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- Intel® 9th/8th Gen Core™ i7/i5/i3 LGA1151 CPU Support:
Compatible with 35W and 65W TDP processors, including Core i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
- Intel® Q370 Chipset:
Provides advanced I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Fanless Design:
Passive cooling architecture ensures silent operation and long-term reliability in harsh environments.
- Dual Gigabit Ethernet Ports:
Two Intel® controllers (I219-LM and I210-IT) provide reliable network connectivity with support for Wake-on-LAN and AMT remote management.
- Rich I/O Connectivity:
8× USB 3.1 ports (4× Gen2, 4× Gen1), 4× COM ports (2× RS-232/422/485 software-programmable, 2× RS-232), audio I/O, and multiple video outputs (VGA, DVI-D, DisplayPort).
- Triple Independent Display Support:
Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA, DVI-D, and DisplayPort up to 4K resolution.
- Flexible Storage Options:
- 1× front-accessible hot-swappable 2.5" SATA III HDD/SSD bay (up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD bay (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- Expansion Capability:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual front-accessible SIM sockets
- 1× MezIO™ expansion port for modular I/O expansion
- Wide Power Input Range:
8–35 VDC input via 3-pin terminal block, supporting industrial and vehicular power systems.
- Rugged Environmental Design:
- Operating temperature: -25°C to +70°C (35W CPU)
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Compact Low-Profile Chassis:
240 mm (W) × 225 mm (D) × 79 mm (H), 3.1 kg weight, optimized for space-constrained installations.
- Hot-Swappable Drive Bay:
Unique to the LP variant, enabling quick maintenance and RAID 0/1 configurations.
- TPM 2.0 and AMT 12.0 Support:
Hardware-based security and remote management capabilities.
Compatible with 35W and 65W TDP processors, including Core i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
- Intel® Q370 Chipset:
Provides advanced I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Fanless Design:
Passive cooling architecture ensures silent operation and long-term reliability in harsh environments.
- Dual Gigabit Ethernet Ports:
Two Intel® controllers (I219-LM and I210-IT) provide reliable network connectivity with support for Wake-on-LAN and AMT remote management.
- Rich I/O Connectivity:
8× USB 3.1 ports (4× Gen2, 4× Gen1), 4× COM ports (2× RS-232/422/485 software-programmable, 2× RS-232), audio I/O, and multiple video outputs (VGA, DVI-D, DisplayPort).
- Triple Independent Display Support:
Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA, DVI-D, and DisplayPort up to 4K resolution.
- Flexible Storage Options:
- 1× front-accessible hot-swappable 2.5" SATA III HDD/SSD bay (up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD bay (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- Expansion Capability:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual front-accessible SIM sockets
- 1× MezIO™ expansion port for modular I/O expansion
- Wide Power Input Range:
8–35 VDC input via 3-pin terminal block, supporting industrial and vehicular power systems.
- Rugged Environmental Design:
- Operating temperature: -25°C to +70°C (35W CPU)
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Compact Low-Profile Chassis:
240 mm (W) × 225 mm (D) × 79 mm (H), 3.1 kg weight, optimized for space-constrained installations.
- Hot-Swappable Drive Bay:
Unique to the LP variant, enabling quick maintenance and RAID 0/1 configurations.
- TPM 2.0 and AMT 12.0 Support:
Hardware-based security and remote management capabilities.
Comprehensive Product Summary – Nuvo-7002LP
### 1. Product Overview
Product Name: Nuvo-7002LP
Model Number: Nuvo-7002LP
Series: Nuvo-7000 Series (Low-Profile Variant)
Article Number: Nuvo-7002LP
Manufacturer: Neousys Technology Inc.
Product Type: Rugged Fanless Embedded Controller
Category: Industrial Embedded Computing / Rugged Edge Controller
The Nuvo-7002LP is a compact, rugged, fanless embedded controller designed by Neousys Technology as part of its Nuvo-7000 series. It is built around Intel’s 8th/9th Generation Coffee Lake Core™ i processors and the Intel® Q370 chipset, offering high-performance computing in a low-profile chassis. The system is engineered for industrial automation, machine vision, transportation, and edge computing applications requiring reliability, wide temperature tolerance, and versatile I/O connectivity.
### 2. Key Features
- Intel® 9th/8th Gen Core™ i7/i5/i3 LGA1151 CPU Support:
Compatible with 35W and 65W TDP processors, including Core i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
- Intel® Q370 Chipset:
Provides advanced I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Fanless Design:
Passive cooling architecture ensures silent operation and long-term reliability in harsh environments.
- Dual Gigabit Ethernet Ports:
Two Intel® controllers (I219-LM and I210-IT) provide reliable network connectivity with support for Wake-on-LAN and AMT remote management.
- Rich I/O Connectivity:
8× USB 3.1 ports (4× Gen2, 4× Gen1), 4× COM ports (2× RS-232/422/485 software-programmable, 2× RS-232), audio I/O, and multiple video outputs (VGA, DVI-D, DisplayPort).
- Triple Independent Display Support:
Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA, DVI-D, and DisplayPort up to 4K resolution.
- Flexible Storage Options:
- 1× front-accessible hot-swappable 2.5" SATA III HDD/SSD bay (up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD bay (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- Expansion Capability:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual front-accessible SIM sockets
- 1× MezIO™ expansion port for modular I/O expansion
- Wide Power Input Range:
8–35 VDC input via 3-pin terminal block, supporting industrial and vehicular power systems.
- Rugged Environmental Design:
- Operating temperature: -25°C to +70°C (35W CPU)
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Compact Low-Profile Chassis:
240 mm (W) × 225 mm (D) × 79 mm (H), 3.1 kg weight, optimized for space-constrained installations.
- Hot-Swappable Drive Bay:
Unique to the LP variant, enabling quick maintenance and RAID 0/1 configurations.
- TPM 2.0 and AMT 12.0 Support:
Hardware-based security and remote management capabilities.
### 3. Technical Specifications
Processor Support:
Intel® 8th/9th Gen Coffee Lake CPUs (LGA1151 socket, 35W/65W TDP)
- Core™ i7-8700 / i7-8700T
- Core™ i5-8500 / i5-8500T
- Core™ i3-8100 / i3-8100T
- Pentium® G5400 / G5400T
- Celeron® G4900 / G4900T
Chipset: Intel® Q370 Platform Controller Hub
Graphics: Integrated Intel® UHD Graphics 630
Memory: Up to 64 GB DDR4 2666/2400 SDRAM (2× SODIMM slots)
Storage:
- 1× front-accessible 2.5" SATA III HDD/SSD (hot-swappable, up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe SSD slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- RAID 0/1 supported
Expansion:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual SIM sockets
- 1× MezIO™ expansion port
I/O Interfaces:
- Ethernet: 2× GbE (Intel® I219-LM + I210-IT)
- USB: 8× USB 3.1 (4× Gen2 10 Gbps, 4× Gen1 5 Gbps)
- Serial: 2× RS-232/422/485 (COM1/2, software-programmable), 2× RS-232 (COM3/4)
- Audio: 1× 3.5 mm 4-pole jack (mic-in/speaker-out)
- Video Outputs:
- 1× VGA (1920×1200)
- 1× DVI-D (1920×1200)
- 1× DisplayPort (4096×2304)
Power Supply:
- Input: 8–35 VDC via 3-pin terminal block
- Optional 160W AC/DC adapter (PA-160W-OW)
- Power consumption (max):
- i7-8700T: 72 W @ 24 V
- i5-8500T: 68.4 W @ 24 V
- i3-8100T: 62.6 W @ 24 V
Mechanical:
- Dimensions: 240 × 225 × 79 mm
- Weight: 3.1 kg
- Mounting: Wall-mount (standard) / DIN-rail (optional)
Environmental:
- Operating Temperature:
- -25°C to +70°C (35W CPU)
- -25°C to +50°C (65W CPU)
- Storage Temperature: -40°C to +85°C
- Humidity: 10–90%, non-condensing
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032, EN 55024)
### 4. Functionality
The Nuvo-7002LP operates as a rugged embedded controller for industrial and edge computing applications. It integrates Intel’s Coffee Lake architecture for high-performance multi-threaded processing and supports triple independent displays for visualization and control interfaces.
Use Cases:
- Industrial automation and machine vision systems
- Intelligent transportation and in-vehicle computing
- Edge AI and data acquisition
- Surveillance and security systems
- Factory control and process monitoring
Operation:
The system’s fanless design ensures silent, maintenance-free operation. It supports RAID configurations for data redundancy or performance, and the hot-swappable drive bay allows quick replacement without downtime. The MezIO™ interface enables modular expansion for application-specific I/O such as DIO, additional COM ports, or ignition control.
Compatibility:
Supports Windows 10 (x64), Ubuntu 16.04/18.04 LTS, and Fedora 29. Linux kernel 4.15.18 or later recommended. Drivers for Intel® graphics, LAN, and chipset are available via Neousys or Intel.
### 5. Components & Accessories
Included Items:
- Nuvo-7002LP system unit
- CPU bracket
- Wall-mount brackets (2 pcs)
- Foot pads (4 pcs)
- 3-pin power terminal block
- HDD thermal pad
- Screw pack
- Key for 2.5" hot-swappable drive bay
- Neousys Drivers & Utilities DVD
Optional Accessories:
- PA-160W-OW: 160W AC/DC power adapter (20V/8A, -30°C to +70°C)
- DINRAIL-O: DIN-rail mounting kit
- Fan-25: 25×25×10 mm fan assembly (for cassette variants)
Expansion Modules (via MezIO™):
- MezIO-DIO: Digital I/O module
- MezIO-RS232/422/485: Serial communication module
- MezIO-GbE: Additional Ethernet ports
- MezIO-IGN: Ignition power control module
### 6. Installation & Setup
Requirements:
- DC power source (8–35 VDC)
- Compatible CPU, DDR4 SODIMM memory, and storage devices
- Proper grounding and ESD precautions during installation
Mounting Options:
- Wall-mount (standard brackets included)
- DIN-rail (optional kit)
- Heatsink fins should be oriented vertically for optimal heat dissipation
Configuration:
- BIOS accessible via F2 during boot
- Supports AMT configuration, RAID setup, TPM enablement, and power management settings
- Wake-on-LAN and remote power control supported
Hot-Swap Drive Installation:
- Unlock front bay with provided key
- Insert 2.5" SATA drive (label up)
- Push until fully seated and lock
Power-On Methods:
- Front panel power button
- External non-latched switch via 3-pin remote connector
- Wake-on-LAN (WOL) via Intel® I219-LM port
### 7. Performance & Capabilities
Processing Power:
Up to 6-core/12-thread Intel® Core™ i7 CPU with 65W TDP, configurable to 35W for thermal optimization.
Graphics Performance:
Intel® UHD Graphics 630 supports 4K UHD output and triple independent display operation.
Storage Performance:
- NVMe SSD (PCIe Gen3 x4) for high-speed data access
- RAID 0/1 for redundancy or performance
- Intel® Optane™ memory acceleration supported
Network Performance:
Dual independent Gigabit Ethernet ports with dedicated PCIe lanes ensure full bandwidth utilization.
Reliability:
- Fanless thermal design for 24/7 operation
- Wide temperature and vibration tolerance
- BIOS-configurable watchdog timer for system recovery
Limitations:
- 65W CPUs limited to +50°C ambient operation
- Requires wide-temperature SSDs for sub-zero environments
### 8. Standards & Compliance
Environmental & Mechanical Standards:
- MIL-STD-810G (Vibration & Shock)
- IEC60068-2-64 (Vibration)
- IEC60068-2-27 (Shock)
EMC & Safety:
- CE/FCC Class A (EN 55032, EN 55024)
- RoHS compliant
Regulatory Compliance:
- FCC Part 15, Class A digital device
- CE marking for European Union conformity
Security & Management:
- TPM 2.0 hardware security module
- Intel® AMT 12.0 for remote management and diagnostics
### 9. Additional Information
Warranty:
Standard Neousys warranty (refer to manufacturer’s policy). Typically covers hardware defects under normal operation.
Support & Maintenance:
- Technical support via Neousys regional offices (Taiwan, USA, China)
- Firmware, BIOS, and driver updates available through official website
- Only qualified personnel should perform internal servicing
Maintenance Guidelines:
- Disconnect power before servicing
- Use ESD protection when handling internal components
- Ensure proper ventilation and avoid dust accumulation
Software & Driver Updates:
- Drivers & Utilities DVD included
- Automatic or manual installation options
- Intel® Optane™ and RAID configuration supported via Intel® RST utility
Operating System Support:
- Windows 10 (x64)
- Ubuntu 16.04/18.04 LTS
- Fedora 29
- Other Linux distributions with kernel ≥ 4.15.18
Manufacturer Contact:
- Neousys Technology Inc.
15F, No.868-3, Zhongzheng Rd., Zhonghe Dist., New Taipei City 23586, Taiwan
Tel: +886-2-2223-6182 | Email: sales@neousys-tech.com
Website: [www.neousys-tech.com](https://www.neousys-tech.com)
### Summary
The Neousys Nuvo-7002LP is a high-performance, low-profile, fanless embedded controller engineered for industrial and edge computing environments. It combines Intel® 8th/9th Gen Coffee Lake processing power with rugged mechanical design, wide temperature operation, and extensive I/O flexibility. Its hot-swappable storage bay, dual GbE ports, and modular MezIO™ expansion make it ideal for automation, machine vision, and transportation systems requiring reliability, scalability, and long lifecycle support.
With compliance to MIL-STD-810G and CE/FCC Class A standards, the Nuvo-7002LP delivers robust performance in demanding conditions, ensuring continuous operation in mission-critical applications.
### 1. Product Overview
Product Name: Nuvo-7002LP
Model Number: Nuvo-7002LP
Series: Nuvo-7000 Series (Low-Profile Variant)
Article Number: Nuvo-7002LP
Manufacturer: Neousys Technology Inc.
Product Type: Rugged Fanless Embedded Controller
Category: Industrial Embedded Computing / Rugged Edge Controller
The Nuvo-7002LP is a compact, rugged, fanless embedded controller designed by Neousys Technology as part of its Nuvo-7000 series. It is built around Intel’s 8th/9th Generation Coffee Lake Core™ i processors and the Intel® Q370 chipset, offering high-performance computing in a low-profile chassis. The system is engineered for industrial automation, machine vision, transportation, and edge computing applications requiring reliability, wide temperature tolerance, and versatile I/O connectivity.
### 2. Key Features
- Intel® 9th/8th Gen Core™ i7/i5/i3 LGA1151 CPU Support:
Compatible with 35W and 65W TDP processors, including Core i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T.
- Intel® Q370 Chipset:
Provides advanced I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support.
- Fanless Design:
Passive cooling architecture ensures silent operation and long-term reliability in harsh environments.
- Dual Gigabit Ethernet Ports:
Two Intel® controllers (I219-LM and I210-IT) provide reliable network connectivity with support for Wake-on-LAN and AMT remote management.
- Rich I/O Connectivity:
8× USB 3.1 ports (4× Gen2, 4× Gen1), 4× COM ports (2× RS-232/422/485 software-programmable, 2× RS-232), audio I/O, and multiple video outputs (VGA, DVI-D, DisplayPort).
- Triple Independent Display Support:
Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA, DVI-D, and DisplayPort up to 4K resolution.
- Flexible Storage Options:
- 1× front-accessible hot-swappable 2.5" SATA III HDD/SSD bay (up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD bay (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- Expansion Capability:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual front-accessible SIM sockets
- 1× MezIO™ expansion port for modular I/O expansion
- Wide Power Input Range:
8–35 VDC input via 3-pin terminal block, supporting industrial and vehicular power systems.
- Rugged Environmental Design:
- Operating temperature: -25°C to +70°C (35W CPU)
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032 & EN 55024)
- Compact Low-Profile Chassis:
240 mm (W) × 225 mm (D) × 79 mm (H), 3.1 kg weight, optimized for space-constrained installations.
- Hot-Swappable Drive Bay:
Unique to the LP variant, enabling quick maintenance and RAID 0/1 configurations.
- TPM 2.0 and AMT 12.0 Support:
Hardware-based security and remote management capabilities.
### 3. Technical Specifications
Processor Support:
Intel® 8th/9th Gen Coffee Lake CPUs (LGA1151 socket, 35W/65W TDP)
- Core™ i7-8700 / i7-8700T
- Core™ i5-8500 / i5-8500T
- Core™ i3-8100 / i3-8100T
- Pentium® G5400 / G5400T
- Celeron® G4900 / G4900T
Chipset: Intel® Q370 Platform Controller Hub
Graphics: Integrated Intel® UHD Graphics 630
Memory: Up to 64 GB DDR4 2666/2400 SDRAM (2× SODIMM slots)
Storage:
- 1× front-accessible 2.5" SATA III HDD/SSD (hot-swappable, up to 9.5 mm)
- 1× internal 2.5" SATA III HDD/SSD (up to 15 mm)
- 1× M.2 2280 (M Key) NVMe SSD slot (PCIe Gen3 x4)
- 1× full-size mSATA (mux with mini-PCIe)
- RAID 0/1 supported
Expansion:
- 1× mini-PCIe slot with internal SIM socket
- 1× M.2 2242 (B Key) slot with dual SIM sockets
- 1× MezIO™ expansion port
I/O Interfaces:
- Ethernet: 2× GbE (Intel® I219-LM + I210-IT)
- USB: 8× USB 3.1 (4× Gen2 10 Gbps, 4× Gen1 5 Gbps)
- Serial: 2× RS-232/422/485 (COM1/2, software-programmable), 2× RS-232 (COM3/4)
- Audio: 1× 3.5 mm 4-pole jack (mic-in/speaker-out)
- Video Outputs:
- 1× VGA (1920×1200)
- 1× DVI-D (1920×1200)
- 1× DisplayPort (4096×2304)
Power Supply:
- Input: 8–35 VDC via 3-pin terminal block
- Optional 160W AC/DC adapter (PA-160W-OW)
- Power consumption (max):
- i7-8700T: 72 W @ 24 V
- i5-8500T: 68.4 W @ 24 V
- i3-8100T: 62.6 W @ 24 V
Mechanical:
- Dimensions: 240 × 225 × 79 mm
- Weight: 3.1 kg
- Mounting: Wall-mount (standard) / DIN-rail (optional)
Environmental:
- Operating Temperature:
- -25°C to +70°C (35W CPU)
- -25°C to +50°C (65W CPU)
- Storage Temperature: -40°C to +85°C
- Humidity: 10–90%, non-condensing
- Vibration: MIL-STD-810G, Method 514.6, Category 4
- Shock: MIL-STD-810G, Method 516.6, Procedure I
- EMC: CE/FCC Class A (EN 55032, EN 55024)
### 4. Functionality
The Nuvo-7002LP operates as a rugged embedded controller for industrial and edge computing applications. It integrates Intel’s Coffee Lake architecture for high-performance multi-threaded processing and supports triple independent displays for visualization and control interfaces.
Use Cases:
- Industrial automation and machine vision systems
- Intelligent transportation and in-vehicle computing
- Edge AI and data acquisition
- Surveillance and security systems
- Factory control and process monitoring
Operation:
The system’s fanless design ensures silent, maintenance-free operation. It supports RAID configurations for data redundancy or performance, and the hot-swappable drive bay allows quick replacement without downtime. The MezIO™ interface enables modular expansion for application-specific I/O such as DIO, additional COM ports, or ignition control.
Compatibility:
Supports Windows 10 (x64), Ubuntu 16.04/18.04 LTS, and Fedora 29. Linux kernel 4.15.18 or later recommended. Drivers for Intel® graphics, LAN, and chipset are available via Neousys or Intel.
### 5. Components & Accessories
Included Items:
- Nuvo-7002LP system unit
- CPU bracket
- Wall-mount brackets (2 pcs)
- Foot pads (4 pcs)
- 3-pin power terminal block
- HDD thermal pad
- Screw pack
- Key for 2.5" hot-swappable drive bay
- Neousys Drivers & Utilities DVD
Optional Accessories:
- PA-160W-OW: 160W AC/DC power adapter (20V/8A, -30°C to +70°C)
- DINRAIL-O: DIN-rail mounting kit
- Fan-25: 25×25×10 mm fan assembly (for cassette variants)
Expansion Modules (via MezIO™):
- MezIO-DIO: Digital I/O module
- MezIO-RS232/422/485: Serial communication module
- MezIO-GbE: Additional Ethernet ports
- MezIO-IGN: Ignition power control module
### 6. Installation & Setup
Requirements:
- DC power source (8–35 VDC)
- Compatible CPU, DDR4 SODIMM memory, and storage devices
- Proper grounding and ESD precautions during installation
Mounting Options:
- Wall-mount (standard brackets included)
- DIN-rail (optional kit)
- Heatsink fins should be oriented vertically for optimal heat dissipation
Configuration:
- BIOS accessible via F2 during boot
- Supports AMT configuration, RAID setup, TPM enablement, and power management settings
- Wake-on-LAN and remote power control supported
Hot-Swap Drive Installation:
- Unlock front bay with provided key
- Insert 2.5" SATA drive (label up)
- Push until fully seated and lock
Power-On Methods:
- Front panel power button
- External non-latched switch via 3-pin remote connector
- Wake-on-LAN (WOL) via Intel® I219-LM port
### 7. Performance & Capabilities
Processing Power:
Up to 6-core/12-thread Intel® Core™ i7 CPU with 65W TDP, configurable to 35W for thermal optimization.
Graphics Performance:
Intel® UHD Graphics 630 supports 4K UHD output and triple independent display operation.
Storage Performance:
- NVMe SSD (PCIe Gen3 x4) for high-speed data access
- RAID 0/1 for redundancy or performance
- Intel® Optane™ memory acceleration supported
Network Performance:
Dual independent Gigabit Ethernet ports with dedicated PCIe lanes ensure full bandwidth utilization.
Reliability:
- Fanless thermal design for 24/7 operation
- Wide temperature and vibration tolerance
- BIOS-configurable watchdog timer for system recovery
Limitations:
- 65W CPUs limited to +50°C ambient operation
- Requires wide-temperature SSDs for sub-zero environments
### 8. Standards & Compliance
Environmental & Mechanical Standards:
- MIL-STD-810G (Vibration & Shock)
- IEC60068-2-64 (Vibration)
- IEC60068-2-27 (Shock)
EMC & Safety:
- CE/FCC Class A (EN 55032, EN 55024)
- RoHS compliant
Regulatory Compliance:
- FCC Part 15, Class A digital device
- CE marking for European Union conformity
Security & Management:
- TPM 2.0 hardware security module
- Intel® AMT 12.0 for remote management and diagnostics
### 9. Additional Information
Warranty:
Standard Neousys warranty (refer to manufacturer’s policy). Typically covers hardware defects under normal operation.
Support & Maintenance:
- Technical support via Neousys regional offices (Taiwan, USA, China)
- Firmware, BIOS, and driver updates available through official website
- Only qualified personnel should perform internal servicing
Maintenance Guidelines:
- Disconnect power before servicing
- Use ESD protection when handling internal components
- Ensure proper ventilation and avoid dust accumulation
Software & Driver Updates:
- Drivers & Utilities DVD included
- Automatic or manual installation options
- Intel® Optane™ and RAID configuration supported via Intel® RST utility
Operating System Support:
- Windows 10 (x64)
- Ubuntu 16.04/18.04 LTS
- Fedora 29
- Other Linux distributions with kernel ≥ 4.15.18
Manufacturer Contact:
- Neousys Technology Inc.
15F, No.868-3, Zhongzheng Rd., Zhonghe Dist., New Taipei City 23586, Taiwan
Tel: +886-2-2223-6182 | Email: sales@neousys-tech.com
Website: [www.neousys-tech.com](https://www.neousys-tech.com)
### Summary
The Neousys Nuvo-7002LP is a high-performance, low-profile, fanless embedded controller engineered for industrial and edge computing environments. It combines Intel® 8th/9th Gen Coffee Lake processing power with rugged mechanical design, wide temperature operation, and extensive I/O flexibility. Its hot-swappable storage bay, dual GbE ports, and modular MezIO™ expansion make it ideal for automation, machine vision, and transportation systems requiring reliability, scalability, and long lifecycle support.
With compliance to MIL-STD-810G and CE/FCC Class A standards, the Nuvo-7002LP delivers robust performance in demanding conditions, ensuring continuous operation in mission-critical applications.
-
Nuvo-7000EP_datasheet.pdf
PDF Catalog
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