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- Architecture: 6th Generation Intel® Core™ (Skylake) microarchitecture
- Core/Thread Count: 4 cores / 8 threads with Intel® Hyper-Threading Technology
- Base Frequency: 2.40 GHz
- Max Turbo Frequency: Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0
- Cache: 8 MB Intel® Smart Cache shared dynamically among cores
- Thermal Design Power (TDP): 35 W, optimized for low-power embedded and industrial systems
- Integrated Graphics: Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz
- Memory Support: Dual-channel DDR4-2133 / DDR3L-1600 memory support
- Socket Type: LGA 1151
- Manufacturing Process: 14 nm lithography
- Instruction Set: 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support
- Security Features: Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard
- Embedded Options Available: Yes – designed for long lifecycle embedded applications
- Graphics APIs Supported: DirectX 12, OpenGL 4.4, OpenCL 2.0
- Display Support: Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces
The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.
- Core/Thread Count: 4 cores / 8 threads with Intel® Hyper-Threading Technology
- Base Frequency: 2.40 GHz
- Max Turbo Frequency: Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0
- Cache: 8 MB Intel® Smart Cache shared dynamically among cores
- Thermal Design Power (TDP): 35 W, optimized for low-power embedded and industrial systems
- Integrated Graphics: Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz
- Memory Support: Dual-channel DDR4-2133 / DDR3L-1600 memory support
- Socket Type: LGA 1151
- Manufacturing Process: 14 nm lithography
- Instruction Set: 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support
- Security Features: Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard
- Embedded Options Available: Yes – designed for long lifecycle embedded applications
- Graphics APIs Supported: DirectX 12, OpenGL 4.4, OpenCL 2.0
- Display Support: Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces
The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.
1. Product Overview
Name: Intel® Core™ i7-6700TE Processor
Model: i7-6700TE
Series: 6th Generation Intel® Core™ Processors (Skylake family)
Article Number: i7-6700TE
Manufacturer: Intel Corporation
The Intel® Core™ i7-6700TE is a high-performance, energy-efficient quad-core processor designed for embedded, industrial, and compact computing applications. Belonging to Intel’s 6th Generation Core processor lineup (code-named *Skylake*), it combines advanced 14-nanometer process technology with integrated Intel® HD Graphics 530 and a balanced thermal design power (TDP) of 35 watts. The processor is engineered to deliver desktop-class performance in thermally constrained environments, making it ideal for embedded systems, digital signage, medical imaging, industrial automation, and edge computing platforms that require both computational power and energy efficiency.
2. Key Features
- Architecture: 6th Generation Intel® Core™ (Skylake) microarchitecture
- Core/Thread Count: 4 cores / 8 threads with Intel® Hyper-Threading Technology
- Base Frequency: 2.40 GHz
- Max Turbo Frequency: Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0
- Cache: 8 MB Intel® Smart Cache shared dynamically among cores
- Thermal Design Power (TDP): 35 W, optimized for low-power embedded and industrial systems
- Integrated Graphics: Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz
- Memory Support: Dual-channel DDR4-2133 / DDR3L-1600 memory support
- Socket Type: LGA 1151
- Manufacturing Process: 14 nm lithography
- Instruction Set: 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support
- Security Features: Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard
- Embedded Options Available: Yes – designed for long lifecycle embedded applications
- Graphics APIs Supported: DirectX 12, OpenGL 4.4, OpenCL 2.0
- Display Support: Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces
The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.
3. Technical Specifications
- Processor Number: i7-6700TE
- Cores / Threads: 4 / 8
- Base Clock Speed: 2.4 GHz
- Max Turbo Frequency: 3.4 GHz
- Cache: 8 MB Intel® Smart Cache
- Bus Speed: 8 GT/s DMI3
- TDP: 35 W
- Lithography: 14 nm
- Socket: FCLGA1151
- Instruction Set: 64-bit
- Instruction Set Extensions: SSE4.1, SSE4.2, AVX2
- Scalability: 1S only (single-socket systems)
- Max Memory Size: 64 GB (depending on memory type)
- Memory Types Supported: DDR4-2133, DDR3L-1600
- Memory Channels: 2
- Max Memory Bandwidth: 34.1 GB/s
- ECC Memory Support: No (non-ECC memory only)
- Integrated Graphics: Intel® HD Graphics 530
- Graphics Base Frequency: 350 MHz
- Graphics Max Dynamic Frequency: 1.05 GHz
- Graphics Video Max Memory: 1.7 GB
- 4K Support: Yes, at 60 Hz
- Max Resolution (HDMI 1.4): 4096x2304 @ 24 Hz
- Max Resolution (DP): 4096x2304 @ 60 Hz
- Max Resolution (eDP - Integrated Flat Panel): 4096x2304 @ 60 Hz
- DirectX Support: 12
- OpenGL Support: 4.4
- PCI Express Revision: 3.0
- PCI Express Configurations: Up to 1x16, 2x8, or 1x8 + 2x4
- Max PCI Express Lanes: 16
- Package Size: 37.5 mm x 37.5 mm (approximate)
- Weight: Varies by packaging; typically < 50 g for bare processor
4. Functionality
The Intel® Core™ i7-6700TE operates as a high-efficiency, multi-core CPU optimized for embedded and industrial computing environments. It leverages Intel’s advanced 14 nm process to deliver strong single-thread and multi-thread performance while maintaining a low thermal envelope. The processor dynamically adjusts its frequency through Intel® Turbo Boost Technology 2.0, scaling up to 3.4 GHz when thermal and power conditions allow, ensuring responsive performance under varying workloads.
Use Cases and Applications:
- Industrial Automation: Real-time control systems, programmable logic controllers (PLCs), and machine vision systems.
- Digital Signage and Kiosks: High-resolution multimedia playback and multi-display support.
- Medical Equipment: Imaging systems, diagnostic devices, and patient monitoring platforms.
- Edge Computing: Local data processing for IoT gateways and smart infrastructure.
- Embedded Systems: Compact PCs, ruggedized computing modules, and fanless embedded controllers.
- Retail and Point-of-Sale (POS): Transaction terminals and interactive retail displays.
Compatibility:
The i7-6700TE is compatible with Intel® 100 Series chipsets (such as Q170, H110, and others) and supports standard LGA1151 motherboards designed for 6th Generation Intel® Core™ processors. It is also compatible with operating systems supporting x86-64 architecture, including Windows, Linux, and various real-time operating systems used in embedded environments.
5. Components & Accessories
Included Items:
- Intel® Core™ i7-6700TE processor (bare CPU)
- Documentation and product data sheet (depending on distribution channel)
Optional Add-ons / Accessories:
- Compatible LGA1151 motherboard
- Cooling solution (active or passive heatsink, depending on system design)
- Memory modules (DDR4 or DDR3L, depending on platform)
- Storage devices (SATA or PCIe-based SSDs)
- Power supply unit compatible with system requirements
Connectors and Interfaces:
- LGA1151 socket interface for CPU installation
- PCI Express 3.0 lanes for discrete GPU or expansion cards
- Integrated display outputs via chipset (HDMI, DP, eDP)
- Memory interface supporting dual-channel DDR4/DDR3L
6. Installation & Setup
Requirements:
- Compatible motherboard with LGA1151 socket and BIOS supporting 6th Gen Intel® Core™ processors
- Adequate cooling solution rated for 35 W TDP
- Proper thermal interface material (TIM) between CPU and heatsink
- Stable power delivery meeting Intel VR specifications
Mounting Options:
The processor is installed into an LGA1151 socket using a zero-insertion-force (ZIF) mechanism. It requires a compatible heatsink or cooling assembly, which may be active (fan-based) or passive (heat pipe or fin array) depending on the system’s thermal design.
Configuration:
System integrators can configure CPU performance parameters through BIOS/UEFI settings, including enabling/disabling Intel® Turbo Boost, Hyper-Threading, and virtualization features. Memory frequency and voltage settings can also be adjusted to optimize performance or power efficiency.
7. Performance & Capabilities
Processing Power:
The i7-6700TE delivers strong multi-threaded performance due to its 4-core/8-thread configuration. With a base frequency of 2.4 GHz and turbo frequency up to 3.4 GHz, it provides a balance between sustained performance and thermal efficiency.
Graphics Performance:
The integrated Intel® HD Graphics 530 supports 4K video output, hardware-accelerated decoding for H.264 and HEVC (H.265) codecs, and multi-display configurations. It is suitable for graphics-intensive embedded applications without requiring a discrete GPU.
Memory and I/O Performance:
Dual-channel memory architecture ensures high data throughput, while PCIe 3.0 lanes provide flexible connectivity for high-speed peripherals.
Efficiency:
With a 35 W TDP, the processor is optimized for low-power operation, enabling fanless or compact system designs. Power management features such as Intel® SpeedStep® Technology and deep C-states further reduce energy consumption during idle or low-load conditions.
Limitations:
- Does not support ECC memory (non-ECC only)
- Limited to single-socket configurations
- Integrated graphics performance is moderate compared to discrete GPUs
8. Standards & Compliance
Certifications and Compliance:
- RoHS Compliant: Restriction of Hazardous Substances Directive compliant
- REACH Compliant: Registration, Evaluation, Authorization, and Restriction of Chemicals compliant
- Halogen-Free Options: Available for embedded and industrial SKUs
- Environmental Standards: Meets Intel’s environmental and sustainability guidelines
- Industry Standards Supported:
- PCI Express 3.0
- DDR4/DDR3L memory standards
- DirectX 12, OpenGL 4.4, OpenCL 2.0 graphics APIs
- x86-64 instruction set architecture
Security and Virtualization Standards:
- Intel® Virtualization Technology (VT-x and VT-d)
- Intel® Trusted Execution Technology (TXT)
- Intel® AES New Instructions (AES-NI)
- Intel® Secure Key and OS Guard for enhanced data protection
These compliance and security features make the i7-6700TE suitable for enterprise-grade and industrial applications requiring reliability, long-term availability, and secure operation.
9. Additional Information
Warranty:
Typically covered under Intel’s standard 3-year limited warranty for boxed processors. OEM and embedded versions may include extended lifecycle support depending on distribution agreements.
Support:
Intel provides extensive technical documentation, software development tools, and driver support through the Intel Developer Zone and Embedded Design Center. BIOS and firmware updates are available through motherboard manufacturers.
Maintenance:
The processor requires minimal maintenance beyond ensuring adequate cooling and clean airflow. Periodic inspection of thermal interfaces and heatsink assemblies is recommended for long-term reliability.
Lifecycle and Availability:
As part of Intel’s embedded product line, the i7-6700TE offers extended availability and lifecycle support, typically up to 7 years from launch, ensuring long-term supply stability for industrial and embedded integrators.
Software and Firmware Updates:
Intel regularly releases microcode updates to enhance security and performance. These updates are distributed through operating system vendors and motherboard BIOS updates.
Environmental and Operating Conditions:
- Operating Temperature Range: Typically 0°C to 100°C (junction temperature, depending on cooling solution)
- Storage Temperature Range: -40°C to 125°C (non-operational)
- Relative Humidity: 5% to 90% non-condensing
Summary:
The Intel® Core™ i7-6700TE is a versatile, power-efficient quad-core processor that delivers desktop-grade performance in a compact, thermally optimized package. With its 35 W TDP, integrated Intel® HD Graphics 530, and support for modern memory and I/O standards, it is ideally suited for embedded, industrial, and edge computing applications requiring a balance of performance, efficiency, and long-term reliability.
Approximate Length: ~3,000 tokens (~12,000 characters)
End of Product Summary
Name: Intel® Core™ i7-6700TE Processor
Model: i7-6700TE
Series: 6th Generation Intel® Core™ Processors (Skylake family)
Article Number: i7-6700TE
Manufacturer: Intel Corporation
The Intel® Core™ i7-6700TE is a high-performance, energy-efficient quad-core processor designed for embedded, industrial, and compact computing applications. Belonging to Intel’s 6th Generation Core processor lineup (code-named *Skylake*), it combines advanced 14-nanometer process technology with integrated Intel® HD Graphics 530 and a balanced thermal design power (TDP) of 35 watts. The processor is engineered to deliver desktop-class performance in thermally constrained environments, making it ideal for embedded systems, digital signage, medical imaging, industrial automation, and edge computing platforms that require both computational power and energy efficiency.
2. Key Features
- Architecture: 6th Generation Intel® Core™ (Skylake) microarchitecture
- Core/Thread Count: 4 cores / 8 threads with Intel® Hyper-Threading Technology
- Base Frequency: 2.40 GHz
- Max Turbo Frequency: Up to 3.40 GHz with Intel® Turbo Boost Technology 2.0
- Cache: 8 MB Intel® Smart Cache shared dynamically among cores
- Thermal Design Power (TDP): 35 W, optimized for low-power embedded and industrial systems
- Integrated Graphics: Intel® HD Graphics 530 with dynamic frequency scaling up to 1.05 GHz
- Memory Support: Dual-channel DDR4-2133 / DDR3L-1600 memory support
- Socket Type: LGA 1151
- Manufacturing Process: 14 nm lithography
- Instruction Set: 64-bit with Intel® SSE4.1/4.2, AVX2, and Intel® VT-x/VT-d virtualization support
- Security Features: Intel® AES-NI, Intel® Secure Key, Intel® OS Guard, Intel® Trusted Execution Technology (TXT), and Intel® Boot Guard
- Embedded Options Available: Yes – designed for long lifecycle embedded applications
- Graphics APIs Supported: DirectX 12, OpenGL 4.4, OpenCL 2.0
- Display Support: Up to three independent displays via DisplayPort, HDMI, DVI, or eDP interfaces
The i7-6700TE’s key differentiator lies in its combination of high performance and low thermal output, enabling system designers to integrate it into compact or fanless systems without sacrificing computational capability.
3. Technical Specifications
- Processor Number: i7-6700TE
- Cores / Threads: 4 / 8
- Base Clock Speed: 2.4 GHz
- Max Turbo Frequency: 3.4 GHz
- Cache: 8 MB Intel® Smart Cache
- Bus Speed: 8 GT/s DMI3
- TDP: 35 W
- Lithography: 14 nm
- Socket: FCLGA1151
- Instruction Set: 64-bit
- Instruction Set Extensions: SSE4.1, SSE4.2, AVX2
- Scalability: 1S only (single-socket systems)
- Max Memory Size: 64 GB (depending on memory type)
- Memory Types Supported: DDR4-2133, DDR3L-1600
- Memory Channels: 2
- Max Memory Bandwidth: 34.1 GB/s
- ECC Memory Support: No (non-ECC memory only)
- Integrated Graphics: Intel® HD Graphics 530
- Graphics Base Frequency: 350 MHz
- Graphics Max Dynamic Frequency: 1.05 GHz
- Graphics Video Max Memory: 1.7 GB
- 4K Support: Yes, at 60 Hz
- Max Resolution (HDMI 1.4): 4096x2304 @ 24 Hz
- Max Resolution (DP): 4096x2304 @ 60 Hz
- Max Resolution (eDP - Integrated Flat Panel): 4096x2304 @ 60 Hz
- DirectX Support: 12
- OpenGL Support: 4.4
- PCI Express Revision: 3.0
- PCI Express Configurations: Up to 1x16, 2x8, or 1x8 + 2x4
- Max PCI Express Lanes: 16
- Package Size: 37.5 mm x 37.5 mm (approximate)
- Weight: Varies by packaging; typically < 50 g for bare processor
4. Functionality
The Intel® Core™ i7-6700TE operates as a high-efficiency, multi-core CPU optimized for embedded and industrial computing environments. It leverages Intel’s advanced 14 nm process to deliver strong single-thread and multi-thread performance while maintaining a low thermal envelope. The processor dynamically adjusts its frequency through Intel® Turbo Boost Technology 2.0, scaling up to 3.4 GHz when thermal and power conditions allow, ensuring responsive performance under varying workloads.
Use Cases and Applications:
- Industrial Automation: Real-time control systems, programmable logic controllers (PLCs), and machine vision systems.
- Digital Signage and Kiosks: High-resolution multimedia playback and multi-display support.
- Medical Equipment: Imaging systems, diagnostic devices, and patient monitoring platforms.
- Edge Computing: Local data processing for IoT gateways and smart infrastructure.
- Embedded Systems: Compact PCs, ruggedized computing modules, and fanless embedded controllers.
- Retail and Point-of-Sale (POS): Transaction terminals and interactive retail displays.
Compatibility:
The i7-6700TE is compatible with Intel® 100 Series chipsets (such as Q170, H110, and others) and supports standard LGA1151 motherboards designed for 6th Generation Intel® Core™ processors. It is also compatible with operating systems supporting x86-64 architecture, including Windows, Linux, and various real-time operating systems used in embedded environments.
5. Components & Accessories
Included Items:
- Intel® Core™ i7-6700TE processor (bare CPU)
- Documentation and product data sheet (depending on distribution channel)
Optional Add-ons / Accessories:
- Compatible LGA1151 motherboard
- Cooling solution (active or passive heatsink, depending on system design)
- Memory modules (DDR4 or DDR3L, depending on platform)
- Storage devices (SATA or PCIe-based SSDs)
- Power supply unit compatible with system requirements
Connectors and Interfaces:
- LGA1151 socket interface for CPU installation
- PCI Express 3.0 lanes for discrete GPU or expansion cards
- Integrated display outputs via chipset (HDMI, DP, eDP)
- Memory interface supporting dual-channel DDR4/DDR3L
6. Installation & Setup
Requirements:
- Compatible motherboard with LGA1151 socket and BIOS supporting 6th Gen Intel® Core™ processors
- Adequate cooling solution rated for 35 W TDP
- Proper thermal interface material (TIM) between CPU and heatsink
- Stable power delivery meeting Intel VR specifications
Mounting Options:
The processor is installed into an LGA1151 socket using a zero-insertion-force (ZIF) mechanism. It requires a compatible heatsink or cooling assembly, which may be active (fan-based) or passive (heat pipe or fin array) depending on the system’s thermal design.
Configuration:
System integrators can configure CPU performance parameters through BIOS/UEFI settings, including enabling/disabling Intel® Turbo Boost, Hyper-Threading, and virtualization features. Memory frequency and voltage settings can also be adjusted to optimize performance or power efficiency.
7. Performance & Capabilities
Processing Power:
The i7-6700TE delivers strong multi-threaded performance due to its 4-core/8-thread configuration. With a base frequency of 2.4 GHz and turbo frequency up to 3.4 GHz, it provides a balance between sustained performance and thermal efficiency.
Graphics Performance:
The integrated Intel® HD Graphics 530 supports 4K video output, hardware-accelerated decoding for H.264 and HEVC (H.265) codecs, and multi-display configurations. It is suitable for graphics-intensive embedded applications without requiring a discrete GPU.
Memory and I/O Performance:
Dual-channel memory architecture ensures high data throughput, while PCIe 3.0 lanes provide flexible connectivity for high-speed peripherals.
Efficiency:
With a 35 W TDP, the processor is optimized for low-power operation, enabling fanless or compact system designs. Power management features such as Intel® SpeedStep® Technology and deep C-states further reduce energy consumption during idle or low-load conditions.
Limitations:
- Does not support ECC memory (non-ECC only)
- Limited to single-socket configurations
- Integrated graphics performance is moderate compared to discrete GPUs
8. Standards & Compliance
Certifications and Compliance:
- RoHS Compliant: Restriction of Hazardous Substances Directive compliant
- REACH Compliant: Registration, Evaluation, Authorization, and Restriction of Chemicals compliant
- Halogen-Free Options: Available for embedded and industrial SKUs
- Environmental Standards: Meets Intel’s environmental and sustainability guidelines
- Industry Standards Supported:
- PCI Express 3.0
- DDR4/DDR3L memory standards
- DirectX 12, OpenGL 4.4, OpenCL 2.0 graphics APIs
- x86-64 instruction set architecture
Security and Virtualization Standards:
- Intel® Virtualization Technology (VT-x and VT-d)
- Intel® Trusted Execution Technology (TXT)
- Intel® AES New Instructions (AES-NI)
- Intel® Secure Key and OS Guard for enhanced data protection
These compliance and security features make the i7-6700TE suitable for enterprise-grade and industrial applications requiring reliability, long-term availability, and secure operation.
9. Additional Information
Warranty:
Typically covered under Intel’s standard 3-year limited warranty for boxed processors. OEM and embedded versions may include extended lifecycle support depending on distribution agreements.
Support:
Intel provides extensive technical documentation, software development tools, and driver support through the Intel Developer Zone and Embedded Design Center. BIOS and firmware updates are available through motherboard manufacturers.
Maintenance:
The processor requires minimal maintenance beyond ensuring adequate cooling and clean airflow. Periodic inspection of thermal interfaces and heatsink assemblies is recommended for long-term reliability.
Lifecycle and Availability:
As part of Intel’s embedded product line, the i7-6700TE offers extended availability and lifecycle support, typically up to 7 years from launch, ensuring long-term supply stability for industrial and embedded integrators.
Software and Firmware Updates:
Intel regularly releases microcode updates to enhance security and performance. These updates are distributed through operating system vendors and motherboard BIOS updates.
Environmental and Operating Conditions:
- Operating Temperature Range: Typically 0°C to 100°C (junction temperature, depending on cooling solution)
- Storage Temperature Range: -40°C to 125°C (non-operational)
- Relative Humidity: 5% to 90% non-condensing
Summary:
The Intel® Core™ i7-6700TE is a versatile, power-efficient quad-core processor that delivers desktop-grade performance in a compact, thermally optimized package. With its 35 W TDP, integrated Intel® HD Graphics 530, and support for modern memory and I/O standards, it is ideally suited for embedded, industrial, and edge computing applications requiring a balance of performance, efficiency, and long-term reliability.
Approximate Length: ~3,000 tokens (~12,000 characters)
End of Product Summary
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