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- Wide Temperature Range: Fully operational from –40°C to +85°C, ensuring stable performance in both extreme cold and high-heat environments.
- High Capacity: 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications.
- SO-DIMM Form Factor: Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers.
- DDR3 Technology: Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2.
- Low Power Operation: Typically operates at 1.5V (standard DDR3 voltage), reducing thermal output and energy consumption.
- High Reliability Components: Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance.
- Error-Free Data Transmission: Designed for robust signal integrity and consistent data throughput in electrically noisy environments.
- Compatibility: Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms.
- Rugged Design: Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.
- High Capacity: 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications.
- SO-DIMM Form Factor: Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers.
- DDR3 Technology: Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2.
- Low Power Operation: Typically operates at 1.5V (standard DDR3 voltage), reducing thermal output and energy consumption.
- High Reliability Components: Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance.
- Error-Free Data Transmission: Designed for robust signal integrity and consistent data throughput in electrically noisy environments.
- Compatibility: Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms.
- Rugged Design: Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.
1. Product Overview
Product Name: SO-DIMM DDR3 8GB Wide Temperature Memory Module
Model: 8GB-DDR3-WT
Series: DDR3 SO-DIMM Industrial Memory Series
Article Number: 8GB-DDR3-WT
Manufacturer: [Manufacturer not specified – typically used by industrial and embedded system integrators]
The 8GB-DDR3-WT is a high-reliability, industrial-grade DDR3 SO-DIMM memory module designed for embedded systems, industrial PCs, automation controllers, and rugged computing platforms that operate in extended temperature environments. This module provides 8 gigabytes of DDR3 SDRAM capacity in a compact, low-profile SO-DIMM form factor, optimized for systems requiring stable performance under harsh thermal conditions ranging from –40°C to +85°C.
2. Key Features
- Wide Temperature Range: Fully operational from –40°C to +85°C, ensuring stable performance in both extreme cold and high-heat environments.
- High Capacity: 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications.
- SO-DIMM Form Factor: Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers.
- DDR3 Technology: Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2.
- Low Power Operation: Typically operates at 1.5V (standard DDR3 voltage), reducing thermal output and energy consumption.
- High Reliability Components: Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance.
- Error-Free Data Transmission: Designed for robust signal integrity and consistent data throughput in electrically noisy environments.
- Compatibility: Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms.
- Rugged Design: Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.
3. Technical Specifications
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: 204-pin SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 8GB (8192MB)
- Data Rate: Typically supports DDR3-1333, DDR3-1600, or DDR3-1866 MHz (depending on system configuration and chipset support)
- Bus Width: 64-bit data bus
- Voltage: 1.5V ±0.075V (standard DDR3 operating voltage)
- Error Correction: Non-ECC (standard version); ECC variant may be available depending on manufacturer
- Rank Configuration: Single or dual rank (varies by module design)
- Chip Organization: x8 or x16 DRAM configuration
- Operating Temperature Range: –40°C to +85°C (wide temperature specification)
- Storage Temperature Range: –55°C to +100°C (typical for industrial-grade modules)
- Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- PCB Material: Multi-layer FR-4 or equivalent high-Tg substrate for thermal stability
- Compliance: JEDEC standard JESD79-3F for DDR3 SDRAM
4. Functionality
The 8GB-DDR3-WT module functions as a volatile memory component that temporarily stores data for active processes within a computing system. It operates synchronously with the system clock, allowing high-speed data transfer between the CPU and memory controller.
Use Cases and Applications:
- Industrial Automation: PLCs, motion controllers, and HMI systems requiring reliable memory under fluctuating temperatures.
- Embedded Computing: Single-board computers (SBCs), industrial motherboards, and fanless embedded PCs.
- Transportation Systems: Railway, automotive, and marine computing platforms exposed to wide temperature variations.
- Defense and Aerospace: Ruggedized systems where environmental resilience is critical.
- Networking Equipment: Routers, switches, and gateways operating in outdoor or unconditioned environments.
- IoT Edge Devices: Smart gateways and data acquisition units deployed in remote or harsh locations.
Compatibility:
The module is compatible with any system supporting DDR3 SO-DIMM memory slots and standard DDR3 voltage levels. It can be used in both x86 and ARM-based embedded platforms, provided the memory controller supports DDR3 technology.
5. Components & Accessories
Included Items:
- 1 × 8GB DDR3 SO-DIMM module (8GB-DDR3-WT)
- Standard anti-static packaging for ESD protection
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- ECC (Error-Correcting Code) variant for mission-critical applications
- Thermal spreader or heat sink for additional thermal management
- Custom labeling or serialization for OEM integration
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance
- Standard SO-DIMM notch keying to prevent incorrect installation
6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot(s)
- System BIOS or firmware supporting 8GB DDR3 modules
- Proper ESD handling procedures during installation
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retention clips lock into place.
- Ensure the module is properly seated and aligned with the slot key to prevent damage.
Configuration:
- The system automatically detects the module’s capacity, speed, and timing parameters via SPD (Serial Presence Detect) EEPROM.
- BIOS or firmware may allow manual configuration of memory frequency, latency, and voltage for performance tuning.
- No additional software or drivers are required; the module functions as standard system memory.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports data transfer rates up to 1600 MT/s (megatransfers per second), depending on system compatibility.
- Theoretical peak bandwidth up to 12.8 GB/s per module (DDR3-1600, 64-bit bus).
Capacity and Scalability:
- 8GB per module allows for flexible memory configurations in dual-channel or multi-slot systems.
- Suitable for systems requiring moderate to high memory capacity without excessive power draw.
Efficiency:
- Operates at 1.5V, offering a balance between performance and power efficiency.
- Low heat generation supports fanless or passively cooled system designs.
Reliability and Durability:
- Designed for continuous 24/7 operation in industrial environments.
- Wide temperature tolerance ensures consistent performance under thermal stress.
- High-quality DRAM chips undergo rigorous testing for endurance and data retention.
Limitations:
- Non-ECC version does not provide hardware-level error correction (ECC variant recommended for mission-critical systems).
- Performance depends on host system’s memory controller and BIOS configuration.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3 SO-DIMM standards (JESD79-3F).
- RoHS Directive: Conforms to RoHS (Restriction of Hazardous Substances) for environmental safety.
- REACH Compliance: Meets REACH regulations for chemical substance safety.
- CE Marking: Complies with European safety and electromagnetic compatibility requirements.
- UL Certification: Manufactured using UL-recognized materials and processes (depending on supplier).
- Environmental Standards: Designed for operation in accordance with IPC-A-610 Class 2 or Class 3 assembly standards for industrial electronics.
- ESD Protection: Packaged and handled per ANSI/ESD S20.20 standards to prevent electrostatic discharge damage.
9. Additional Information
Warranty:
Typically covered by a limited lifetime warranty or 3–5 year industrial warranty, depending on the manufacturer or distributor. Warranty covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer or authorized distributor.
- Engineering support for integration into custom embedded systems.
- Firmware and SPD configuration assistance for OEM customers.
Maintenance:
- No active maintenance required; memory modules are solid-state components with no moving parts.
- Periodic inspection recommended in high-vibration or high-dust environments to ensure secure seating.
- Avoid exposure to electrostatic discharge during handling or replacement.
Updates and Lifecycle:
- DDR3 technology remains widely supported in industrial and embedded markets, ensuring long-term availability.
- Product lifecycle typically exceeds 5–7 years for industrial-grade components.
- Successor modules may include DDR3L (1.35V) or DDR4 variants for future system upgrades.
### Summary
The 8GB-DDR3-WT SO-DIMM DDR3 8GB Wide Temperature Memory Module is a robust, industrial-grade memory solution engineered for demanding environments where reliability, endurance, and thermal resilience are critical. With its 8GB capacity, DDR3 performance, and wide operating temperature range of –40°C to +85°C, it is ideally suited for embedded, industrial, and rugged computing applications.
Its compliance with JEDEC standards, RoHS and REACH directives, and its compatibility with standard DDR3 SO-DIMM slots make it a versatile and dependable choice for system integrators and OEMs seeking stable long-term memory solutions. The module’s compact form factor, low power consumption, and high reliability ensure consistent performance across a wide range of industrial and embedded computing platforms.
Approximate Length: ~3,000 tokens (~12,000 characters)
Document Type: Comprehensive Technical Product Summary for 8GB-DDR3-WT
Product Name: SO-DIMM DDR3 8GB Wide Temperature Memory Module
Model: 8GB-DDR3-WT
Series: DDR3 SO-DIMM Industrial Memory Series
Article Number: 8GB-DDR3-WT
Manufacturer: [Manufacturer not specified – typically used by industrial and embedded system integrators]
The 8GB-DDR3-WT is a high-reliability, industrial-grade DDR3 SO-DIMM memory module designed for embedded systems, industrial PCs, automation controllers, and rugged computing platforms that operate in extended temperature environments. This module provides 8 gigabytes of DDR3 SDRAM capacity in a compact, low-profile SO-DIMM form factor, optimized for systems requiring stable performance under harsh thermal conditions ranging from –40°C to +85°C.
2. Key Features
- Wide Temperature Range: Fully operational from –40°C to +85°C, ensuring stable performance in both extreme cold and high-heat environments.
- High Capacity: 8GB of DDR3 SDRAM, suitable for memory-intensive industrial and embedded applications.
- SO-DIMM Form Factor: Compact 204-pin design optimized for space-constrained systems such as industrial PCs, edge devices, and embedded controllers.
- DDR3 Technology: Utilizes DDR3 SDRAM architecture for improved bandwidth, lower power consumption, and enhanced data integrity compared to DDR2.
- Low Power Operation: Typically operates at 1.5V (standard DDR3 voltage), reducing thermal output and energy consumption.
- High Reliability Components: Built using industrial-grade DRAM chips and PCB materials for long-term stability and endurance.
- Error-Free Data Transmission: Designed for robust signal integrity and consistent data throughput in electrically noisy environments.
- Compatibility: Fully compliant with JEDEC DDR3 SO-DIMM standards, ensuring interoperability with a wide range of industrial and embedded platforms.
- Rugged Design: Resistant to vibration, shock, and thermal cycling, making it ideal for mission-critical and field-deployed systems.
3. Technical Specifications
- Memory Type: DDR3 SDRAM (Double Data Rate Type 3 Synchronous Dynamic Random-Access Memory)
- Form Factor: 204-pin SO-DIMM (Small Outline Dual Inline Memory Module)
- Capacity: 8GB (8192MB)
- Data Rate: Typically supports DDR3-1333, DDR3-1600, or DDR3-1866 MHz (depending on system configuration and chipset support)
- Bus Width: 64-bit data bus
- Voltage: 1.5V ±0.075V (standard DDR3 operating voltage)
- Error Correction: Non-ECC (standard version); ECC variant may be available depending on manufacturer
- Rank Configuration: Single or dual rank (varies by module design)
- Chip Organization: x8 or x16 DRAM configuration
- Operating Temperature Range: –40°C to +85°C (wide temperature specification)
- Storage Temperature Range: –55°C to +100°C (typical for industrial-grade modules)
- Dimensions: Approx. 67.6 mm (L) × 30 mm (H) × 3.8 mm (T) (standard SO-DIMM dimensions)
- Weight: Approximately 8–10 grams
- PCB Material: Multi-layer FR-4 or equivalent high-Tg substrate for thermal stability
- Compliance: JEDEC standard JESD79-3F for DDR3 SDRAM
4. Functionality
The 8GB-DDR3-WT module functions as a volatile memory component that temporarily stores data for active processes within a computing system. It operates synchronously with the system clock, allowing high-speed data transfer between the CPU and memory controller.
Use Cases and Applications:
- Industrial Automation: PLCs, motion controllers, and HMI systems requiring reliable memory under fluctuating temperatures.
- Embedded Computing: Single-board computers (SBCs), industrial motherboards, and fanless embedded PCs.
- Transportation Systems: Railway, automotive, and marine computing platforms exposed to wide temperature variations.
- Defense and Aerospace: Ruggedized systems where environmental resilience is critical.
- Networking Equipment: Routers, switches, and gateways operating in outdoor or unconditioned environments.
- IoT Edge Devices: Smart gateways and data acquisition units deployed in remote or harsh locations.
Compatibility:
The module is compatible with any system supporting DDR3 SO-DIMM memory slots and standard DDR3 voltage levels. It can be used in both x86 and ARM-based embedded platforms, provided the memory controller supports DDR3 technology.
5. Components & Accessories
Included Items:
- 1 × 8GB DDR3 SO-DIMM module (8GB-DDR3-WT)
- Standard anti-static packaging for ESD protection
Optional Add-ons (depending on supplier):
- Conformal coating for enhanced moisture and dust resistance
- ECC (Error-Correcting Code) variant for mission-critical applications
- Thermal spreader or heat sink for additional thermal management
- Custom labeling or serialization for OEM integration
Connectors:
- 204-pin gold-plated edge connector for reliable electrical contact and corrosion resistance
- Standard SO-DIMM notch keying to prevent incorrect installation
6. Installation & Setup
Requirements:
- Compatible motherboard or embedded system with DDR3 SO-DIMM slot(s)
- System BIOS or firmware supporting 8GB DDR3 modules
- Proper ESD handling procedures during installation
Mounting Options:
- Insert the module into the SO-DIMM slot at a 30° angle, then press down until the retention clips lock into place.
- Ensure the module is properly seated and aligned with the slot key to prevent damage.
Configuration:
- The system automatically detects the module’s capacity, speed, and timing parameters via SPD (Serial Presence Detect) EEPROM.
- BIOS or firmware may allow manual configuration of memory frequency, latency, and voltage for performance tuning.
- No additional software or drivers are required; the module functions as standard system memory.
7. Performance & Capabilities
Speed and Bandwidth:
- Supports data transfer rates up to 1600 MT/s (megatransfers per second), depending on system compatibility.
- Theoretical peak bandwidth up to 12.8 GB/s per module (DDR3-1600, 64-bit bus).
Capacity and Scalability:
- 8GB per module allows for flexible memory configurations in dual-channel or multi-slot systems.
- Suitable for systems requiring moderate to high memory capacity without excessive power draw.
Efficiency:
- Operates at 1.5V, offering a balance between performance and power efficiency.
- Low heat generation supports fanless or passively cooled system designs.
Reliability and Durability:
- Designed for continuous 24/7 operation in industrial environments.
- Wide temperature tolerance ensures consistent performance under thermal stress.
- High-quality DRAM chips undergo rigorous testing for endurance and data retention.
Limitations:
- Non-ECC version does not provide hardware-level error correction (ECC variant recommended for mission-critical systems).
- Performance depends on host system’s memory controller and BIOS configuration.
8. Standards & Compliance
- JEDEC Compliance: Fully compliant with JEDEC DDR3 SO-DIMM standards (JESD79-3F).
- RoHS Directive: Conforms to RoHS (Restriction of Hazardous Substances) for environmental safety.
- REACH Compliance: Meets REACH regulations for chemical substance safety.
- CE Marking: Complies with European safety and electromagnetic compatibility requirements.
- UL Certification: Manufactured using UL-recognized materials and processes (depending on supplier).
- Environmental Standards: Designed for operation in accordance with IPC-A-610 Class 2 or Class 3 assembly standards for industrial electronics.
- ESD Protection: Packaged and handled per ANSI/ESD S20.20 standards to prevent electrostatic discharge damage.
9. Additional Information
Warranty:
Typically covered by a limited lifetime warranty or 3–5 year industrial warranty, depending on the manufacturer or distributor. Warranty covers defects in materials and workmanship under normal operating conditions.
Support:
- Technical documentation, datasheets, and compatibility lists available from the manufacturer or authorized distributor.
- Engineering support for integration into custom embedded systems.
- Firmware and SPD configuration assistance for OEM customers.
Maintenance:
- No active maintenance required; memory modules are solid-state components with no moving parts.
- Periodic inspection recommended in high-vibration or high-dust environments to ensure secure seating.
- Avoid exposure to electrostatic discharge during handling or replacement.
Updates and Lifecycle:
- DDR3 technology remains widely supported in industrial and embedded markets, ensuring long-term availability.
- Product lifecycle typically exceeds 5–7 years for industrial-grade components.
- Successor modules may include DDR3L (1.35V) or DDR4 variants for future system upgrades.
### Summary
The 8GB-DDR3-WT SO-DIMM DDR3 8GB Wide Temperature Memory Module is a robust, industrial-grade memory solution engineered for demanding environments where reliability, endurance, and thermal resilience are critical. With its 8GB capacity, DDR3 performance, and wide operating temperature range of –40°C to +85°C, it is ideally suited for embedded, industrial, and rugged computing applications.
Its compliance with JEDEC standards, RoHS and REACH directives, and its compatibility with standard DDR3 SO-DIMM slots make it a versatile and dependable choice for system integrators and OEMs seeking stable long-term memory solutions. The module’s compact form factor, low power consumption, and high reliability ensure consistent performance across a wide range of industrial and embedded computing platforms.
Approximate Length: ~3,000 tokens (~12,000 characters)
Document Type: Comprehensive Technical Product Summary for 8GB-DDR3-WT
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