Comprehensive Product Summary – Neousys Nuvo‑5002P Fanless Embedded Controller

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### 1. Product Overview

Product Name: Nuvo‑5002P
Model / Article Number: Nuvo‑5002P
Series: Nuvo‑5000E/P Series (Rugged Embedded Controllers)
Manufacturer: Neousys Technology Inc.
Product Type: Intel® 6th‑Generation Core™ i7/i5/i3 Fanless Industrial Controller with PCI Expansion Cassette and MezIO™ Interface
Chipset: Intel® Q170 Platform Controller Hub

The Nuvo‑5002P is a rugged, fanless embedded controller designed for industrial automation, machine vision, transportation, and edge computing applications. It belongs to Neousys’ Nuvo‑5000 series, which integrates Intel® Skylake‑generation processors, a patented expansion cassette for PCI/PCIe add‑on cards, and the proprietary MezIO™ modular I/O interface. The system combines high computing performance, wide‑temperature operation, and versatile I/O connectivity in a compact, maintenance‑free chassis.

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### 2. Key Features

- Fanless Industrial Design:
Completely fanless aluminum chassis with optimized heat dissipation, supporting ‑25 °C to +70 °C operation (with 35 W CPUs) or up to +50 °C (with 65 W CPUs).

- Intel® 6th‑Gen Skylake CPU Support:
Socket‑type LGA1151 processors including Core™ i7‑6700/6700TE, i5‑6500/6500TE, i3‑6100/6100TE, Pentium® G4400/G4400TE, and Celeron® G3900/G3900TE.
Configurable TDP (35 W to 65 W) for balancing performance and thermal envelope.

- Intel® Q170 Chipset:
Enterprise‑grade platform controller hub with AMT 11.0 and TPM 2.0 hardware security support.

- Integrated Intel® HD Graphics 530/510:
Triple‑independent display outputs via VGA, DVI‑D, and dual DisplayPort connectors; 4K2K resolution supported on DP ports.

- Patented Expansion Cassette:
Provides one 32‑bit/33 MHz PCI slot (Nuvo‑5002P) for add‑on cards; isolated thermal compartment ensures stable operation and easy maintenance.

- MezIO™ Expansion Interface:
Proprietary Neousys mezzanine connector for modular I/O expansion (digital I/O, serial, PoE, ignition control, etc.).

- Comprehensive I/O Connectivity:
- 2 × Gigabit Ethernet ports (Intel® I219‑LM + I210‑IT)
- 4 × USB 3.0 + 4 × USB 2.0 ports
- 3 × COM ports (2 × software‑selectable RS‑232/422/485 + 1 × RS‑232)
- Audio (Mic‑in, Speaker‑out)
- Dual Mini‑PCIe sockets with SIM support
- 2 × SATA III ports with RAID 0/1 support
- 1 × mSATA (muxed with Mini‑PCIe)

- Rugged Reliability:
Vibration resistance up to 5 Grms (IEC 60068‑2‑64) and shock resistance up to 50 Grms (IEC 60068‑2‑27) with SSD.

- Wide‑Range DC Power Input:
8 – 35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter (PA‑120W‑OW).

- Compact Form Factor:
240 mm (W) × 225 mm (D) × 90 mm (H); weight ≈ 4.4 kg including HDD and memory.

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### 3. Technical Specifications

Processor Options (LGA1151 Socket):
- Core™ i7‑6700 (3.4/4.0 GHz, 65 W TDP)
- Core™ i5‑6500 (3.2/3.6 GHz, 65 W TDP)
- Core™ i3‑6100 (3.7 GHz, 51 W TDP)
- Pentium® G4400 (3.3 GHz, 54 W TDP)
- Celeron® G3900 (2.8 GHz, 51 W TDP)
- Low‑power TE variants (35 W TDP) for extended temperature operation.

Chipset: Intel® Q170 PCH
Graphics: Intel® HD 530/510, triple‑display support (VGA + DVI‑D + 2 × DP)
Memory: 2 × DDR4 SO‑DIMM slots, up to 32 GB DDR4‑2133
Storage:
- 2 × 2.5″ SATA III (6 Gb/s) ports, RAID 0/1
- 1 × full‑size mSATA (mux with Mini‑PCIe)
Expansion:
- 1 × PCI slot (via Cassette)
- 2 × Mini‑PCIe slots (1 front‑accessible SIM, 1 internal SIM)
- 1 × MezIO™ connector

I/O Ports:
- Ethernet: 2 × GbE (Intel I219‑LM + I210‑IT)
- USB: 4 × USB 3.0 + 4 × USB 2.0
- Serial: 2 × RS‑232/422/485 + 1 × RS‑232
- Audio: Mic‑in + Speaker‑out
- Video: VGA, DVI‑D, 2 × DisplayPort (4K support)
- Power/Status: 10‑pin remote on/off and LED header

Power Input: 8 – 35 V DC (3‑pin terminal block)
Power Consumption: ≈ 49 W with i7‑6700TE @ 24 V input
Dimensions: 240 × 225 × 90 mm
Weight: 4.4 kg (incl. HDD and RAM)
Mounting: Wall‑mount (standard) / DIN‑rail (optional)

Environmental Ratings:
- Operating Temp: ‑25 °C to +70 °C (35 W CPU) / ‑25 °C to +50 °C (65 W CPU)
- Storage Temp: ‑40 °C to +85 °C
- Humidity: 10 – 90 % non‑condensing
- Vibration: 5 Grms (5–500 Hz, 3 axes)
- Shock: 50 Grms (11 ms half‑sine)

EMC Compliance: CE/FCC Class A (EN 55022, EN 55024, EN 55032, EN 60950)

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### 4. Functionality

The Nuvo‑5002P operates as a high‑performance embedded controller for industrial and field‑deployed systems. It integrates computing, communication, and expansion capabilities in a sealed, fanless chassis.

Operation Principle:
Heat from the CPU and chipset is dissipated through the aluminum enclosure, enabling silent, dust‑proof operation. The system boots from SATA or mSATA storage and supports hardware RAID for redundancy or performance.

Use Cases:
- Machine vision and automation control
- Industrial data acquisition and SCADA
- Transportation and in‑vehicle computing (with MezIO‑V20 ignition module)
- Edge computing and IoT gateways
- Networked video or sensor processing

Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and major Linux distributions (Ubuntu, Fedora, Debian, openSUSE). BIOS supports both Legacy and UEFI boot modes.

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### 5. Components & Accessories

Included Items:
- Nuvo‑5002P main unit
- Wall‑mounting brackets
- Foot pads
- 3‑pin DC terminal block
- HDD thermal pad
- Screw pack
- Neousys Drivers & Utilities DVD

Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting kit
- Fankit‑25: 25 × 25 × 10 mm fan assembly for Cassette
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C)
- DmpbrNuvo5000_7000: Damping bracket assembly

Cassette Modules (optional):
- CSM‑PoE354: PCIe PoE+ module (4 × IEEE 802.3at ports)
- CSM‑USB380: PCIe USB 3.0 expansion module
- CSM‑NV750: NVIDIA® GTX 750 Ti graphics module with fan
- CSM‑R800: 4‑drive RAID module (0/1/10)

MezIO™ Modules:
- MezIO‑C180: 4 × RS‑232/422/485 + 4 × RS‑232
- MezIO‑C181: 4 × RS‑232/422/485 + 4 × RS‑422/485
- MezIO‑D220/D230: Isolated digital I/O (8/8 or 16/16 channels)
- MezIO‑V20‑EP: Ignition power control for vehicle use
- MezIO‑U4: 4 × USB 3.0 ports
- MezIO‑G4/G4P: 4 × GigE or 4 × PoE+ ports

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### 6. Installation & Setup

Requirements:
- DC power supply 8–35 V DC (≥ 60 W recommended)
- Compatible DDR4 SO‑DIMM modules and 2.5″ SATA drives
- Optional Mini‑PCIe modules (Wi‑Fi, 3G/4G, GPS, CAN, etc.)

Mounting Options:
- Wall‑mount: Standard brackets with M4 screws
- DIN‑rail: Optional DINRAIL‑O kit

Configuration Steps:
1. Install CPU (LGA1151) and DDR4 memory.
2. Mount 2.5″ HDD/SSD using thermal pad and bracket.
3. Connect DC power via terminal block (verify polarity).
4. Attach display and I/O devices.
5. Power on via front button or remote switch.
6. Configure BIOS for SATA mode (AHCI/RAID), boot order, and power options.

Remote Control:
10‑pin header supports external on/off switch and status LED outputs (PWR, HDD, WDT).

BIOS Features:
- CPU power limit configuration (SKU Power Config)
- Wake‑on‑LAN and Power‑on‑after‑failure options
- TPM enable/disable and UEFI boot mode
- Watchdog timer for boot monitoring

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### 7. Performance & Capabilities

Processing Performance:
Up to 4.0 GHz Core i7 quad‑core CPU with 8 MB cache; supports Intel® Hyper‑Threading and VT‑x/VT‑d virtualization.

Graphics:
Intel® HD 530 GPU supports DirectX 12, OpenGL 4.4, and hardware 4K decoding. Triple independent display operation (VGA + DVI‑D + DP).

Storage Performance:
Dual SATA III ports (6 Gb/s) with RAID 0/1 for redundancy or throughput; mSATA SSD option for OS boot.

Networking:
Dual Intel® GbE controllers with dedicated PCIe lanes for maximum throughput; AMT 11.0 remote management and Wake‑on‑LAN supported.

Reliability:
Fanless design eliminates mechanical failure points; industrial‑grade components rated for ‑25 °C to +70 °C. Vibration and shock resistance meet IEC standards.

Limitations:
Thermal throttling may occur above 50 °C with 65 W CPUs under sustained load; for sub‑zero operation, use wide‑temperature SSD/HDD.

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### 8. Standards & Compliance

- EMC: CE/FCC Class A (EN 55022, EN 55024, EN 55032, EN 60950)
- Safety: Meets EN 60950 information technology equipment safety requirements
- Environmental: IEC 60068‑2‑64 (Vibration), IEC 60068‑2‑27 (Shock)
- RoHS Compliant
- Intel® Embedded Roadmap Support: 7‑year lifecycle (2015–2021) for embedded CPUs

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### 9. Additional Information

Warranty & Support:
Standard Neousys limited warranty (typically 2 years); technical support and driver updates available via [www.neousys‑tech.com](https://www.neousys-tech.com).

Maintenance:
No fan or filter replacement required; periodic dust inspection recommended for connectors and vent areas. Firmware and BIOS updates available through Neousys support.

Software Utilities:
- “One‑Click” Driver Installation DVD for Windows OS
- WDT_DIO library for Watchdog Timer and PoE control functions
- AMT configuration for remote management
- RAID configuration utility via Intel Rapid Storage Technology

Operating System Support:
- Windows 7 (32/64‑bit) with xHCI driver integration
- Windows 8.1 / 10 (64‑bit)
- Linux (Ubuntu 14.04/16.04 LTS, Fedora 23, Debian 8.3, openSUSE 42.1)

Lifecycle and Serviceability:
Designed for long‑term deployment in industrial environments with extended component availability and stable firmware revisions. Supports remote diagnostics via Intel AMT and hardware watchdog reset for unattended operation.

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### Summary

The Neousys Nuvo‑5002P is a robust, fanless embedded controller engineered for demanding industrial and field applications. Combining Intel® Skylake processing power, wide‑temperature tolerance, and modular expansion through PCI Cassette and MezIO™, it delivers exceptional flexibility and reliability. Its dual Gigabit Ethernet, multiple USB and serial ports, and triple‑display graphics make it ideal for machine vision, automation control, and edge computing tasks. With compliance to industrial EMC standards and support for ‑25 °C to +70 °C operation, the Nuvo‑5002P offers a long‑life, maintenance‑free solution for mission‑critical embedded systems.