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- Intel® 8th‑Gen Coffee Lake CPU Support:
Supports LGA1151 socket processors up to 6 cores/12 threads, including Intel® Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
Configurable TDP of 35 W or 65 W for performance‑to‑thermal optimization.
- Fanless Thermal Design:
Advanced passive cooling architecture ensures silent operation and long‑term reliability in environments from ‑25 °C to +70 °C (with 35 W CPU).
- Intel® Q370 Chipset:
Provides high‑speed I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Integrated Intel® UHD Graphics 630:
Supports triple independent display outputs via VGA, DVI‑D, and DisplayPort (up to 4096 × 2304 resolution).
- Patented Expansion Cassette:
One PCIe ×16 slot (Gen3, 8‑lane signals) in a thermally isolated compartment for add‑on cards, simplifying installation and improving heat dissipation.
- MezIO™ Interface:
Proprietary high‑speed mezzanine connector for modular I/O expansion (digital I/O, serial, GbE, USB, ignition control, etc.).
- Comprehensive I/O Connectivity:
2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT), 8 × USB 3.1 (4 × Gen2 10 Gbps + 4 × Gen1 5 Gbps), 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232), audio I/O, and dual mSATA/M.2 expansion.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW).
- Rugged Reliability:
MIL‑STD‑810G‑compliant vibration (5 Grms, 5–500 Hz) and shock (50 Grms, 11 ms) resistance; CE/FCC Class A EMC compliance.
- Compact Industrial Form Factor:
240 mm (W) × 225 mm (D) × 90 mm (H), 4.4 kg, wall‑mount or optional DIN‑rail installation.
Supports LGA1151 socket processors up to 6 cores/12 threads, including Intel® Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
Configurable TDP of 35 W or 65 W for performance‑to‑thermal optimization.
- Fanless Thermal Design:
Advanced passive cooling architecture ensures silent operation and long‑term reliability in environments from ‑25 °C to +70 °C (with 35 W CPU).
- Intel® Q370 Chipset:
Provides high‑speed I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Integrated Intel® UHD Graphics 630:
Supports triple independent display outputs via VGA, DVI‑D, and DisplayPort (up to 4096 × 2304 resolution).
- Patented Expansion Cassette:
One PCIe ×16 slot (Gen3, 8‑lane signals) in a thermally isolated compartment for add‑on cards, simplifying installation and improving heat dissipation.
- MezIO™ Interface:
Proprietary high‑speed mezzanine connector for modular I/O expansion (digital I/O, serial, GbE, USB, ignition control, etc.).
- Comprehensive I/O Connectivity:
2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT), 8 × USB 3.1 (4 × Gen2 10 Gbps + 4 × Gen1 5 Gbps), 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232), audio I/O, and dual mSATA/M.2 expansion.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW).
- Rugged Reliability:
MIL‑STD‑810G‑compliant vibration (5 Grms, 5–500 Hz) and shock (50 Grms, 11 ms) resistance; CE/FCC Class A EMC compliance.
- Compact Industrial Form Factor:
240 mm (W) × 225 mm (D) × 90 mm (H), 4.4 kg, wall‑mount or optional DIN‑rail installation.
Comprehensive Product Summary: Nuvo‑7002E Rugged Fanless Embedded Controller
### 1. Product Overview
Product Name: Nuvo‑7002E
Model: Nuvo‑7002E
Series: Nuvo‑7000 Series (Rugged Embedded Fanless Controllers)
Article Number: Nuvo‑7002E
Manufacturer: Neousys Technology Inc. (Taipei, Taiwan)
The Nuvo‑7002E is a rugged, industrial‑grade fanless embedded controller designed by Neousys Technology as part of its flagship Nuvo‑7000 series. It integrates Intel® 8th‑Generation Coffee Lake Core™ i processors and the Intel® Q370 chipset, offering high‑performance computing in a compact, thermally optimized, and maintenance‑free chassis. The system is engineered for industrial automation, machine vision, transportation, and edge computing applications requiring reliability under harsh environmental conditions.
### 2. Key Features
- Intel® 8th‑Gen Coffee Lake CPU Support:
Supports LGA1151 socket processors up to 6 cores/12 threads, including Intel® Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
Configurable TDP of 35 W or 65 W for performance‑to‑thermal optimization.
- Fanless Thermal Design:
Advanced passive cooling architecture ensures silent operation and long‑term reliability in environments from ‑25 °C to +70 °C (with 35 W CPU).
- Intel® Q370 Chipset:
Provides high‑speed I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Integrated Intel® UHD Graphics 630:
Supports triple independent display outputs via VGA, DVI‑D, and DisplayPort (up to 4096 × 2304 resolution).
- Patented Expansion Cassette:
One PCIe ×16 slot (Gen3, 8‑lane signals) in a thermally isolated compartment for add‑on cards, simplifying installation and improving heat dissipation.
- MezIO™ Interface:
Proprietary high‑speed mezzanine connector for modular I/O expansion (digital I/O, serial, GbE, USB, ignition control, etc.).
- Comprehensive I/O Connectivity:
2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT), 8 × USB 3.1 (4 × Gen2 10 Gbps + 4 × Gen1 5 Gbps), 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232), audio I/O, and dual mSATA/M.2 expansion.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW).
- Rugged Reliability:
MIL‑STD‑810G‑compliant vibration (5 Grms, 5–500 Hz) and shock (50 Grms, 11 ms) resistance; CE/FCC Class A EMC compliance.
- Compact Industrial Form Factor:
240 mm (W) × 225 mm (D) × 90 mm (H), 4.4 kg, wall‑mount or optional DIN‑rail installation.
### 3. Technical Specifications
Processor Support:
Intel® 8th‑Gen Coffee Lake CPUs (LGA1151, 35 W/65 W TDP)
– Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, Celeron® G4900/G4900T
Chipset: Intel® Q370 Platform Controller Hub
Graphics: Intel® UHD 630 integrated GPU
Memory: Up to 64 GB DDR4‑2666/2400 MHz SDRAM (2 × SODIMM slots)
Storage:
- 2 × 2.5″ SATA III ports (RAID 0/1, up to 15 mm thickness)
- 1 × M.2 2280 (M key) NVMe PCIe Gen3 ×4 slot (NVMe SSD or Intel® Optane™ Memory)
- 1 × full‑size mSATA (mux with mini‑PCIe)
- 1 × M.2 2242 (B key) slot with dual front‑accessible SIM sockets
Ethernet:
2 × GbE ports (Intel® I219‑LM + I210‑IT)
Wake‑on‑LAN and Intel® AMT 12.0 supported
USB:
4 × USB 3.1 Gen2 (10 Gbps) + 4 × USB 3.1 Gen1 (5 Gbps)
Serial Ports:
2 × RS‑232/422/485 software‑selectable (COM1/COM2)
2 × RS‑232 (COM3/COM4)
Audio: 1 × 3.5 mm jack (mic‑in / speaker‑out)
Video Outputs:
- VGA (1920 × 1200 @ 60 Hz)
- DVI‑D (1920 × 1200 @ 60 Hz)
- DisplayPort (4096 × 2304 @ 60 Hz)
Expansion:
- 1 × PCIe ×16 slot (Gen3, 8 lanes) in Cassette
- 1 × mini‑PCIe socket with SIM slot (mux with mSATA)
- 1 × MezIO™ expansion port
Power Input: 8 – 35 V DC via 3‑pin terminal block
Power Consumption:
72 W max (i7‑8700T @ 35 W mode)
68.4 W max (i5‑8500T @ 35 W mode)
62.6 W max (i3‑8100T @ 35 W mode)
Dimensions: 240 × 225 × 90 mm
Weight: ≈ 4.4 kg (incl. CPU, RAM, HDD)
Mounting: Wall mount (standard) / DIN‑rail (optional)
Environmental Ratings:
- Operating Temp: –25 °C to +70 °C (35 W CPU) / –25 °C to +50 °C (65 W CPU)
- Storage Temp: –40 °C to +85 °C
- Humidity: 10 – 90 % non‑condensing
- Vibration: MIL‑STD‑810G Method 514.6 Cat. 4
- Shock: MIL‑STD‑810G Method 516.6 Proc. I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
### 4. Functionality
The Nuvo‑7002E operates as a high‑performance embedded controller for industrial and edge computing environments. Its fanless design enables silent, dust‑resistant operation, while the Q370 chipset and Coffee Lake CPU deliver desktop‑class performance.
Use Cases & Applications:
- Industrial automation and machine vision control
- Intelligent transportation and in‑vehicle computing
- Edge AI inference and data acquisition
- Surveillance, robotics, and process monitoring
- Factory control and SCADA systems
Operation & Compatibility:
- Supports Windows 10 x64, Ubuntu 16.04/18.04 LTS, Fedora 29, and other Linux kernels ≥ 4.15.18.
- Compatible with Intel® Optane™ Memory acceleration and RAID 0/1 storage.
- BIOS configurable for AMT 12.0 remote management, TPM 2.0 security, and Wake‑on‑LAN.
- Triple‑display output for visualization and HMI applications.
### 5. Components & Accessories
Included Items (Standard Packing List):
1. Nuvo‑7002E system unit
2. CPU bracket
3. Neousys Drivers & Utilities DVD
4. Wall‑mount brackets (2 pcs)
5. Foot pads (4 pcs)
6. 3‑pin power terminal block
7. HDD thermal pad (for 2.5″ HDD/SSD)
8. Screw pack and rubber spacers
Optional Accessories:
- PA‑160W‑OW: 160 W AC/DC adapter (20 V/8 A, –30 °C to +70 °C operation)
- Fan‑25: 25 × 25 × 10 mm fan assembly for 1‑slot Cassette
- DINRAIL‑O: DIN‑rail mounting kit for Nuvo‑7000 series
Connectors & Interfaces:
Front panel – USB, video, Ethernet, SIM slots, power button, LED indicators, reset button.
Rear panel – MezIO™ port, COM ports, audio jack, DC input, remote on/off terminal.
### 6. Installation & Setup
Requirements:
- DC power supply 8–35 V DC (160 W recommended for full load)
- Proper grounding and ESD precautions
- Qualified personnel for component installation
Mounting Options:
- Wall Mount: Attach two M4 brackets to chassis and secure to surface (perpendicular heatsink orientation recommended for optimal cooling).
- DIN‑Rail Mount: Optional kit with clip and bracket for cabinet installation.
Configuration:
- BIOS accessible via F2 key at boot; supports UEFI/Legacy boot, TPM enablement, RAID setup, and power management options.
- Supports Wake‑on‑LAN, Auto Wake on S5, and Power On After Power Failure settings.
- RAID 0/1 configuration available in Legacy or UEFI mode via Intel® RST utility.
Powering On:
- Front panel power button (non‑latched ATX switch)
- External 3‑pin remote on/off switch
- Wake‑on‑LAN magic packet
### 7. Performance & Capabilities
Processing Performance:
Up to 6 cores/12 threads (65 W TDP) with Intel® Core™ i7‑8700; significant performance gain over 6th/7th Gen platforms.
Graphics Performance:
Intel® UHD 630 GPU supports 4K DisplayPort output and triple independent displays.
Storage Performance:
- NVMe PCIe Gen3 ×4 M.2 SSD for high‑speed I/O (> 2 GB/s)
- RAID 0 for throughput or RAID 1 for redundancy
- Intel® Optane™ Memory acceleration supported
Network Performance:
Dual Intel® GbE controllers with dedicated PCIe lanes for maximum bandwidth and low latency.
Reliability:
- Fanless design eliminates mechanical failure points.
- Wide temperature operation (–25 °C to +70 °C).
- MIL‑STD‑810G vibration and shock resistance.
- ESD and surge protection on I/O ports.
Limitations:
- 65 W CPU operation limited to +50 °C ambient temperature.
- For sub‑zero operation, wide‑temperature SSD/HDD required.
### 8. Standards & Compliance
- Environmental: MIL‑STD‑810G (Method 514.6 Vibration, Method 516.6 Shock)
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Safety: IEC 60068‑2‑64 (Vibration) and IEC 60068‑2‑27 (Shock)
- Power over Ethernet (PoE+): IEEE 802.3at PSE (optional on other Nuvo‑7000 variants)
- Security: TPM 2.0 hardware module support
- Remote Management: Intel® AMT 12.0 compliant
- RoHS and WEEE: Compliant manufacturing process
### 9. Additional Information
Warranty & Support:
Neousys Technology provides a standard limited hardware warranty and lifetime technical support. Firmware and driver updates are available through the official website or authorized service partners.
Maintenance:
- Fanless design requires minimal maintenance.
- Periodic inspection of connectors and dust removal recommended.
- Only qualified personnel should service internal components.
Software & Updates:
- Drivers and utilities DVD included (one‑click installation for Windows 10 x64).
- Manual driver installation supported for chipset, graphics, audio, LAN, and ME components.
- WDT & DIO library available for Windows 10 x64 and WOW64 for watchdog and digital I/O control.
Watchdog Timer (WDT):
Hardware watchdog ensures system recovery from software hangs; programmable timeout via API library (InitWDT, SetWDT, StartWDT, ResetWDT, StopWDT).
PoE Control API (Series Feature):
For PoE‑enabled models, software functions allow port‑level power on/off control (GetStatusPoEPort, EnablePoEPort, DisablePoEPort).
Manufacturer Contact:
Neousys Technology Inc.
15F, No. 868‑3, Zhongzheng Rd., Zhonghe Dist., New Taipei City 23586, Taiwan
Tel: +886‑2‑2223‑6182 Email: sales@neousys‑tech.com
Website: [www.neousys‑tech.com](https://www.neousys-tech.com)
### Summary
The Nuvo‑7002E exemplifies Neousys Technology’s rugged embedded computing design philosophy—combining high‑performance Intel® Coffee Lake processing, extensive I/O connectivity, and a patented fanless thermal architecture within a compact industrial enclosure. Its wide temperature operation, shock and vibration resilience, and modular expandability through PCIe Cassette and MezIO™ interfaces make it a versatile solution for industrial automation, machine vision, and edge AI applications where uptime and reliability are paramount. With support for RAID, NVMe, Intel® Optane™, and remote management technologies, the Nuvo‑7002E delivers both computational power and system integrity for mission‑critical deployments.
### 1. Product Overview
Product Name: Nuvo‑7002E
Model: Nuvo‑7002E
Series: Nuvo‑7000 Series (Rugged Embedded Fanless Controllers)
Article Number: Nuvo‑7002E
Manufacturer: Neousys Technology Inc. (Taipei, Taiwan)
The Nuvo‑7002E is a rugged, industrial‑grade fanless embedded controller designed by Neousys Technology as part of its flagship Nuvo‑7000 series. It integrates Intel® 8th‑Generation Coffee Lake Core™ i processors and the Intel® Q370 chipset, offering high‑performance computing in a compact, thermally optimized, and maintenance‑free chassis. The system is engineered for industrial automation, machine vision, transportation, and edge computing applications requiring reliability under harsh environmental conditions.
### 2. Key Features
- Intel® 8th‑Gen Coffee Lake CPU Support:
Supports LGA1151 socket processors up to 6 cores/12 threads, including Intel® Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
Configurable TDP of 35 W or 65 W for performance‑to‑thermal optimization.
- Fanless Thermal Design:
Advanced passive cooling architecture ensures silent operation and long‑term reliability in environments from ‑25 °C to +70 °C (with 35 W CPU).
- Intel® Q370 Chipset:
Provides high‑speed I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Integrated Intel® UHD Graphics 630:
Supports triple independent display outputs via VGA, DVI‑D, and DisplayPort (up to 4096 × 2304 resolution).
- Patented Expansion Cassette:
One PCIe ×16 slot (Gen3, 8‑lane signals) in a thermally isolated compartment for add‑on cards, simplifying installation and improving heat dissipation.
- MezIO™ Interface:
Proprietary high‑speed mezzanine connector for modular I/O expansion (digital I/O, serial, GbE, USB, ignition control, etc.).
- Comprehensive I/O Connectivity:
2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT), 8 × USB 3.1 (4 × Gen2 10 Gbps + 4 × Gen1 5 Gbps), 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232), audio I/O, and dual mSATA/M.2 expansion.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW).
- Rugged Reliability:
MIL‑STD‑810G‑compliant vibration (5 Grms, 5–500 Hz) and shock (50 Grms, 11 ms) resistance; CE/FCC Class A EMC compliance.
- Compact Industrial Form Factor:
240 mm (W) × 225 mm (D) × 90 mm (H), 4.4 kg, wall‑mount or optional DIN‑rail installation.
### 3. Technical Specifications
Processor Support:
Intel® 8th‑Gen Coffee Lake CPUs (LGA1151, 35 W/65 W TDP)
– Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, Celeron® G4900/G4900T
Chipset: Intel® Q370 Platform Controller Hub
Graphics: Intel® UHD 630 integrated GPU
Memory: Up to 64 GB DDR4‑2666/2400 MHz SDRAM (2 × SODIMM slots)
Storage:
- 2 × 2.5″ SATA III ports (RAID 0/1, up to 15 mm thickness)
- 1 × M.2 2280 (M key) NVMe PCIe Gen3 ×4 slot (NVMe SSD or Intel® Optane™ Memory)
- 1 × full‑size mSATA (mux with mini‑PCIe)
- 1 × M.2 2242 (B key) slot with dual front‑accessible SIM sockets
Ethernet:
2 × GbE ports (Intel® I219‑LM + I210‑IT)
Wake‑on‑LAN and Intel® AMT 12.0 supported
USB:
4 × USB 3.1 Gen2 (10 Gbps) + 4 × USB 3.1 Gen1 (5 Gbps)
Serial Ports:
2 × RS‑232/422/485 software‑selectable (COM1/COM2)
2 × RS‑232 (COM3/COM4)
Audio: 1 × 3.5 mm jack (mic‑in / speaker‑out)
Video Outputs:
- VGA (1920 × 1200 @ 60 Hz)
- DVI‑D (1920 × 1200 @ 60 Hz)
- DisplayPort (4096 × 2304 @ 60 Hz)
Expansion:
- 1 × PCIe ×16 slot (Gen3, 8 lanes) in Cassette
- 1 × mini‑PCIe socket with SIM slot (mux with mSATA)
- 1 × MezIO™ expansion port
Power Input: 8 – 35 V DC via 3‑pin terminal block
Power Consumption:
72 W max (i7‑8700T @ 35 W mode)
68.4 W max (i5‑8500T @ 35 W mode)
62.6 W max (i3‑8100T @ 35 W mode)
Dimensions: 240 × 225 × 90 mm
Weight: ≈ 4.4 kg (incl. CPU, RAM, HDD)
Mounting: Wall mount (standard) / DIN‑rail (optional)
Environmental Ratings:
- Operating Temp: –25 °C to +70 °C (35 W CPU) / –25 °C to +50 °C (65 W CPU)
- Storage Temp: –40 °C to +85 °C
- Humidity: 10 – 90 % non‑condensing
- Vibration: MIL‑STD‑810G Method 514.6 Cat. 4
- Shock: MIL‑STD‑810G Method 516.6 Proc. I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
### 4. Functionality
The Nuvo‑7002E operates as a high‑performance embedded controller for industrial and edge computing environments. Its fanless design enables silent, dust‑resistant operation, while the Q370 chipset and Coffee Lake CPU deliver desktop‑class performance.
Use Cases & Applications:
- Industrial automation and machine vision control
- Intelligent transportation and in‑vehicle computing
- Edge AI inference and data acquisition
- Surveillance, robotics, and process monitoring
- Factory control and SCADA systems
Operation & Compatibility:
- Supports Windows 10 x64, Ubuntu 16.04/18.04 LTS, Fedora 29, and other Linux kernels ≥ 4.15.18.
- Compatible with Intel® Optane™ Memory acceleration and RAID 0/1 storage.
- BIOS configurable for AMT 12.0 remote management, TPM 2.0 security, and Wake‑on‑LAN.
- Triple‑display output for visualization and HMI applications.
### 5. Components & Accessories
Included Items (Standard Packing List):
1. Nuvo‑7002E system unit
2. CPU bracket
3. Neousys Drivers & Utilities DVD
4. Wall‑mount brackets (2 pcs)
5. Foot pads (4 pcs)
6. 3‑pin power terminal block
7. HDD thermal pad (for 2.5″ HDD/SSD)
8. Screw pack and rubber spacers
Optional Accessories:
- PA‑160W‑OW: 160 W AC/DC adapter (20 V/8 A, –30 °C to +70 °C operation)
- Fan‑25: 25 × 25 × 10 mm fan assembly for 1‑slot Cassette
- DINRAIL‑O: DIN‑rail mounting kit for Nuvo‑7000 series
Connectors & Interfaces:
Front panel – USB, video, Ethernet, SIM slots, power button, LED indicators, reset button.
Rear panel – MezIO™ port, COM ports, audio jack, DC input, remote on/off terminal.
### 6. Installation & Setup
Requirements:
- DC power supply 8–35 V DC (160 W recommended for full load)
- Proper grounding and ESD precautions
- Qualified personnel for component installation
Mounting Options:
- Wall Mount: Attach two M4 brackets to chassis and secure to surface (perpendicular heatsink orientation recommended for optimal cooling).
- DIN‑Rail Mount: Optional kit with clip and bracket for cabinet installation.
Configuration:
- BIOS accessible via F2 key at boot; supports UEFI/Legacy boot, TPM enablement, RAID setup, and power management options.
- Supports Wake‑on‑LAN, Auto Wake on S5, and Power On After Power Failure settings.
- RAID 0/1 configuration available in Legacy or UEFI mode via Intel® RST utility.
Powering On:
- Front panel power button (non‑latched ATX switch)
- External 3‑pin remote on/off switch
- Wake‑on‑LAN magic packet
### 7. Performance & Capabilities
Processing Performance:
Up to 6 cores/12 threads (65 W TDP) with Intel® Core™ i7‑8700; significant performance gain over 6th/7th Gen platforms.
Graphics Performance:
Intel® UHD 630 GPU supports 4K DisplayPort output and triple independent displays.
Storage Performance:
- NVMe PCIe Gen3 ×4 M.2 SSD for high‑speed I/O (> 2 GB/s)
- RAID 0 for throughput or RAID 1 for redundancy
- Intel® Optane™ Memory acceleration supported
Network Performance:
Dual Intel® GbE controllers with dedicated PCIe lanes for maximum bandwidth and low latency.
Reliability:
- Fanless design eliminates mechanical failure points.
- Wide temperature operation (–25 °C to +70 °C).
- MIL‑STD‑810G vibration and shock resistance.
- ESD and surge protection on I/O ports.
Limitations:
- 65 W CPU operation limited to +50 °C ambient temperature.
- For sub‑zero operation, wide‑temperature SSD/HDD required.
### 8. Standards & Compliance
- Environmental: MIL‑STD‑810G (Method 514.6 Vibration, Method 516.6 Shock)
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Safety: IEC 60068‑2‑64 (Vibration) and IEC 60068‑2‑27 (Shock)
- Power over Ethernet (PoE+): IEEE 802.3at PSE (optional on other Nuvo‑7000 variants)
- Security: TPM 2.0 hardware module support
- Remote Management: Intel® AMT 12.0 compliant
- RoHS and WEEE: Compliant manufacturing process
### 9. Additional Information
Warranty & Support:
Neousys Technology provides a standard limited hardware warranty and lifetime technical support. Firmware and driver updates are available through the official website or authorized service partners.
Maintenance:
- Fanless design requires minimal maintenance.
- Periodic inspection of connectors and dust removal recommended.
- Only qualified personnel should service internal components.
Software & Updates:
- Drivers and utilities DVD included (one‑click installation for Windows 10 x64).
- Manual driver installation supported for chipset, graphics, audio, LAN, and ME components.
- WDT & DIO library available for Windows 10 x64 and WOW64 for watchdog and digital I/O control.
Watchdog Timer (WDT):
Hardware watchdog ensures system recovery from software hangs; programmable timeout via API library (InitWDT, SetWDT, StartWDT, ResetWDT, StopWDT).
PoE Control API (Series Feature):
For PoE‑enabled models, software functions allow port‑level power on/off control (GetStatusPoEPort, EnablePoEPort, DisablePoEPort).
Manufacturer Contact:
Neousys Technology Inc.
15F, No. 868‑3, Zhongzheng Rd., Zhonghe Dist., New Taipei City 23586, Taiwan
Tel: +886‑2‑2223‑6182 Email: sales@neousys‑tech.com
Website: [www.neousys‑tech.com](https://www.neousys-tech.com)
### Summary
The Nuvo‑7002E exemplifies Neousys Technology’s rugged embedded computing design philosophy—combining high‑performance Intel® Coffee Lake processing, extensive I/O connectivity, and a patented fanless thermal architecture within a compact industrial enclosure. Its wide temperature operation, shock and vibration resilience, and modular expandability through PCIe Cassette and MezIO™ interfaces make it a versatile solution for industrial automation, machine vision, and edge AI applications where uptime and reliability are paramount. With support for RAID, NVMe, Intel® Optane™, and remote management technologies, the Nuvo‑7002E delivers both computational power and system integrity for mission‑critical deployments.
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Nuvo-7000EP_datasheet.pdf
PDF Catalog
- PA-160W-OW - 160W AC/DC power adapter 20V/8A
- MezIO - Interchangeable Mezzanine I/O Boards
