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- Fanless Industrial Design: Passive thermal architecture enables operation from ‑25°C to +70°C (with 35 W CPUs) without active cooling.
- Intel® 6th‑Gen Core™ Platform: Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake, LGA1151).
- Intel® Q170 Chipset: Provides advanced I/O, PCIe Gen3 support, and Intel® AMT 11.0 manageability.
- Six Gigabit Ethernet Ports: One Intel® I219‑LM and five Intel® I210‑IT controllers for high‑throughput networking.
- Optional PoE+ Capability: IEEE 802.3at PSE on ports 3–6, 80 W total power budget.
- Triple Independent Display: VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution.
- Flexible Expansion:
- One PCIe x16 slot (Gen3, 8‑lane) via patented Cassette module.
- Two Mini‑PCIe slots (one with front‑accessible SIM socket, one internal).
- One MezIO™ expansion interface for modular I/O.
- Storage Flexibility: Two internal 2.5″ SATA III (6 Gb/s) ports with RAID 0/1 support and one full‑size mSATA (muxed with Mini‑PCIe).
- Rich I/O Connectivity: 4 × USB 3.0, 4 × USB 2.0, 3 × COM (2 × RS‑232/422/485 software‑selectable, 1 × RS‑232), audio I/O, and remote control header.
- Rugged Reliability:
- Vibration resistance: 5 Grms (5–500 Hz, 3 axes, per IEC 60068‑2‑64).
- Shock resistance: 50 Grms (11 ms half‑sine, per IEC 60068‑2‑27).
- Wide DC Input Range: 8 – 35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter.
- Compact Form Factor: 240 × 225 × 90 mm, 4.4 kg including HDD and memory.
- Compliance: CE/FCC Class A, EN 55022/55024/55032, EN 60950 safety.
- Intel® 6th‑Gen Core™ Platform: Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake, LGA1151).
- Intel® Q170 Chipset: Provides advanced I/O, PCIe Gen3 support, and Intel® AMT 11.0 manageability.
- Six Gigabit Ethernet Ports: One Intel® I219‑LM and five Intel® I210‑IT controllers for high‑throughput networking.
- Optional PoE+ Capability: IEEE 802.3at PSE on ports 3–6, 80 W total power budget.
- Triple Independent Display: VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution.
- Flexible Expansion:
- One PCIe x16 slot (Gen3, 8‑lane) via patented Cassette module.
- Two Mini‑PCIe slots (one with front‑accessible SIM socket, one internal).
- One MezIO™ expansion interface for modular I/O.
- Storage Flexibility: Two internal 2.5″ SATA III (6 Gb/s) ports with RAID 0/1 support and one full‑size mSATA (muxed with Mini‑PCIe).
- Rich I/O Connectivity: 4 × USB 3.0, 4 × USB 2.0, 3 × COM (2 × RS‑232/422/485 software‑selectable, 1 × RS‑232), audio I/O, and remote control header.
- Rugged Reliability:
- Vibration resistance: 5 Grms (5–500 Hz, 3 axes, per IEC 60068‑2‑64).
- Shock resistance: 50 Grms (11 ms half‑sine, per IEC 60068‑2‑27).
- Wide DC Input Range: 8 – 35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter.
- Compact Form Factor: 240 × 225 × 90 mm, 4.4 kg including HDD and memory.
- Compliance: CE/FCC Class A, EN 55022/55024/55032, EN 60950 safety.
Comprehensive Product Summary – Neousys Nuvo‑5006E Fanless Embedded Controller
### 1. Product Overview
Product Name: Nuvo‑5006E
Model: Nuvo‑5006E
Series: Nuvo‑5000E/P Series (Rugged Embedded Fanless Controllers)
Article Number: Nuvo‑5006E
Manufacturer: Neousys Technology Inc. (Taiwan)
The Nuvo‑5006E is a rugged, fanless embedded controller designed for industrial and mission‑critical applications. It belongs to Neousys’ Nuvo‑5000 series, which integrates Intel® 6th‑Generation Core™ processors (Skylake architecture) with the Intel® Q170 chipset. The system combines high‑performance computing, wide‑temperature operation, and modular expandability through Neousys’ patented Cassette and MezIO™ interfaces. It is engineered for reliability in harsh environments, offering extended temperature tolerance, vibration and shock resistance, and versatile I/O connectivity.
### 2. Key Features
- Fanless Industrial Design: Passive thermal architecture enables operation from ‑25°C to +70°C (with 35 W CPUs) without active cooling.
- Intel® 6th‑Gen Core™ Platform: Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake, LGA1151).
- Intel® Q170 Chipset: Provides advanced I/O, PCIe Gen3 support, and Intel® AMT 11.0 manageability.
- Six Gigabit Ethernet Ports: One Intel® I219‑LM and five Intel® I210‑IT controllers for high‑throughput networking.
- Optional PoE+ Capability: IEEE 802.3at PSE on ports 3–6, 80 W total power budget.
- Triple Independent Display: VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution.
- Flexible Expansion:
- One PCIe x16 slot (Gen3, 8‑lane) via patented Cassette module.
- Two Mini‑PCIe slots (one with front‑accessible SIM socket, one internal).
- One MezIO™ expansion interface for modular I/O.
- Storage Flexibility: Two internal 2.5″ SATA III (6 Gb/s) ports with RAID 0/1 support and one full‑size mSATA (muxed with Mini‑PCIe).
- Rich I/O Connectivity: 4 × USB 3.0, 4 × USB 2.0, 3 × COM (2 × RS‑232/422/485 software‑selectable, 1 × RS‑232), audio I/O, and remote control header.
- Rugged Reliability:
- Vibration resistance: 5 Grms (5–500 Hz, 3 axes, per IEC 60068‑2‑64).
- Shock resistance: 50 Grms (11 ms half‑sine, per IEC 60068‑2‑27).
- Wide DC Input Range: 8 – 35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter.
- Compact Form Factor: 240 × 225 × 90 mm, 4.4 kg including HDD and memory.
- Compliance: CE/FCC Class A, EN 55022/55024/55032, EN 60950 safety.
### 3. Technical Specifications
Processor Support (LGA1151 Socket):
- Intel® Core™ i7‑6700 (8 MB cache, 3.4/4.0 GHz, 65 W TDP)
- Intel® Core™ i5‑6500 (6 MB cache, 3.2/3.6 GHz, 65 W TDP)
- Intel® Core™ i3‑6100 (3 MB cache, 3.7 GHz, 51 W TDP)
- Intel® Pentium® G4400 (3 MB cache, 3.3 GHz, 54 W TDP)
- Intel® Celeron® G3900 (2 MB cache, 2.8 GHz, 51 W TDP)
- Low‑power TE variants (35 W TDP): i7‑6700TE, i5‑6500TE, i3‑6100TE, G4400TE, G3900TE
Chipset: Intel® Q170 PCH
Graphics: Integrated Intel® HD Graphics 530/510
Memory: Up to 32 GB DDR4‑2133 SO‑DIMM (2 slots)
Storage:
- 2 × 2.5″ SATA III (6 Gb/s) ports, RAID 0/1
- 1 × full‑size mSATA (mux with Mini‑PCIe)
Expansion:
- 1 × PCIe x16 slot (Gen3, 8 lanes) in Cassette
- 2 × Mini‑PCIe slots (SIM support)
- 1 × MezIO™ connector
Ethernet: 6 × GbE (Intel I219‑LM + 5 × I210‑IT)
USB: 4 × USB 3.0 + 4 × USB 2.0
Serial Ports: 2 × RS‑232/422/485 (SW‑selectable), 1 × RS‑232
Audio: 1 × Mic‑in, 1 × Speaker‑out
Video Outputs: 1 × VGA + 1 × DVI‑D + 2 × DisplayPort (4K support)
Power Input: 8 – 35 V DC via 3‑pin terminal block
Dimensions: 240 (W) × 225 (D) × 90 (H) mm
Weight: 4.4 kg (incl. HDD and RAM)
Mounting: Wall‑mount (standard) / DIN‑rail (optional)
Operating Temperature:
- ‑25 °C to +70 °C (35 W CPU)
- ‑25 °C to +50 °C (65 W CPU @ full load)
Storage Temperature: ‑40 °C to +85 °C
Humidity: 10 – 90 % non‑condensing
### 4. Functionality
The Nuvo‑5006E functions as a high‑performance embedded controller for industrial automation, machine vision, transportation, and surveillance. Its fanless design ensures silent, maintenance‑free operation in dusty or vibration‑prone environments.
Operation Principle:
- Passive aluminum heat‑sink chassis dissipates CPU and chipset heat.
- Wide‑range DC input allows direct connection to industrial power sources.
- BIOS‑configurable CPU power modes (35 W/65 W) balance performance and thermal envelope.
- Integrated Intel® AMT 11.0 enables remote management, KVM, and power control.
- TPM 2.0 provides hardware‑level security for encryption and authentication.
Use Cases:
- Industrial automation controllers and data acquisition systems.
- Machine vision and inspection platforms with multi‑camera GbE connectivity.
- Transportation and in‑vehicle computing (with MezIO‑V20 ignition control).
- Network security appliances and edge gateways.
- Digital signage or multi‑display control systems.
Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and major Linux distributions (Ubuntu, Fedora, Debian, OpenSUSE).
### 5. Components & Accessories
Included Items:
- Nuvo‑5006E main unit (barebone or configured with CPU/RAM/HDD).
- Accessory box containing:
- Wall‑mount brackets and screws
- 3‑pin DC terminal block
- Foot pads
- HDD thermal pad
- Screw pack
- Neousys Drivers & Utilities DVD
Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting kit.
- Fankit‑25: 25 × 25 × 10 mm fan assembly for Cassette.
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C).
- DmpbrNuvo5000_7000: Damping bracket assembly for shock absorption.
Cassette Modules:
- CSM‑PoE354: PCIe PoE+ module (4 × IEEE 802.3at ports).
- CSM‑USB380: PCIe USB 3.0 expansion module.
- CSM‑NV750: NVIDIA® GTX 750 Ti graphics module with fan.
- CSM‑R800: 4‑drive RAID module (0/1/10).
MezIO™ Modules:
- MezIO‑C180: 4 × RS‑232/422/485 + 4 × RS‑232.
- MezIO‑C181: 4 × RS‑232/422/485 + 4 × RS‑422/485.
- MezIO‑D220/D230: 8/16 CH isolated DI/DO.
- MezIO‑V20‑EP: Ignition power control for vehicle use.
- MezIO‑U4: 4 × USB 3.0 ports.
- MezIO‑G4/G4P: 4 × GbE or 4 × PoE+ ports.
### 6. Installation & Setup
Requirements:
- DC power supply 8–35 V DC (≥ 120 W recommended).
- Compatible DDR4 SO‑DIMM modules and 2.5″ SATA drives.
- Operating system installation media (USB or SATA).
Mounting Options:
- Wall‑mount: Standard brackets included.
- DIN‑rail: Optional DINRAIL‑O kit.
- Orientation: Vertical mounting recommended for optimal heat dissipation.
Configuration Steps:
1. Install CPU (LGA1151) and DDR4 memory.
2. Mount HDD/SSD to bracket or tray and connect SATA cables.
3. Install Mini‑PCIe modules (Wi‑Fi/4G/GPS) and SIM cards if required.
4. Connect DC power via terminal block (verify polarity).
5. Power on using front button or remote switch (2×5 header).
6. Configure BIOS for boot device, RAID, and power options.
7. Install OS and drivers from Neousys DVD or USB.
Remote Control Header (10‑pin):
Provides external on/off switch input and status LED outputs (PWR, HDD, WDT, Standby).
### 7. Performance & Capabilities
Processing Performance:
- Up to 4.0 GHz Core i7 CPU with 8 MB cache.
- DDR4 2133 MHz memory bandwidth for high‑speed data processing.
Graphics:
- Intel® HD Graphics 530 supports DirectX 12, OpenGL 4.4, and 4K display output.
- Triple independent display operation (VGA + DVI‑D + DP).
Networking:
- Six independent GbE controllers with dedicated PCIe lanes for maximum throughput.
- Optional PoE+ power delivery (25.5 W per port, 80 W total).
- Wake‑on‑LAN and Intel® AMT remote management support.
Storage Performance:
- SATA III 6 Gb/s RAID 0/1 for redundancy or speed.
- mSATA SSD option for OS boot and fast data access.
Environmental Endurance:
- Operates in ‑25 °C to +70 °C ambient (35 W CPU).
- Withstands 5 Grms vibration and 50 Grms shock with SSD.
Power Efficiency:
- Typical consumption ≈ 40–50 W (depending on CPU).
- BIOS‑configurable SKU power limit for thermal optimization.
Limitations:
- 65 W CPUs limited to +50 °C ambient at full load without throttling.
- Add‑on cards in Cassette should not exceed 16 W without optional fan.
### 8. Standards & Compliance
- EMC: CE/FCC Class A (EN 55022, EN 55024, EN 55032).
- Safety: EN 60950 Information Technology Equipment Safety.
- Environmental Tests: IEC 60068‑2‑64 (vibration), IEC 60068‑2‑27 (shock).
- PoE Standard: IEEE 802.3at PSE (Ports 3–6).
- RoHS Compliance: Lead‑free manufacturing.
- Patent: R.O.C. Patent No. M456527 (Cassette design).
### 9. Additional Information
Warranty: Standard 3‑year limited manufacturer warranty.
Support: Neousys provides technical documentation, driver packages, and firmware updates via official website.
Maintenance: Fanless design minimizes dust accumulation; periodic inspection of thermal interfaces recommended.
Firmware & BIOS Updates: Available through Neousys support portal; BIOS includes AMT, TPM, RAID, and WDT configuration utilities.
Software Tools: WDT_DIO library for watchdog and PoE control functions (Windows API).
Operating System Support: Windows 7/8.1/10 (32/64‑bit), Linux (Ubuntu, Debian, Fedora, OpenSUSE).
Lifecycle: Embedded roadmap CPUs with 7‑year availability (2015–2021 and beyond).
### Summary
The Neousys Nuvo‑5006E is a robust, modular, and high‑performance fanless embedded controller tailored for industrial automation, machine vision, and rugged computing environments. Combining Intel® Skylake processing, six Gigabit Ethernet ports, triple display support, and versatile expansion options, it delivers exceptional flexibility and reliability. Its patented Cassette and MezIO™ interfaces enable custom I/O and add‑on modules without compromising thermal integrity. With wide‑temperature operation, shock/vibration resilience, and compliance to industrial standards, the Nuvo‑5006E is an ideal platform for demanding embedded applications requiring long‑term stability and expandability.
### 1. Product Overview
Product Name: Nuvo‑5006E
Model: Nuvo‑5006E
Series: Nuvo‑5000E/P Series (Rugged Embedded Fanless Controllers)
Article Number: Nuvo‑5006E
Manufacturer: Neousys Technology Inc. (Taiwan)
The Nuvo‑5006E is a rugged, fanless embedded controller designed for industrial and mission‑critical applications. It belongs to Neousys’ Nuvo‑5000 series, which integrates Intel® 6th‑Generation Core™ processors (Skylake architecture) with the Intel® Q170 chipset. The system combines high‑performance computing, wide‑temperature operation, and modular expandability through Neousys’ patented Cassette and MezIO™ interfaces. It is engineered for reliability in harsh environments, offering extended temperature tolerance, vibration and shock resistance, and versatile I/O connectivity.
### 2. Key Features
- Fanless Industrial Design: Passive thermal architecture enables operation from ‑25°C to +70°C (with 35 W CPUs) without active cooling.
- Intel® 6th‑Gen Core™ Platform: Supports socket‑type Intel® Core™ i7/i5/i3, Pentium®, and Celeron® processors (Skylake, LGA1151).
- Intel® Q170 Chipset: Provides advanced I/O, PCIe Gen3 support, and Intel® AMT 11.0 manageability.
- Six Gigabit Ethernet Ports: One Intel® I219‑LM and five Intel® I210‑IT controllers for high‑throughput networking.
- Optional PoE+ Capability: IEEE 802.3at PSE on ports 3–6, 80 W total power budget.
- Triple Independent Display: VGA, DVI‑D, and dual DisplayPort outputs supporting up to 4K2K resolution.
- Flexible Expansion:
- One PCIe x16 slot (Gen3, 8‑lane) via patented Cassette module.
- Two Mini‑PCIe slots (one with front‑accessible SIM socket, one internal).
- One MezIO™ expansion interface for modular I/O.
- Storage Flexibility: Two internal 2.5″ SATA III (6 Gb/s) ports with RAID 0/1 support and one full‑size mSATA (muxed with Mini‑PCIe).
- Rich I/O Connectivity: 4 × USB 3.0, 4 × USB 2.0, 3 × COM (2 × RS‑232/422/485 software‑selectable, 1 × RS‑232), audio I/O, and remote control header.
- Rugged Reliability:
- Vibration resistance: 5 Grms (5–500 Hz, 3 axes, per IEC 60068‑2‑64).
- Shock resistance: 50 Grms (11 ms half‑sine, per IEC 60068‑2‑27).
- Wide DC Input Range: 8 – 35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter.
- Compact Form Factor: 240 × 225 × 90 mm, 4.4 kg including HDD and memory.
- Compliance: CE/FCC Class A, EN 55022/55024/55032, EN 60950 safety.
### 3. Technical Specifications
Processor Support (LGA1151 Socket):
- Intel® Core™ i7‑6700 (8 MB cache, 3.4/4.0 GHz, 65 W TDP)
- Intel® Core™ i5‑6500 (6 MB cache, 3.2/3.6 GHz, 65 W TDP)
- Intel® Core™ i3‑6100 (3 MB cache, 3.7 GHz, 51 W TDP)
- Intel® Pentium® G4400 (3 MB cache, 3.3 GHz, 54 W TDP)
- Intel® Celeron® G3900 (2 MB cache, 2.8 GHz, 51 W TDP)
- Low‑power TE variants (35 W TDP): i7‑6700TE, i5‑6500TE, i3‑6100TE, G4400TE, G3900TE
Chipset: Intel® Q170 PCH
Graphics: Integrated Intel® HD Graphics 530/510
Memory: Up to 32 GB DDR4‑2133 SO‑DIMM (2 slots)
Storage:
- 2 × 2.5″ SATA III (6 Gb/s) ports, RAID 0/1
- 1 × full‑size mSATA (mux with Mini‑PCIe)
Expansion:
- 1 × PCIe x16 slot (Gen3, 8 lanes) in Cassette
- 2 × Mini‑PCIe slots (SIM support)
- 1 × MezIO™ connector
Ethernet: 6 × GbE (Intel I219‑LM + 5 × I210‑IT)
USB: 4 × USB 3.0 + 4 × USB 2.0
Serial Ports: 2 × RS‑232/422/485 (SW‑selectable), 1 × RS‑232
Audio: 1 × Mic‑in, 1 × Speaker‑out
Video Outputs: 1 × VGA + 1 × DVI‑D + 2 × DisplayPort (4K support)
Power Input: 8 – 35 V DC via 3‑pin terminal block
Dimensions: 240 (W) × 225 (D) × 90 (H) mm
Weight: 4.4 kg (incl. HDD and RAM)
Mounting: Wall‑mount (standard) / DIN‑rail (optional)
Operating Temperature:
- ‑25 °C to +70 °C (35 W CPU)
- ‑25 °C to +50 °C (65 W CPU @ full load)
Storage Temperature: ‑40 °C to +85 °C
Humidity: 10 – 90 % non‑condensing
### 4. Functionality
The Nuvo‑5006E functions as a high‑performance embedded controller for industrial automation, machine vision, transportation, and surveillance. Its fanless design ensures silent, maintenance‑free operation in dusty or vibration‑prone environments.
Operation Principle:
- Passive aluminum heat‑sink chassis dissipates CPU and chipset heat.
- Wide‑range DC input allows direct connection to industrial power sources.
- BIOS‑configurable CPU power modes (35 W/65 W) balance performance and thermal envelope.
- Integrated Intel® AMT 11.0 enables remote management, KVM, and power control.
- TPM 2.0 provides hardware‑level security for encryption and authentication.
Use Cases:
- Industrial automation controllers and data acquisition systems.
- Machine vision and inspection platforms with multi‑camera GbE connectivity.
- Transportation and in‑vehicle computing (with MezIO‑V20 ignition control).
- Network security appliances and edge gateways.
- Digital signage or multi‑display control systems.
Compatibility:
Supports Windows 7/8.1/10 (32/64‑bit) and major Linux distributions (Ubuntu, Fedora, Debian, OpenSUSE).
### 5. Components & Accessories
Included Items:
- Nuvo‑5006E main unit (barebone or configured with CPU/RAM/HDD).
- Accessory box containing:
- Wall‑mount brackets and screws
- 3‑pin DC terminal block
- Foot pads
- HDD thermal pad
- Screw pack
- Neousys Drivers & Utilities DVD
Optional Accessories:
- DINRAIL‑O: DIN‑rail mounting kit.
- Fankit‑25: 25 × 25 × 10 mm fan assembly for Cassette.
- PA‑120W‑OW: 120 W AC/DC adapter (20 V/6 A, ‑30 °C to +70 °C).
- DmpbrNuvo5000_7000: Damping bracket assembly for shock absorption.
Cassette Modules:
- CSM‑PoE354: PCIe PoE+ module (4 × IEEE 802.3at ports).
- CSM‑USB380: PCIe USB 3.0 expansion module.
- CSM‑NV750: NVIDIA® GTX 750 Ti graphics module with fan.
- CSM‑R800: 4‑drive RAID module (0/1/10).
MezIO™ Modules:
- MezIO‑C180: 4 × RS‑232/422/485 + 4 × RS‑232.
- MezIO‑C181: 4 × RS‑232/422/485 + 4 × RS‑422/485.
- MezIO‑D220/D230: 8/16 CH isolated DI/DO.
- MezIO‑V20‑EP: Ignition power control for vehicle use.
- MezIO‑U4: 4 × USB 3.0 ports.
- MezIO‑G4/G4P: 4 × GbE or 4 × PoE+ ports.
### 6. Installation & Setup
Requirements:
- DC power supply 8–35 V DC (≥ 120 W recommended).
- Compatible DDR4 SO‑DIMM modules and 2.5″ SATA drives.
- Operating system installation media (USB or SATA).
Mounting Options:
- Wall‑mount: Standard brackets included.
- DIN‑rail: Optional DINRAIL‑O kit.
- Orientation: Vertical mounting recommended for optimal heat dissipation.
Configuration Steps:
1. Install CPU (LGA1151) and DDR4 memory.
2. Mount HDD/SSD to bracket or tray and connect SATA cables.
3. Install Mini‑PCIe modules (Wi‑Fi/4G/GPS) and SIM cards if required.
4. Connect DC power via terminal block (verify polarity).
5. Power on using front button or remote switch (2×5 header).
6. Configure BIOS for boot device, RAID, and power options.
7. Install OS and drivers from Neousys DVD or USB.
Remote Control Header (10‑pin):
Provides external on/off switch input and status LED outputs (PWR, HDD, WDT, Standby).
### 7. Performance & Capabilities
Processing Performance:
- Up to 4.0 GHz Core i7 CPU with 8 MB cache.
- DDR4 2133 MHz memory bandwidth for high‑speed data processing.
Graphics:
- Intel® HD Graphics 530 supports DirectX 12, OpenGL 4.4, and 4K display output.
- Triple independent display operation (VGA + DVI‑D + DP).
Networking:
- Six independent GbE controllers with dedicated PCIe lanes for maximum throughput.
- Optional PoE+ power delivery (25.5 W per port, 80 W total).
- Wake‑on‑LAN and Intel® AMT remote management support.
Storage Performance:
- SATA III 6 Gb/s RAID 0/1 for redundancy or speed.
- mSATA SSD option for OS boot and fast data access.
Environmental Endurance:
- Operates in ‑25 °C to +70 °C ambient (35 W CPU).
- Withstands 5 Grms vibration and 50 Grms shock with SSD.
Power Efficiency:
- Typical consumption ≈ 40–50 W (depending on CPU).
- BIOS‑configurable SKU power limit for thermal optimization.
Limitations:
- 65 W CPUs limited to +50 °C ambient at full load without throttling.
- Add‑on cards in Cassette should not exceed 16 W without optional fan.
### 8. Standards & Compliance
- EMC: CE/FCC Class A (EN 55022, EN 55024, EN 55032).
- Safety: EN 60950 Information Technology Equipment Safety.
- Environmental Tests: IEC 60068‑2‑64 (vibration), IEC 60068‑2‑27 (shock).
- PoE Standard: IEEE 802.3at PSE (Ports 3–6).
- RoHS Compliance: Lead‑free manufacturing.
- Patent: R.O.C. Patent No. M456527 (Cassette design).
### 9. Additional Information
Warranty: Standard 3‑year limited manufacturer warranty.
Support: Neousys provides technical documentation, driver packages, and firmware updates via official website.
Maintenance: Fanless design minimizes dust accumulation; periodic inspection of thermal interfaces recommended.
Firmware & BIOS Updates: Available through Neousys support portal; BIOS includes AMT, TPM, RAID, and WDT configuration utilities.
Software Tools: WDT_DIO library for watchdog and PoE control functions (Windows API).
Operating System Support: Windows 7/8.1/10 (32/64‑bit), Linux (Ubuntu, Debian, Fedora, OpenSUSE).
Lifecycle: Embedded roadmap CPUs with 7‑year availability (2015–2021 and beyond).
### Summary
The Neousys Nuvo‑5006E is a robust, modular, and high‑performance fanless embedded controller tailored for industrial automation, machine vision, and rugged computing environments. Combining Intel® Skylake processing, six Gigabit Ethernet ports, triple display support, and versatile expansion options, it delivers exceptional flexibility and reliability. Its patented Cassette and MezIO™ interfaces enable custom I/O and add‑on modules without compromising thermal integrity. With wide‑temperature operation, shock/vibration resilience, and compliance to industrial standards, the Nuvo‑5006E is an ideal platform for demanding embedded applications requiring long‑term stability and expandability.
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Nuvo-5000EP_Datasheet_en.pdf
PDF Catalog
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