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- Intel® 6th‑Generation Core™ Processor Support:
Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake architecture) with TDP options from 35 W to 65 W, allowing performance scalability for different thermal and power budgets.
- Fanless, Low‑Profile Design:
77 mm‑high aluminum chassis with passive thermal design for silent, maintenance‑free operation in harsh environments.
- Wide Operating Temperature Range:
‑25 °C to +70 °C with 35 W CPUs, or up to +50 °C with 65 W CPUs at full load.
- Intel® Q170 Chipset Platform:
Provides advanced I/O, AMT 11.0 remote management, and TPM 2.0 hardware security.
- Dual Gigabit Ethernet Ports:
Two Intel® GbE controllers (I219‑LM and I210‑IT) for reliable network connectivity and remote management.
- Triple‑Independent Display Outputs:
VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution on DP ports.
- Rich I/O Connectivity:
4 × USB 3.0, 4 × USB 2.0, 3 × COM ports (2 × software‑programmable RS‑232/422/485 + 1 × RS‑232), audio I/O, and dual SATA III interfaces with RAID 0/1 support.
- Hot‑Swappable 2.5″ HDD/SSD Tray:
One external SATA III bay with front‑accessible hot‑swap capability and one internal SATA III port for fixed storage.
- Expansion Flexibility:
Two full‑size Mini‑PCIe slots (each with SIM socket) and one Neousys MezIO™ expansion interface for modular I/O expansion.
- Rugged Reliability:
Vibration resistance up to 5 Grms (IEC 60068‑2‑64) and shock resistance up to 50 Grms (IEC 60068‑2‑27) with SSD.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 120 W AC/DC adapter available.
- Compact and Lightweight:
240 mm (W) × 225 mm (D) × 77 mm (H); weight ≈ 3.1 kg including CPU, memory, and HDD.
Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake architecture) with TDP options from 35 W to 65 W, allowing performance scalability for different thermal and power budgets.
- Fanless, Low‑Profile Design:
77 mm‑high aluminum chassis with passive thermal design for silent, maintenance‑free operation in harsh environments.
- Wide Operating Temperature Range:
‑25 °C to +70 °C with 35 W CPUs, or up to +50 °C with 65 W CPUs at full load.
- Intel® Q170 Chipset Platform:
Provides advanced I/O, AMT 11.0 remote management, and TPM 2.0 hardware security.
- Dual Gigabit Ethernet Ports:
Two Intel® GbE controllers (I219‑LM and I210‑IT) for reliable network connectivity and remote management.
- Triple‑Independent Display Outputs:
VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution on DP ports.
- Rich I/O Connectivity:
4 × USB 3.0, 4 × USB 2.0, 3 × COM ports (2 × software‑programmable RS‑232/422/485 + 1 × RS‑232), audio I/O, and dual SATA III interfaces with RAID 0/1 support.
- Hot‑Swappable 2.5″ HDD/SSD Tray:
One external SATA III bay with front‑accessible hot‑swap capability and one internal SATA III port for fixed storage.
- Expansion Flexibility:
Two full‑size Mini‑PCIe slots (each with SIM socket) and one Neousys MezIO™ expansion interface for modular I/O expansion.
- Rugged Reliability:
Vibration resistance up to 5 Grms (IEC 60068‑2‑64) and shock resistance up to 50 Grms (IEC 60068‑2‑27) with SSD.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 120 W AC/DC adapter available.
- Compact and Lightweight:
240 mm (W) × 225 mm (D) × 77 mm (H); weight ≈ 3.1 kg including CPU, memory, and HDD.
Comprehensive Product Summary: Nuvo‑5002LP Fanless Embedded Controller
### 1. Product Overview
Product Name: Nuvo‑5002LP
Model: Nuvo‑5002LP
Series: Nuvo‑5000LP Series (Low‑Profile Fanless Embedded Controllers)
Article Number: Nuvo‑5002LP
Manufacturer: Neousys Technology Inc.
Product Type: Rugged, low‑profile, fanless embedded controller for industrial and embedded computing applications.
Category: Rugged Embedded / Industrial Automation Controller
The Nuvo‑5002LP is part of Neousys’ Nuvo‑5000 family of rugged fanless controllers. It is designed for industrial, in‑vehicle, and automation environments requiring high reliability, wide‑temperature operation, and compact form factor. The “LP” designation indicates a low‑profile chassis (77 mm height) optimized for space‑constrained installations while maintaining full‑featured I/O and expansion capabilities.
### 2. Key Features
- Intel® 6th‑Generation Core™ Processor Support:
Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake architecture) with TDP options from 35 W to 65 W, allowing performance scalability for different thermal and power budgets.
- Fanless, Low‑Profile Design:
77 mm‑high aluminum chassis with passive thermal design for silent, maintenance‑free operation in harsh environments.
- Wide Operating Temperature Range:
‑25 °C to +70 °C with 35 W CPUs, or up to +50 °C with 65 W CPUs at full load.
- Intel® Q170 Chipset Platform:
Provides advanced I/O, AMT 11.0 remote management, and TPM 2.0 hardware security.
- Dual Gigabit Ethernet Ports:
Two Intel® GbE controllers (I219‑LM and I210‑IT) for reliable network connectivity and remote management.
- Triple‑Independent Display Outputs:
VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution on DP ports.
- Rich I/O Connectivity:
4 × USB 3.0, 4 × USB 2.0, 3 × COM ports (2 × software‑programmable RS‑232/422/485 + 1 × RS‑232), audio I/O, and dual SATA III interfaces with RAID 0/1 support.
- Hot‑Swappable 2.5″ HDD/SSD Tray:
One external SATA III bay with front‑accessible hot‑swap capability and one internal SATA III port for fixed storage.
- Expansion Flexibility:
Two full‑size Mini‑PCIe slots (each with SIM socket) and one Neousys MezIO™ expansion interface for modular I/O expansion.
- Rugged Reliability:
Vibration resistance up to 5 Grms (IEC 60068‑2‑64) and shock resistance up to 50 Grms (IEC 60068‑2‑27) with SSD.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 120 W AC/DC adapter available.
- Compact and Lightweight:
240 mm (W) × 225 mm (D) × 77 mm (H); weight ≈ 3.1 kg including CPU, memory, and HDD.
### 3. Technical Specifications
Processor Options (LGA1151 Socket):
- Intel® Core™ i7‑6700 (8 MB Cache, 3.4/4.0 GHz, 65 W TDP)
- Intel® Core™ i5‑6500 (6 MB Cache, 3.2/3.6 GHz, 65 W TDP)
- Intel® Core™ i3‑6100 (3 MB Cache, 3.7 GHz, 51 W TDP)
- Intel® Pentium® G4400 (3 MB Cache, 3.3 GHz, 54 W TDP)
- Intel® Celeron® G3900 (2 MB Cache, 2.8 GHz, 51 W TDP)
- Low‑power 35 W TDP variants: i7‑6700TE, i5‑6500TE, i3‑6100TE, G4400TE, G3900TE.
Chipset: Intel® Q170 Platform Controller Hub
Graphics: Integrated Intel® HD Graphics 530/510
Memory: Up to 32 GB DDR4‑2133 SDRAM via 2 × SO‑DIMM slots
Storage:
- 1 × internal 2.5″ SATA III (6 Gb/s) HDD/SSD
- 1 × external 2.5″ SATA III HDD/SSD in hot‑swappable tray
- RAID 0/1 support
- 1 × full‑size mSATA port (mux with Mini‑PCIe)
I/O Interfaces:
- Ethernet: 2 × Intel® GbE (I219‑LM + I210‑IT)
- USB: 4 × USB 3.0 + 4 × USB 2.0
- Serial: 2 × RS‑232/422/485 (software‑selectable) + 1 × RS‑232
- Video: 1 × VGA + 1 × DVI‑D + 2 × DisplayPort (4K support)
- Audio: 1 × Mic‑in + 1 × Speaker‑out
- Expansion: 2 × Mini‑PCIe (full‑size, each with SIM socket) + 1 × MezIO™ interface
- Power Input: 8 – 35 V DC via 3‑pin terminal block
- Remote Control: 10‑pin (2 × 5) wafer connector for remote on/off and status LED output
Mechanical:
- Dimensions: 240 (W) × 225 (D) × 77 (H) mm
- Weight: 3.1 kg (incl. CPU, memory, HDD)
- Mounting: Wall‑mount (standard) or DIN‑rail (optional)
Environmental:
- Operating Temperature: ‑25 °C to +70 °C (35 W CPU) / ‑25 °C to +50 °C (65 W CPU)
- Storage Temperature: ‑40 °C to +85 °C
- Humidity: 10 % – 90 %, non‑condensing
- Vibration: 5 Grms (5 – 500 Hz, 3 axes, SSD installed)
- Shock: 50 Grms (half‑sine 11 ms, SSD installed)
- EMC: CE/FCC Class A (EN 55022, EN 55024, EN 55032)
### 4. Functionality
Operation Principle:
The Nuvo‑5002LP is a fanless embedded controller that integrates CPU, chipset, memory, and I/O in a sealed aluminum chassis. Passive conduction cooling dissipates heat through the enclosure, enabling reliable operation in dusty or vibration‑prone environments.
Use Cases and Applications:
- Industrial automation and machine vision
- Transportation and in‑vehicle computing
- Surveillance and security systems
- Edge computing and data acquisition
- Digital signage and multi‑display control
- Network gateway or industrial IoT controller
Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and Linux distributions (Ubuntu, Fedora, Debian, OpenSUSE).
Supports Intel® AMT 11.0 for remote management and Wake‑on‑LAN functionality.
### 5. Components & Accessories
Included Items:
- Nuvo‑5002LP controller unit
- Wall‑mount brackets and screws
- 3‑pin pluggable DC terminal block
- Foot pads
- Key for HDD tray lock
- HDD thermal pad (for 2.5″ drive)
- Screw pack
- Neousys Drivers & Utilities DVD
Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting assembly
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C operation)
- DmpbrNuvo5000_7000: Damping bracket assembly for vibration isolation
- MezIO™ Modules: modular I/O expansion options including:
- MezIO‑C180/C181 (4 × RS‑232/422/485 ports)
- MezIO‑U4 (4 × USB 3.0 ports)
- MezIO‑D220/D230 (isolated digital I/O)
- MezIO‑V20‑EP (ignition power control for in‑vehicle use)
- MezIO‑G4/G4P (4 × GigE or PoE ports with isolated DIO)
### 6. Installation & Setup
Requirements:
- DC power supply 8 – 35 V DC (20 V recommended)
- Compatible DDR4 SO‑DIMM modules (2133 MHz)
- 2.5″ SATA HDD/SSD or mSATA drive
- Operating system installation media (USB or SATA)
Mounting Options:
- Wall‑Mount: Standard brackets included; mount vertically for optimal heat dissipation.
- DIN‑Rail: Optional kit for cabinet installation.
Configuration Steps:
1. Install CPU and DDR4 memory modules into LGA1151 socket and SO‑DIMM slots.
2. Mount internal HDD/SSD and connect SATA cables.
3. Insert optional Mini‑PCIe modules (Wi‑Fi, 3G/4G, GPS, CAN, etc.) and SIM cards.
4. Connect DC power via terminal block (verify polarity).
5. Power on using front panel button or remote switch.
6. Configure BIOS settings for SATA mode (AHCI/RAID), TPM, and boot sequence.
7. Install OS and drivers from Neousys DVD or USB media.
Hot‑Swap Drive Use:
Enable “Hot Plug” for SATA Port #1 in BIOS to support front‑accessible HDD tray replacement without shutdown.
### 7. Performance & Capabilities
Processing Performance:
Dependent on CPU selection (35 W to 65 W TDP). Supports Intel® Turbo Boost and Hyper‑Threading for multi‑core performance.
Graphics Performance:
Integrated Intel® HD Graphics 530/510 supports DirectX 12, OpenGL 4.4, and hardware video acceleration for 4K display output.
Storage Performance:
SATA III 6 Gb/s interfaces with RAID 0/1 support for redundancy or throughput. mSATA option for OS boot drive.
Network Performance:
Dual Intel® GbE controllers provide independent PCIe lanes for maximum throughput and low latency. Supports Wake‑on‑LAN and Intel® AMT remote management.
Reliability:
Fanless design eliminates moving parts; rugged construction ensures operation under vibration and shock. Thermal throttling protects CPU at high temperatures.
Limitations:
High‑TDP CPUs (65 W) limited to +50 °C ambient for continuous full load. For sub‑zero operation, use wide‑temperature HDD or SSD.
### 8. Standards & Compliance
- CE/FCC Class A (EN 55022, EN 55024, EN 55032)
- IEC 60068‑2‑64 (Vibration Test)
- IEC 60068‑2‑27 (Shock Test)
- EN 50155:2007 (Railway Application Compliance)
- RoHS Compliant
- Intel® AMT 11.0 and TPM 2.0 Support for security and remote management.
These certifications ensure the Nuvo‑5002LP meets industrial EMC and environmental standards for deployment in regulated environments.
### 9. Additional Information
Warranty & Support:
Standard Neousys limited warranty (typically 2 years, extendable by region). Technical support and driver updates available via [www.neousys‑tech.com](https://www.neousys-tech.com).
Maintenance:
No fan or filter maintenance required. Periodic inspection of thermal interfaces and dust accumulation recommended for long‑term operation.
Firmware & BIOS Updates:
BIOS updates available from Neousys for enhanced CPU support and feature improvements. Supports user‑configurable CPU power limits and watchdog timer settings.
Software Utilities:
- “One‑Click” Driver Installation utility on Drivers & Utilities DVD.
- WDT_DIO library for watchdog timer and per‑port PoE control functions.
- AMT configuration tools for remote management.
Operating System Support:
- Windows 7 (32/64‑bit) with xHCI driver integration required
- Windows 8.1 / 10 (64‑bit)
- Linux (Ubuntu 14.04/16.04 LTS, Fedora 23, Debian 8.3, OpenSUSE 42.1)
Power Management & Control:
- BIOS options for Wake‑on‑LAN, Power‑on after Power Failure, and SKU Power Configuration.
- Remote on/off control via external switch or ignition signal (MezIO‑V20 module).
- Watchdog Timer (WDT) for system recovery and boot monitoring.
Expansion Ecosystem:
The MezIO™ interface enables custom I/O expansion without compromising mechanical integrity. Modules can add serial ports, digital I/O, PoE ports, or vehicle ignition control, making the Nuvo‑5002LP adaptable to diverse vertical markets.
### Summary
The Neousys Nuvo‑5002LP is a compact, rugged, and highly configurable fanless embedded controller built for industrial and embedded computing environments. Combining Intel® 6th‑Gen Core™ processing power with a low‑profile, wide‑temperature chassis, it delivers exceptional reliability and flexibility. Its dual GbE ports, multiple USB and COM interfaces, triple display outputs, and expandable MezIO™ architecture make it suitable for applications ranging from machine automation and vision systems to transportation and IoT edge nodes. With robust environmental tolerance, wide DC input range, and comprehensive I/O options, the Nuvo‑5002LP offers a balanced solution for performance, durability, and expandability in industrial deployments.
### 1. Product Overview
Product Name: Nuvo‑5002LP
Model: Nuvo‑5002LP
Series: Nuvo‑5000LP Series (Low‑Profile Fanless Embedded Controllers)
Article Number: Nuvo‑5002LP
Manufacturer: Neousys Technology Inc.
Product Type: Rugged, low‑profile, fanless embedded controller for industrial and embedded computing applications.
Category: Rugged Embedded / Industrial Automation Controller
The Nuvo‑5002LP is part of Neousys’ Nuvo‑5000 family of rugged fanless controllers. It is designed for industrial, in‑vehicle, and automation environments requiring high reliability, wide‑temperature operation, and compact form factor. The “LP” designation indicates a low‑profile chassis (77 mm height) optimized for space‑constrained installations while maintaining full‑featured I/O and expansion capabilities.
### 2. Key Features
- Intel® 6th‑Generation Core™ Processor Support:
Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake architecture) with TDP options from 35 W to 65 W, allowing performance scalability for different thermal and power budgets.
- Fanless, Low‑Profile Design:
77 mm‑high aluminum chassis with passive thermal design for silent, maintenance‑free operation in harsh environments.
- Wide Operating Temperature Range:
‑25 °C to +70 °C with 35 W CPUs, or up to +50 °C with 65 W CPUs at full load.
- Intel® Q170 Chipset Platform:
Provides advanced I/O, AMT 11.0 remote management, and TPM 2.0 hardware security.
- Dual Gigabit Ethernet Ports:
Two Intel® GbE controllers (I219‑LM and I210‑IT) for reliable network connectivity and remote management.
- Triple‑Independent Display Outputs:
VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution on DP ports.
- Rich I/O Connectivity:
4 × USB 3.0, 4 × USB 2.0, 3 × COM ports (2 × software‑programmable RS‑232/422/485 + 1 × RS‑232), audio I/O, and dual SATA III interfaces with RAID 0/1 support.
- Hot‑Swappable 2.5″ HDD/SSD Tray:
One external SATA III bay with front‑accessible hot‑swap capability and one internal SATA III port for fixed storage.
- Expansion Flexibility:
Two full‑size Mini‑PCIe slots (each with SIM socket) and one Neousys MezIO™ expansion interface for modular I/O expansion.
- Rugged Reliability:
Vibration resistance up to 5 Grms (IEC 60068‑2‑64) and shock resistance up to 50 Grms (IEC 60068‑2‑27) with SSD.
- Wide‑Range DC Power Input:
8 – 35 V DC input via 3‑pin terminal block; optional 120 W AC/DC adapter available.
- Compact and Lightweight:
240 mm (W) × 225 mm (D) × 77 mm (H); weight ≈ 3.1 kg including CPU, memory, and HDD.
### 3. Technical Specifications
Processor Options (LGA1151 Socket):
- Intel® Core™ i7‑6700 (8 MB Cache, 3.4/4.0 GHz, 65 W TDP)
- Intel® Core™ i5‑6500 (6 MB Cache, 3.2/3.6 GHz, 65 W TDP)
- Intel® Core™ i3‑6100 (3 MB Cache, 3.7 GHz, 51 W TDP)
- Intel® Pentium® G4400 (3 MB Cache, 3.3 GHz, 54 W TDP)
- Intel® Celeron® G3900 (2 MB Cache, 2.8 GHz, 51 W TDP)
- Low‑power 35 W TDP variants: i7‑6700TE, i5‑6500TE, i3‑6100TE, G4400TE, G3900TE.
Chipset: Intel® Q170 Platform Controller Hub
Graphics: Integrated Intel® HD Graphics 530/510
Memory: Up to 32 GB DDR4‑2133 SDRAM via 2 × SO‑DIMM slots
Storage:
- 1 × internal 2.5″ SATA III (6 Gb/s) HDD/SSD
- 1 × external 2.5″ SATA III HDD/SSD in hot‑swappable tray
- RAID 0/1 support
- 1 × full‑size mSATA port (mux with Mini‑PCIe)
I/O Interfaces:
- Ethernet: 2 × Intel® GbE (I219‑LM + I210‑IT)
- USB: 4 × USB 3.0 + 4 × USB 2.0
- Serial: 2 × RS‑232/422/485 (software‑selectable) + 1 × RS‑232
- Video: 1 × VGA + 1 × DVI‑D + 2 × DisplayPort (4K support)
- Audio: 1 × Mic‑in + 1 × Speaker‑out
- Expansion: 2 × Mini‑PCIe (full‑size, each with SIM socket) + 1 × MezIO™ interface
- Power Input: 8 – 35 V DC via 3‑pin terminal block
- Remote Control: 10‑pin (2 × 5) wafer connector for remote on/off and status LED output
Mechanical:
- Dimensions: 240 (W) × 225 (D) × 77 (H) mm
- Weight: 3.1 kg (incl. CPU, memory, HDD)
- Mounting: Wall‑mount (standard) or DIN‑rail (optional)
Environmental:
- Operating Temperature: ‑25 °C to +70 °C (35 W CPU) / ‑25 °C to +50 °C (65 W CPU)
- Storage Temperature: ‑40 °C to +85 °C
- Humidity: 10 % – 90 %, non‑condensing
- Vibration: 5 Grms (5 – 500 Hz, 3 axes, SSD installed)
- Shock: 50 Grms (half‑sine 11 ms, SSD installed)
- EMC: CE/FCC Class A (EN 55022, EN 55024, EN 55032)
### 4. Functionality
Operation Principle:
The Nuvo‑5002LP is a fanless embedded controller that integrates CPU, chipset, memory, and I/O in a sealed aluminum chassis. Passive conduction cooling dissipates heat through the enclosure, enabling reliable operation in dusty or vibration‑prone environments.
Use Cases and Applications:
- Industrial automation and machine vision
- Transportation and in‑vehicle computing
- Surveillance and security systems
- Edge computing and data acquisition
- Digital signage and multi‑display control
- Network gateway or industrial IoT controller
Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and Linux distributions (Ubuntu, Fedora, Debian, OpenSUSE).
Supports Intel® AMT 11.0 for remote management and Wake‑on‑LAN functionality.
### 5. Components & Accessories
Included Items:
- Nuvo‑5002LP controller unit
- Wall‑mount brackets and screws
- 3‑pin pluggable DC terminal block
- Foot pads
- Key for HDD tray lock
- HDD thermal pad (for 2.5″ drive)
- Screw pack
- Neousys Drivers & Utilities DVD
Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting assembly
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C operation)
- DmpbrNuvo5000_7000: Damping bracket assembly for vibration isolation
- MezIO™ Modules: modular I/O expansion options including:
- MezIO‑C180/C181 (4 × RS‑232/422/485 ports)
- MezIO‑U4 (4 × USB 3.0 ports)
- MezIO‑D220/D230 (isolated digital I/O)
- MezIO‑V20‑EP (ignition power control for in‑vehicle use)
- MezIO‑G4/G4P (4 × GigE or PoE ports with isolated DIO)
### 6. Installation & Setup
Requirements:
- DC power supply 8 – 35 V DC (20 V recommended)
- Compatible DDR4 SO‑DIMM modules (2133 MHz)
- 2.5″ SATA HDD/SSD or mSATA drive
- Operating system installation media (USB or SATA)
Mounting Options:
- Wall‑Mount: Standard brackets included; mount vertically for optimal heat dissipation.
- DIN‑Rail: Optional kit for cabinet installation.
Configuration Steps:
1. Install CPU and DDR4 memory modules into LGA1151 socket and SO‑DIMM slots.
2. Mount internal HDD/SSD and connect SATA cables.
3. Insert optional Mini‑PCIe modules (Wi‑Fi, 3G/4G, GPS, CAN, etc.) and SIM cards.
4. Connect DC power via terminal block (verify polarity).
5. Power on using front panel button or remote switch.
6. Configure BIOS settings for SATA mode (AHCI/RAID), TPM, and boot sequence.
7. Install OS and drivers from Neousys DVD or USB media.
Hot‑Swap Drive Use:
Enable “Hot Plug” for SATA Port #1 in BIOS to support front‑accessible HDD tray replacement without shutdown.
### 7. Performance & Capabilities
Processing Performance:
Dependent on CPU selection (35 W to 65 W TDP). Supports Intel® Turbo Boost and Hyper‑Threading for multi‑core performance.
Graphics Performance:
Integrated Intel® HD Graphics 530/510 supports DirectX 12, OpenGL 4.4, and hardware video acceleration for 4K display output.
Storage Performance:
SATA III 6 Gb/s interfaces with RAID 0/1 support for redundancy or throughput. mSATA option for OS boot drive.
Network Performance:
Dual Intel® GbE controllers provide independent PCIe lanes for maximum throughput and low latency. Supports Wake‑on‑LAN and Intel® AMT remote management.
Reliability:
Fanless design eliminates moving parts; rugged construction ensures operation under vibration and shock. Thermal throttling protects CPU at high temperatures.
Limitations:
High‑TDP CPUs (65 W) limited to +50 °C ambient for continuous full load. For sub‑zero operation, use wide‑temperature HDD or SSD.
### 8. Standards & Compliance
- CE/FCC Class A (EN 55022, EN 55024, EN 55032)
- IEC 60068‑2‑64 (Vibration Test)
- IEC 60068‑2‑27 (Shock Test)
- EN 50155:2007 (Railway Application Compliance)
- RoHS Compliant
- Intel® AMT 11.0 and TPM 2.0 Support for security and remote management.
These certifications ensure the Nuvo‑5002LP meets industrial EMC and environmental standards for deployment in regulated environments.
### 9. Additional Information
Warranty & Support:
Standard Neousys limited warranty (typically 2 years, extendable by region). Technical support and driver updates available via [www.neousys‑tech.com](https://www.neousys-tech.com).
Maintenance:
No fan or filter maintenance required. Periodic inspection of thermal interfaces and dust accumulation recommended for long‑term operation.
Firmware & BIOS Updates:
BIOS updates available from Neousys for enhanced CPU support and feature improvements. Supports user‑configurable CPU power limits and watchdog timer settings.
Software Utilities:
- “One‑Click” Driver Installation utility on Drivers & Utilities DVD.
- WDT_DIO library for watchdog timer and per‑port PoE control functions.
- AMT configuration tools for remote management.
Operating System Support:
- Windows 7 (32/64‑bit) with xHCI driver integration required
- Windows 8.1 / 10 (64‑bit)
- Linux (Ubuntu 14.04/16.04 LTS, Fedora 23, Debian 8.3, OpenSUSE 42.1)
Power Management & Control:
- BIOS options for Wake‑on‑LAN, Power‑on after Power Failure, and SKU Power Configuration.
- Remote on/off control via external switch or ignition signal (MezIO‑V20 module).
- Watchdog Timer (WDT) for system recovery and boot monitoring.
Expansion Ecosystem:
The MezIO™ interface enables custom I/O expansion without compromising mechanical integrity. Modules can add serial ports, digital I/O, PoE ports, or vehicle ignition control, making the Nuvo‑5002LP adaptable to diverse vertical markets.
### Summary
The Neousys Nuvo‑5002LP is a compact, rugged, and highly configurable fanless embedded controller built for industrial and embedded computing environments. Combining Intel® 6th‑Gen Core™ processing power with a low‑profile, wide‑temperature chassis, it delivers exceptional reliability and flexibility. Its dual GbE ports, multiple USB and COM interfaces, triple display outputs, and expandable MezIO™ architecture make it suitable for applications ranging from machine automation and vision systems to transportation and IoT edge nodes. With robust environmental tolerance, wide DC input range, and comprehensive I/O options, the Nuvo‑5002LP offers a balanced solution for performance, durability, and expandability in industrial deployments.
-
Nuvo-5000LP_Datasheet_en.pdf
PDF Catalog
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