‑V20‑EP – Ignition power control for vehicle use
- MezIO‑U4 – 4 × USB 3.0 ports
- MezIO‑G4 – 4 × GigE ports
- MezIO‑G4P – 4 × PoE+ ports

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6. Installation & Setup

Requirements:
- DC power supply 8–35 V DC (≥ 60 W recommended)
- Compatible DDR4 SO‑DIMM modules (2133 MHz)
- 2.5″ SATA HDD/SSD or mSATA drive
- Operating system installation media (USB or SATA)

Mounting Options:
- Wall‑mount: Standard brackets included; mount vertically for optimal heat dissipation.
- DIN‑rail: Optional DINRAIL‑O kit for cabinet installation.

Configuration Steps:
1. Install CPU (LGA1151) and apply thermal pads per manual.
2. Insert DDR4 SO‑DIMMs (up to 32 GB).
3. Mount 2.5″ HDD/SSD on bracket with thermal pad and connect SATA cables.
4. Optionally install mini‑PCIe modules (Wi‑Fi/4G/GPS) and SIM cards.
5. Connect DC power via terminal block (verify polarity).
6. Power on using front button or remote on/off connector.
7. Enter BIOS (F2) to configure boot mode, RAID, and power options.

Remote Control:
10‑pin wafer connector provides external on/off switch input and status LED outputs (PWR, HDD, WDT).

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7. Performance & Capabilities

- Processing Power: Up to Intel® Core™ i7‑6700 (4 cores, 8 threads, 4.0 GHz Turbo).
- Graphics: Intel® HD 530 supports triple independent displays (VGA + DVI‑D + DP).
- Memory Bandwidth: DDR4‑2133 dual‑channel up to 34 GB/s.
- Storage Throughput: SATA III 6 Gb/s with RAID 0/1 for redundancy or speed.
- Network: Dual GbE with AMT remote management and Wake‑on‑LAN.
- Power Efficiency: Typical consumption ≈ 40–50 W (35 W CPU mode).
- Thermal Limits: Full performance to 70 °C (35 W CPU); throttling above 50 °C for 65 W CPU mode.
- Reliability: Designed for 24/7 operation in industrial environments; no moving parts in fanless configuration.
- Limitations: High‑power PCIe cards (> 16 W) require optional fan kit for thermal stability.

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8. Standards & Compliance

- Safety & EMC: CE/FCC Class A compliant (EN 55022, EN 55024, EN 55032, EN 60950).
- Environmental Testing: Vibration and shock qualified per IEC 60068‑2‑64 and ‑27.
- Temperature Qualification: ‑25 °C to +70 °C verified with 35 W CPU and SSD.
- RoHS/REACH: Compliant with EU environmental directives.
- Intel® AMT 11.0: Supports remote management and KVM over LAN.
- TPM 2.0: Hardware security module for trusted boot and encryption.

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9. Additional Information

Warranty & Support:
Standard Neousys limited warranty (typically 2 years, region‑dependent). Technical support and driver updates available via [www.neousys‑tech.com](https://www.neousys-tech.com).

Maintenance:
Fanless design minimizes service requirements. Periodic dust inspection and connector tightening recommended. Firmware and BIOS updates provided through Neousys support.

Software & Drivers:
Drivers for chipset, graphics, LAN, audio, and ME available on the Drivers & Utilities DVD or online. “One‑Click” installer automates Windows driver setup. Linux users may require manual driver updates for graphics and RAID.

Operating System Support:
- Windows 7 (32/64‑bit) with xHCI USB patch
- Windows 8.1 / 10 (64‑bit)
- Linux (Ubuntu 14.04/16.04 LTS, Fedora 23, Debian 8.3, openSUSE 42.1)

BIOS Features:
- Configurable COM port modes (RS‑232/422/485)
- SATA AHCI/RAID mode selection
- TPM enable/disable
- CPU SKU power limit configuration
- Wake‑on‑LAN and Power‑on‑after‑failure options
- Watchdog timer for boot and runtime monitoring

Watchdog & PoE Control:
Integrated hardware watchdog timer with API library (WDT_DIO). For PoE models, per‑port power on/off control is supported via software API.

Mechanical Design:
Extruded aluminum chassis with integrated heat sink fins for passive cooling. Cassette compartment isolates add‑on card heat sources. Optional fan module provides active airflow for high‑TDP cards.

Summary:
The Neousys Nuvo‑5002E is a compact, industrial‑grade, fanless embedded controller combining Intel® Skylake processing, robust mechanical design, and modular expandability. Its dual Gigabit Ethernet, PCIe and MezIO™ interfaces, and wide temperature operation make it ideal for mission‑critical applications requiring long‑term reliability and flexible I/O integration.