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Industrial Computers

Industrie-PCs sind für den zuverlässigen Dauerbetrieb in Produktion, Automation und Maschinenbau ausgelegt. Sie widerstehen Staub, Vibrationen und Temperaturschwankungen und bieten eine stabile Basis für Steuerung, Visualisierung und Datenerfassung.

Unterkategorien

2.1 - (Artificial Intelligence Robot) Rechenplattformen, Kameras und Robotiksysteme für industrielle KI- und Automatisierungsanwendungen.
2.1.1 - (Inference & Deep Learning) Rechenplattformen für die Ausführung von KI-Modellen und Deep-Learning-Anwendungen im industriellen Umfeld.
2.1.2 - (Smart AI Cams) Intelligente Kameras für die Integration bildbasierter KI-Auswertung in industrielle Anwendungen.
2.1.3 - (ROS Robots AV) Robotikplattformen für die Entwicklung ROS-basierter Anwendungen und autonomer Fahrfunktionen.
2.2 - (Embedded Systems) Embedded-Computer für die Integration von Rechenleistung und Schnittstellen in Maschinen und Anlagen.
2.2.1 - (Core i7/i5/i3 Embedded) Embedded-Computer mit Intel-Core-i3-, i5- und i7-Prozessoren für industrielle Rechen- und Steuerungsaufgaben.
2.2.1.1 - (Adlink M-Series) ADLINK-Embedded-Systeme der M-Serie für industrielle Rechner- und Integrationslösungen.
2.2.1.2 - (Nuvo-6000/7000/8000-Series) Nuvo-Systeme der Serien 6000, 7000 und 8000 für industrielle Automatisierung und Datenerfassung.
2.2.1.3 - (Nuvo-5000-Series) Embedded-Computer der Nuvo-5000-Serie für industrielle Steuerungs- und Verarbeitungsaufgaben.
2.2.1.4 - (Nuvo-3000-Series) Embedded-Computer der Nuvo-3000-Serie für die Integration in Maschinen und Bestandsanlagen.
2.2.1.5 - (Nuvo-4000-Series) Embedded-Computer der Nuvo-4000-Serie für industrielle Rechen- und Schnittstellenanwendungen.
2.2.1.6 - (Nuvo-2000-Series and others) Embedded-Computer der Nuvo-2000-Serie und weiterer Baureihen für industrielle Integrationsaufgaben.
2.2.1.7 - (Embedded with GPU) Embedded-Systeme mit GPU für parallele Datenverarbeitung, Bildanalyse und KI-Anwendungen.
2.2.1.8 - (Nuvo-9000-Series) Embedded-Computer der Nuvo-9000-Serie für industrielle Automatisierung und Bildverarbeitung.
2.2.2 - (Atom Powered Embedded) Embedded-Computer mit Intel-Atom-Prozessoren für kompakte industrielle Rechen- und Steuerungssysteme.
2.2.3 - (ARM Embedded Systems) ARM-basierte Embedded-Systeme für Geräteintegration, Kommunikation und industrielle Steuerungsaufgaben.
2.2.3.1 - (LCD HMI) ARM-basierte Bediengeräte mit LCD für die Anzeige und Steuerung von Maschinenfunktionen.
2.2.3.2 - (IoT Gateway) IoT-Gateways zur Anbindung von Geräten und Betriebsdaten an übergeordnete Informationssysteme.
2.2.3.3 - (Automation Controller) Automatisierungscontroller für die Umsetzung industrieller Steuerungs- und Kommunikationsaufgaben.
2.2.3.4 - (SBC Modules) ARM-basierte Einplatinencomputer für die Entwicklung kundenspezifischer Geräte und Embedded-Anwendungen.
2.2.3.5 - (Accessories) Systemzubehör für die Installation und Erweiterung ARM-basierter Embedded-Plattformen.
2.2.4 - (IPC Embedded System) Embedded-Industriecomputer für die Integration in Maschinen, Prüfstände und Automatisierungssysteme.
2.2.5 - (HMI) HMI-Systeme zur Bedienung und Visualisierung industrieller Maschinen und Prozesse.
2.2.6 - (Handheld Android 5.0) Handheld-Geräte mit Android 5.0 für kompatible mobile Erfassungs- und Bedienanwendungen.
2.2.7 - (Power Modules) Versorgungsmodule für den elektrischen Anschluss und Betrieb kompatibler Embedded-Systeme.
2.3 - (PXI/cPCI Controller/Chassis) Controller und Gehäuse für modulare PXI- und CompactPCI-Mess- und Steuerungssysteme.
2.3.1 - (PXIe Platform) PXI-Express-Systemplattformen für den Aufbau modularer Mess- und Prüfsysteme.
2.3.1.1 - (PXIe / PXI Controller 3U) 3-HE-Controller für die zentrale Verarbeitung und Steuerung in PXI- und PXI-Express-Systemen.
2.3.1.2 - (PXIe PXI Chassis) PXI- und PXI-Express-Chassis für die Aufnahme kompatibler Controller und Messmodule.
2.3.2 - (cPCI 3U CPU chassis) CompactPCI-Prozessorkarten und Gehäuse im 3-HE-Format für modulare Industriesysteme.
2.3.2.1 - (cPCI CPU P-III Level) CompactPCI-Prozessorkarten der Pentium-III-Klasse für kompatible Bestands- und Ersatzteilsysteme.
2.3.2.2 - (cPCI CPU LPP-266) CompactPCI-Prozessorkarten der LPP-266-Klasse für die Instandhaltung kompatibler Systeme.
2.3.2.3 - (cPCI Interface Cards) CompactPCI-Schnittstellenkarten zur Erweiterung modularer Industrie- und Steuerungssysteme.
2.3.2.4 - (cPCI 3U 19'' Chassis) 3-HE-CompactPCI-Gehäuse für den Aufbau modularer Systeme im 19-Zoll-Rack.
2.3.2.5 - (cPCI LCD) LCD-Komponenten für Anzeige- und Bedienfunktionen in kompatiblen CompactPCI-Systemen.
2.3.2.6 - (cPCI Backplanes) CompactPCI-Backplanes zur Verbindung von Controller- und Erweiterungsbaugruppen.
2.3.2.7 - (cPCI Power Supplies) Netzteile für die elektrische Versorgung kompatibler CompactPCI-Systeme.
2.3.3 - (cPCI 6U CPU, Chassis) CompactPCI-Prozessorkarten und Chassis im 6-HE-Format für industrielle Systemplattformen.
2.3.3.1 - (cPCI CPU Card 6U) 6-HE-CompactPCI-Prozessorkarten für modulare Rechner- und Steuerungssysteme.
2.3.3.2 - (cPCI CPU Card P-III Level 6U) 6-HE-CompactPCI-Prozessorkarten der Pentium-III-Klasse für kompatible Bestandsanlagen.
2.4 - (Industrial Computer) Industriecomputer, Panel-PCs und Displays für Rechen-, Bedien- und Visualisierungsaufgaben.
2.4.1 - (Industrial Computer 19'' Systems) 19-Zoll-Industriecomputersysteme für die Integration in Racks und Automatisierungsschränke.
2.4.1.1 - (Industrial Computer 19'') Industriecomputer im 19-Zoll-Format für zentrale Rechen- und Steuerungsaufgaben.
2.4.1.2 - (IPC 19'' Workstation with LCD, Kbd, Low Mounting Depth) 19-Zoll-Workstations mit LCD, Tastatur und geringer Einbautiefe für kompakte Racks.
2.4.1.3 - (IPC 19'' Workstation With LCD, Kbd) 19-Zoll-Workstations mit integriertem LCD und Tastatur für industrielle Bedienplätze.
2.4.1.4 - (IPC 19'' Workstation With LCD) 19-Zoll-Workstations mit LCD für die integrierte Verarbeitung und Darstellung von Betriebsdaten.
2.4.2 - (Panel LCD PCs) Panel-PCs mit LCD für die Integration von Bedienung und Rechenleistung in Maschinenfronten.
2.4.2.1 - (Panel IPCs With Front Controls) Panel-Industriecomputer mit frontseitigen Bedienelementen für Maschinen- und Anlagenbedienung.
2.4.2.2 - (Panel IPCs Without Front Controls) Panel-Industriecomputer ohne frontseitige Bedienelemente für integrierte Bedien- und Anzeigelösungen.
2.4.2.3 - (Open Frame PC System) Open-Frame-PC-Systeme für den Einbau in kundenspezifische Gehäuse und Bedienoberflächen.
2.4.3 - (Panel Displays) Panel-Displays für die industrielle Anzeige von Prozess-, Maschinen- und Systemdaten.
2.4.3.1 - (Industrial Monitor) Industriemonitore für Visualisierung und Bedienplätze in Maschinen und Anlagen.
2.4.3.1.1 - (LCD Panel 4:3) LCD-Panels im 4:3-Format für die Integration in industrielle Anzeige- und Bedienlösungen.
2.4.3.1.2 - (LCD Widescreen) Breitformatige LCD-Displays zur Darstellung industrieller Prozess- und Anwendungsoberflächen.
2.4.3.1.3 - (LCD Rackmount) Rackmount-LCD-Monitore für Anzeige- und Bedienplätze in 19-Zoll-Systemen.
2.4.3.1.4 - (LCD Monitor) LCD-Monitore für Anzeigeaufgaben an industriellen Rechner- und Bedienplätzen.
2.4.3.2 - (LCD Open Metal Frame) LCD-Displays mit offenem Metallrahmen für die Integration in kundenspezifische Systeme.
2.4.3.3 - (Panel 19") 19-Zoll-Anzeigepanels für die Integration in industrielle Racks und Rechnerschränke.
2.4.3.4 - (Panel Display 19'' With Keyboard) 19-Zoll-Anzeigeeinheiten mit Tastatur für zentrale Bedienplätze in Rack-Systemen.
2.5 - (Complete) Komplettsysteme für industrielle Steuerung, dezentrale I/O-Anbindung und Bewegungsautomatisierung.
2.5.1 - (EtherCAT) EtherCAT-Komponenten für die Vernetzung von Steuerungen, I/O-Modulen und Antrieben.
2.5.1.1 - (Master) EtherCAT-Master für die Koordination kompatibler Antriebe und dezentraler I/O-Teilnehmer.
2.5.1.2 - (Modules) EtherCAT-Module zur Erweiterung industrieller Steuerungs- und Automatisierungssysteme.
2.5.1.3 - (Remote IO Modules) Remote-I/O-Module zur dezentralen Signalerfassung und -ausgabe in EtherCAT-Netzwerken.
2.5.2 - (Motion Control) Motion-Control-Systeme zur Koordination von Antrieben und industriellen Positionieraufgaben.

Produkte

1121 Produkte

Nr. Code Produkt Preis Menge
2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCIe,MezIO Nuvo-9006E-PoE
Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCIe,MezIO

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, PoE+, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCIe,MezIO,UL Nuvo-9006E-PoE-UL
Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCIe,MezIO,UL

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, PoE+, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,s-slot PCIe,MezIO,UL Nuvo-9006E-UL
Intel 14/13/12G rugged PC 6x2.5GbE,s-slot PCIe,MezIO,UL

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD Nuvo-9006LP
Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD,PoE+ Nuvo-9006LP-PoE
Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD,PoE+

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,MezIO,2.5" HDD,PoE+,UL Nuvo-9006LP-PoE-UL
Intel 14/13/12G rugged PC 6x2.5GbE,MezIO,2.5" HDD,PoE+,UL

Intel® 14th/13th/12th Gen Core™ i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD,UL Nuvo-9006LP-UL
Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,MezIO,2.5" HDD,UL

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65 W/35 W TDP) and Intel® Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× DIMM slots. Integrated Intel® UHD Graphics 770/730, cassette-less low-profile design, 1× hot-swappable 2.5? HDD/SSD tray (7 mm) + 1× internal 2.5? SATA (RAID 0/1), 5× 2.5GbE (Intel I226/I225) + 1× GbE (Intel I219-LM) LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO® expansion, remote power control, rugged -25 °C…+70 °C fanless operation, 8–48 V DC input, wall-mount chassis 240×225×79 mm, 3.36 kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,s-slot PCI,MezIO Nuvo-9006P
Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,s-slot PCI,MezIO

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,s-slot PCI,MezIO,PoE+ Nuvo-9006P-PoE
Intel 14/13/12G rugged PC 6x2.5GbE,s-slot PCI,MezIO,PoE+

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, PoE+, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCI, MezIO,UL Nuvo-9006P-PoE-UL
Intel 14/13/12G rugged PC 6x2.5GbE,PoE+,s-slot PCI, MezIO,UL

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel® UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports, 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, UL certified, PoE+, Neousys

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,s-slot PCI,MezIO,UL Nuvo-9006P-UL
Intel 14/13/12G rugged PC 6x2.5GbE,USB-C,s-slot PCI,MezIO,UL

Intel 14th/13th/12th Gen Core i9/i7/i5/i3 rugged embedded computer with LGA1700 socket (65W/35W TDP) and Intel Q670E chipset. Supports up to 64 GB DDR5-4800 via 2× SODIMM slots. Features integrated Intel UHD Graphics 770/730, 1× PCI Slo, 5× 2.5GbE + 1× GbE LAN ports (PoE+ optional), 1× USB 3.2 Gen2x2 Type-C, 4× USB 3.2 Gen2, 2× USB 3.2 Gen1, 2× USB 2.0, VGA, DVI-D, DisplayPort, 2× RS-232/422/485, 2× RS-232, audio I/O, 2× 2.5" SATA HDD/SSD bays with RAID 0/1, 1× M.2 2280 Gen4 NVMe slot, 1× mini-PCIe, 1× M.2 B-Key with SIM, MezIO expansion port, remote power control, rugged -25?°C…+70?°C fanless operation, 8–48?V DC input, wall-mount chassis 240×225×90?mm, 3.58?kg, UL certified, Neousys.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Compact rugged fanless computer with 4x 2.5GbE, 4x USB 3.2 and hot-swappable storage. Nuvo-9531
Compact rugged fanless computer with 4x 2.5GbE, 4x USB 3.2 and hot-swappable storage.

Compact fanless embedded computer supporting Intel 14th, 13th and 12th Gen Core processors in an LGA1700 socket with 35 W or 65 W TDP. It provides up to 32 GB DDR4-3200, four 2.5GbE ports with optional PoE+, four USB 3.2 Gen 1 ports, isolated 4-channel DI and 4-channel DO, VGA and DisplayPort outputs, an M.2 2280 PCIe Gen4 x4 NVMe socket and a hot-swappable 2.5-inch HDD/SSD tray. The rugged 212 x 165 x 63 mm system operates from 8 to 48 VDC and supports -25°C to 60°C fanless operation under the stated CPU conditions.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.1.8 Compact fanless computer with flattop heatsink, 4x 2.5GbE and hot-swappable storage. Nuvo-9531-FT
Compact fanless computer with flattop heatsink, 4x 2.5GbE and hot-swappable storage.

Low-profile fanless embedded computer supporting Intel 14th/13th/12th-Gen LGA1700 processors with 65W or 35W TDP. It provides up to 32GB DDR4-3200, four 2.5GbE ports, four USB 3.2 Gen1 ports, isolated 4-channel DI and 4-channel DO, VGA and DisplayPort, an M.2 2280 PCIe Gen4 x4 NVMe socket, and a hot-swappable 2.5-inch HDD/SSD tray. The 212 x 165 x 45 mm system accepts 8–48V DC and operates fanlessly from -25°C to 60°C under the specified conditions.

Hersteller: Neousys Technology

Kategorie: Nuvo-9000-Series

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2.2.2 Fanless D525 System 2*GbE 4*COM 8*DIO 1*PCI-104 ARS-1000
Fanless D525 System 2*GbE 4*COM 8*DIO 1*PCI-104

- **Fanless Embedded Design:** The ARS-1000 employs a fanless thermal solution with an integrated aluminum heat sink and internal heat spreader, ensuring silent operation and long-term reliability in dusty or vibration-prone environments. - **Intel® Atom™ D525 Processor:** Dual-core 1.8GHz CPU with 1MB cache, offering low power consumption and sufficient processing capability for automation, control, and data acquisition tasks. - **Wide Operating Temperature Range:** Designed for rugged environments, the system operates reliably from -20°C to +70°C ambient temperature with airflow. - **Dual Gigabit Ethernet Ports:** Two Intel® WG82583V GbE interfaces provide high-speed networking and redundancy options for industrial communication. - **Rich I/O Connectivity:** Includes 4 COM ports (3 x RS-232, 1 x RS-232/422/485 with automatic flow control), 5 USB 2.0 ports, isolated 8 digital inputs and 8 digital outputs (8DI/8DO), and programmable GPIO. - **Expansion Capability:** Supports PCI-104 and PC/104+ expansion modules, allowing integration of additional I/O, communication, or control cards. - **Storage Flexibility:** Internal 2.5” SATA/SATA II bay for HDD/SSD and an externally accessible CFast slot for removable solid-state storage. - **Display Options:** Dual independent display support via VGA (DB15) and 24-bit LVDS interfaces. - **Programmable Indicators:** Includes a 16-step rotary switch for mode selection and programmable LED display with four status modes. - **Compact and Durable Construction:** Aluminum heat-sink enclosure with sheet metal chassis, iron-gray finish, and wall or DIN-rail mounting options. - **Wide DC Input Range:** Operates from 16V to 28V DC, suitable for industrial power systems. - **Comprehensive OS Support:** Compatible with Windows XP Embedded, Windows XP Professional, and multiple Linux distributions (Fedora 11, Ubuntu 10.04, CentOS 5.3).

Hersteller: Vecow Co., Ltd

Kategorie: Atom Powered Embedded

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2.2.2 Fanless D525 System 2*GbE 4*COM 8*DIO 1*PC/104+ 3*1394a ARS-1100
Fanless D525 System 2*GbE 4*COM 8*DIO 1*PC/104+ 3*1394a

- **Fanless Design:** The ARS-1100 employs a completely fanless thermal solution using an aluminum heat-sink chassis and internal heat spreader, ensuring silent operation and long-term reliability in harsh environments. - **Intel® Atom™ D525 Processor:** Dual-core 1.8GHz CPU with 1MB cache, offering low power consumption and sufficient processing power for embedded and automation tasks. - **Wide Operating Temperature:** Designed for industrial environments, the system operates reliably from -20°C to +70°C ambient temperature with airflow. - **Dual Gigabit Ethernet Ports:** Two Intel® WG82583V GbE interfaces provide high-speed networking and redundancy for industrial communication. - **Rich I/O Connectivity:** Includes 4 COM ports (3×RS-232, 1×RS-232/422/485 with auto flow control), 5 USB 2.0 ports, 8 isolated digital inputs, and 8 isolated digital outputs. - **Expansion Flexibility:** Supports PCI-104 and PC/104+ expansion modules, as well as a Mini PCIe slot for wireless or additional I/O modules. - **Triple IEEE 1394a Ports:** Three FireWire ports (exclusive to ARS-1100/ARS-1200 models) for high-speed data transfer and vision system integration. - **Dual Independent Display:** Supports VGA (DB15) and 24-bit LVDS outputs for dual-display configurations. - **Programmable GPIO and LED Display:** 16-step rotary switch and programmable LED indicators for mode/status display and system diagnostics. - **External CFast Slot:** Easily accessible CFast storage slot for quick data exchange and OS deployment. - **Rugged Power Input:** Wide-range DC input from 16V to 28V with onboard DC-to-DC conversion, suitable for field and mobile installations. - **Compact and Durable Construction:** Measuring 186 × 147 × 79 mm and weighing approximately 2.1 kg, the ARS-1100 is built with an iron-gray aluminum and sheet metal chassis for durability. - **OS Compatibility:** Supports Windows XP Embedded, Windows XP Professional, and various Linux distributions (Fedora 11, Ubuntu 10.04, CentOS 5.3).

Hersteller: Vecow Co., Ltd

Kategorie: Atom Powered Embedded

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2.2.2 Fanless D525 Syst. 2*GbE 4*COM 8*DIO 1*PC/104+ 3*1394a 2*CAN ARS-1200
Fanless D525 Syst. 2*GbE 4*COM 8*DIO 1*PC/104+ 3*1394a 2*CAN

- **Fanless Design:** The ARS-1200 employs a completely fanless thermal architecture with an aluminum heat-sink chassis, ensuring silent operation, reduced maintenance, and enhanced reliability in dusty or vibration-prone environments. - **Intel® Atom™ D525 Processor:** Powered by a dual-core Intel Atom D525 CPU (1M Cache, 1.8GHz) with Intel ICH8M chipset, offering a balance of performance and low power consumption for embedded and automation tasks. - **Dual Gigabit Ethernet:** Two Intel® WG82583V Gigabit Ethernet ports provide high-speed, redundant, or segmented network connectivity for industrial communication. - **Rich I/O Connectivity:** Includes 4 COM ports (3×RS-232, 1×RS-232/422/485 with automatic flow control), 5 USB 2.0 ports, and isolated digital I/O (8×DI, 8×DO, 24V). - **Expansion Flexibility:** Supports PCI-104 and PC/104+ expansion modules, Mini PCIe slot, and onboard EPROM for unique ID identification. - **IEEE 1394a and CAN Bus:** Three IEEE 1394a ports and two CAN interfaces enable integration with machine vision, robotics, and automotive control systems. - **Dual Display Support:** Offers VGA (DB15) and DVI/HDMI or 24-bit LVDS outputs for dual independent display configurations. - **External CFast Port:** Provides an easily accessible CFast slot for removable solid-state storage, ideal for data logging or quick system updates. - **Programmable GPIO and LED Display:** Features programmable GPIO with isolation protection, a 16-step rotary switch for mode selection, and a 4-mode/status LED display for system diagnostics. - **Wide Temperature and Voltage Range:** Operates reliably from -20°C to +70°C with DC input from 16V to 28V, suitable for field deployment in industrial automation and transportation. - **Mounting Options:** Supports both wall-mount and DIN-rail installation for flexible deployment in control cabinets or machinery enclosures. - **OS Compatibility:** Compatible with Windows XP Embedded, Windows XP Professional, and multiple Linux distributions (Fedora 11, Ubuntu 10.04, CentOS 5.3).

Hersteller: Vecow Co., Ltd

Kategorie: Atom Powered Embedded

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2.2.2 Fanless D525 System 2*GbE 8*COM 8*DIO 1*PC/104+ ARS-1500
Fanless D525 System 2*GbE 8*COM 8*DIO 1*PC/104+

- **Fanless Embedded Design:** The ARS-1500 employs a completely fanless thermal architecture, utilizing an aluminum heat-sink chassis for passive cooling. This design ensures silent operation, reduced maintenance, and enhanced reliability in dusty or vibration-prone environments. - **Intel® Atom™ D525 Processor:** Powered by a dual-core Intel® Atom™ D525 CPU (1M Cache, 1.8GHz) paired with the Intel® ICH8M chipset, the system delivers efficient computing performance with low power consumption, ideal for automation and control tasks. - **Dual Gigabit Ethernet Ports:** Equipped with two Intel® WG82583V Gigabit Ethernet controllers, the ARS-1500 provides high-speed, redundant network connectivity for industrial communication and remote management. - **Rich Serial Communication Interfaces:** The ARS-1500 offers eight COM ports, including multiple RS-232 and RS-232/422/485 interfaces with automatic flow control, supporting a wide range of legacy and modern serial devices. - **Isolated Digital I/O:** Features 16-channel isolated GPIO (8 digital inputs and 8 digital outputs) with 24V sink/wet contact support, enabling safe and reliable integration with industrial sensors, actuators, and control systems. - **Dual Independent Display Support:** Supports VGA (DB15) and DVI/HDMI or 24-bit LVDS outputs for dual-display configurations, suitable for HMI, monitoring, and visualization applications. - **Flexible Expansion:** Includes one Mini PCIe slot and PC/104+ expansion interface for additional modules such as data acquisition, communication, or fieldbus cards. - **External CFast Slot:** Provides an externally accessible CFast port for quick storage access and system updates without disassembly. - **Comprehensive OS Support:** Compatible with Windows XP Embedded, Windows XP Professional, and various Linux distributions (Fedora 11, Ubuntu 10.04, CentOS 5.3), ensuring broad software integration. - **Wide Operating Temperature Range:** Designed for rugged environments with operational stability from -20°C to +70°C (-4°F to +157°F). - **Compact and Rugged Construction:** The 186 × 147 × 79 mm aluminum chassis provides durability and efficient heat dissipation while maintaining a small footprint for space-constrained installations.

Hersteller: Vecow Co., Ltd

Kategorie: Atom Powered Embedded

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2.2.2 Fanless D525 System 2*GbE 8*COM 8*DIO 1*PC/104+ 2*CAN ARS-1600
Fanless D525 System 2*GbE 8*COM 8*DIO 1*PC/104+ 2*CAN

- **Intel® Atom™ D525 Processor:** Dual-core, 1.8GHz CPU with 1MB cache, offering a balance of performance and low power consumption for embedded applications. - **Fanless and Compact Design:** Passive cooling with an integrated aluminum heat-sink chassis ensures silent operation and long-term reliability in dusty or vibration-prone environments. - **Dual Gigabit Ethernet Ports:** Two Intel® WG82583V GbE interfaces provide high-speed network connectivity and redundancy for industrial communication. - **Rich Serial Communication:** Eight COM ports (3 × RS-232, 1 × RS-232/422/485 with auto flow control, and additional ports via expansion) support legacy and modern serial devices. - **Isolated Digital I/O:** 8 isolated digital inputs and 8 isolated digital outputs (24V) with sink/wet contact source configuration for safe and flexible industrial signal interfacing. - **CAN Bus Support:** Integrated dual CAN interfaces for real-time communication in automotive, robotics, and industrial control networks. - **Expansion Flexibility:** PC/104+ and PCI-104 expansion slots allow integration of additional I/O, communication, or control modules. - **Storage Options:** Internal 2.5” SATA/SATA II bay for HDD/SSD and an externally accessible CFast slot for removable solid-state storage. - **Display Interfaces:** Dual independent display support via VGA (DB15) and DVI/HDMI or 24-bit LVDS for versatile visual output configurations. - **Programmable GPIO and LED Display:** 16-step rotary switch and programmable LED indicators for mode selection and system status display. - **Wide DC Input Range:** Operates from 16V to 28V DC, suitable for industrial power systems. - **Rugged Environmental Design:** Operational temperature range of -20°C to +70°C, vibration and shock resistance compliant with IEC 68-2-27 and IEC 68-2-64 standards. - **Multiple Mounting Options:** Supports both wall-mount and DIN-rail installation for flexible deployment in control cabinets or machinery. - **Comprehensive OS Support:** Compatible with Windows XP Embedded, Windows XP Professional, and multiple Linux distributions (Fedora 11, Ubuntu 10.04, CentOS 5.3).

Hersteller: Vecow Co., Ltd

Kategorie: Atom Powered Embedded

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2.2.2 IoT Gateway Starter kit (MXE-202i), USB ZigBee,sensor&actor IoT Gateway Starter kit (MXE-202i)
IoT Gateway Starter kit (MXE-202i), USB ZigBee,sensor&actor

- **Intel® Atom™ E3826 Dual‑Core Processor:** 1.46 GHz SoC providing low‑power, high‑efficiency computing for embedded and IoT applications. - **Pre‑installed Wind River® IDP XT 2.0:** Embedded OS platform optimized for Intel IoT Gateway architecture, ensuring secure connectivity and device management. - **Ultra‑Compact Fanless Design:** Dimensions of 120 × 100 × 55 mm in a full aluminum alloy enclosure for rugged, maintenance‑free operation. - **Rich I/O Connectivity:** - 1 × HDMI video output - 2 × USB 2.0 + 1 × USB 3.0 host ports - 2 × Intel® I210‑IT Gigabit Ethernet ports - 2 × COM ports (1 × RS‑232, 1 × RS‑232/422/485) - Optional 4 × isolated digital inputs and 4 × isolated digital outputs - **Flexible Expansion:** Two Mini PCI Express slots (one with mSATA support, one with USIM socket) for wireless modules (Wi‑Fi, Bluetooth, 3G, LTE). - **Wide‑Range Power Input:** 6 – 36 V DC input with optional 40 W AC‑DC adapter. - **Industrial‑Grade Reliability:** - Operating temperature: 0 – 50 °C (standard) or −20 – 70 °C (with industrial SSD/RAM) - Shock tolerance: 100 G, 11 ms half‑sine - Vibration resistance: 5 Grms, 5–500 Hz - ESD protection: ±4 kV contact, ±8 kV air - **Integrated SEMA Cloud Solution:** Enables remote system monitoring, watchdog control, and power management via secure cloud connectivity. - **Full Intel® IoT Gateway Support:** Combines Wind River® IDP XT and McAfee® Embedded Control for secure, manageable IoT deployments. - **Mounting Flexibility:** Supports DIN‑rail and wall‑mount configurations.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

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2.2.2 Intel Atom E3950 Machine Condition Monitoring Edge Platform MCM-100
Intel Atom E3950 Machine Condition Monitoring Edge Platform

- **Integrated Edge Computing Platform:** Combines data acquisition, signal conditioning, computation, and network communication in one compact system. - **Intel Atom x7-E3950 Quad-Core Processor:** Delivers efficient performance for real-time data processing and analytics at the edge. - **High-Precision Vibration Measurement:** 4-channel, 24-bit resolution, up to 128 kS/s sampling rate for accurate vibration and condition monitoring. - **Built-in IEPE Excitation:** Each channel includes a 2 mA IEPE current source, eliminating the need for external signal conditioning. - **Fanless, Rugged Design:** Full aluminum alloy construction ensures durability in harsh industrial environments. - **Wide Power Input Range:** Operates from 6–36 VDC, with optional 40W AC/DC adapter. - **Comprehensive Connectivity:** Includes dual Gigabit Ethernet ports, multiple USB interfaces, serial ports, DisplayPort, and dual Mini PCIe slots for expansion. - **Flexible Mounting Options:** DIN-rail and wall-mountable for easy integration into existing systems. - **Wide Environmental Tolerance:** Operating temperature range of 0–55°C and storage temperature range of -20–70°C. - **Software Ecosystem:** Supports Windows 10 IoT Enterprise/Core and Ubuntu Linux, with SDKs for LabVIEW, MATLAB, C/C++, Visual Basic, and Visual Studio .NET. - **Predictive Maintenance Enablement:** Enables continuous monitoring, early fault detection, and data-driven maintenance scheduling. - **Reduced Downtime:** Up to 70% reduction in unplanned downtime and related expenses through proactive monitoring.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

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2.2.2 Ethernet DAQ with 4*AI, 24*bit, 128KS/s, 4*DIO MCM-204
Ethernet DAQ with 4*AI, 24*bit, 128KS/s, 4*DIO

- **Standalone Ethernet DAQ:** Operates independently without a host PC, ideal for distributed monitoring. - **Edge Computing Capability:** Performs data filtering, FFT, and algorithmic processing locally to reduce network load. - **High‑Resolution Analog Inputs:** Four simultaneous 24‑bit channels with up to 128 kS/s sampling rate. - **IEPE Sensor Support:** 4 mA excitation current per channel for accelerometers and vibration sensors. - **Dual Gigabit Ethernet Ports:** Two 1 GbE RJ‑45 ports with cascading support for daisy‑chain networking. - **RESTful API and SDK:** REST API (C#, Python, JavaScript) and Streaming SDK (C/C++) for integration and continuous data streaming. - **Built‑in Web Console:** Browser‑based configuration interface for setup, monitoring, and mission management. - **Custom Filtering Algorithms:** User‑defined C/C++ algorithms can be uploaded and executed under Linux. - **Automatic Recovery:** System resumes previous state after power restoration. - **Compact, Fanless Design:** Metal IP30 housing suitable for DIN‑rail or wall mounting. - **Wide Power Input Range:** 9 – 30 VDC (typical 24 VDC) with max. 8.8 W consumption. - **Environmental Robustness:** Operates from 0 °C – 50 °C, vibration‑ and shock‑resistant, EMC‑compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

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2.2.2 Ethernet DAQ with 16*AI, 16*bit, 250KS/s, 8*DI/O MCM-216
Ethernet DAQ with 16*AI, 16*bit, 250KS/s, 8*DI/O

- **High‑Density Analog Input:** 16 simultaneous analog input channels with 16‑bit resolution and up to 250 kS/s aggregate sampling rate. - **Digital I/O Flexibility:** 8 configurable digital input/output channels for control, triggering, or status monitoring. - **Embedded ARM Cortex‑A9 Processor:** Provides local computation, preprocessing, and autonomous operation without a host PC. - **Ethernet Connectivity:** Integrated Ethernet interface for remote configuration, data streaming, and networked DAQ deployment. - **Fanless Industrial Design:** Rugged, maintenance‑free construction suitable for continuous operation in harsh environments. - **Wide Power Range:** Accepts 6 – 36 V DC input for flexible integration into industrial power systems. - **Edge Computing Capability:** Supports local data filtering, FFT analysis, and condition monitoring at the device level to reduce network load. - **Compact Form Factor:** 183 × 110 × 84 mm enclosure optimized for control cabinets and distributed installations. - **Extended Temperature Range:** Operates reliably from 0 °C to 55 °C; storage from −20 °C to +70 °C. - **ADLINK Reliability:** Industrial‑grade components, long‑life design, and compliance with global EMC and safety standards.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

980,00 EUR (w/o VAT)
2.2.2 Ethernet DAQ with 8*AI, 16*bit, 2*AO, 250KS/s, 8*DIO MCM-218
Ethernet DAQ with 8*AI, 16*bit, 2*AO, 250KS/s, 8*DIO

- **Standalone Operation:** Functions independently without a host PC, ideal for distributed or remote installations. - **Edge Computing Capability:** Performs local data filtering, FFT, and algorithmic processing to reduce network load. - **High‑Resolution Analog Input:** 4 simultaneous 24‑bit channels with up to 128 kS/s sampling rate. - **IEPE Sensor Support:** 4 mA excitation current per channel for accelerometers and vibration sensors. - **Dual Gigabit Ethernet Ports:** Two 1 Gb RJ‑45 ports with cascading support for daisy‑chain networking. - **RESTful API and SDK:** REST API (C#, Python, JavaScript) and Streaming SDK (C/C++) for integration and continuous data streaming. - **Built‑in Web Console:** Browser‑based configuration, monitoring, and mission management interface. - **Custom Algorithm Support:** User‑defined filtering algorithms in C/C++ can be uploaded and executed at the edge. - **Automatic Recovery:** System resumes previous mission after power restoration. - **Compact, Rugged Design:** Metal IP30 housing, DIN‑rail or wall‑mountable, designed for industrial environments. - **Wide Power Input Range:** 9 – 30 VDC input with low power consumption (max 8.8 W). - **Environmental Robustness:** Operates from 0 °C – 50 °C, vibration‑ and shock‑resistant. - **Comprehensive EMC/EMI Compliance:** Meets EN61000‑6‑4/‑6‑2, FCC Part 15B Class A, CISPR 32 standards.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

985,00 EUR (w/o VAT)
2.2.2 Ethernet DAQ with 4*AI, 24*bit, 128KS/s, 4*DIO w/o log MCM/NL-100
Ethernet DAQ with 4*AI, 24*bit, 128KS/s, 4*DIO w/o log

- **Standalone Ethernet DAQ:** Operates independently without a host PC, ideal for distributed or remote installations. - **Edge Computing Capability:** Performs local data filtering, FFT, and algorithmic processing at the edge to reduce network load. - **High-Resolution Analog Input:** Four simultaneous 24-bit channels with up to 128 kS/s sampling rate. - **IEPE Sensor Support:** 4 mA excitation current per channel for accelerometers and vibration sensors. - **Dual Gigabit Ethernet Ports:** Two 1 GbE RJ-45 ports supporting cascading topology for simplified network deployment. - **RESTful API and SDK Support:** RESTful API (C#, Python, JavaScript) and Streaming SDK (C/C++) for integration and continuous data streaming. - **Built-in Web Console:** Browser-based configuration and monitoring interface with dashboard visualization. - **Custom Filtering Algorithms:** User-defined C/C++ algorithms can be uploaded and executed locally under Linux. - **Automatic Recovery:** System resumes previous operational state after power restoration. - **Compact, Fanless Design:** Metal IP30 housing suitable for DIN rail or wall mounting. - **Wide Power Input Range:** 9–30 VDC input with low power consumption (max. 8.8 W). - **Industrial-Grade Reliability:** Operating temperature 0–50°C, vibration resistance up to 5 Grms, and shock tolerance up to 100 G.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

3090,00 EUR (w/o VAT)
2.2.2 Atom E3845 fanless 2*PCI 1*PCIe*4 MXC-2300-3E1
Atom E3845 fanless 2*PCI 1*PCIe*4

- **Processor:** Intel® Atom™ E3845 SoC, 4 cores @ 1.91 GHz, integrated graphics (542/792 MHz base/turbo). - **Memory:** Two DDR3L SO‑DIMM sockets supporting up to 8 GB (4 GB pre‑installed, 1333 MHz). - **Expansion:** 2 × PCI + 1 × PCIe x4 slots for flexible add‑on card integration. - **Display Interfaces:** 1 × DisplayPort, 1 × DVI‑I (supports VGA or DVI‑D), resolutions up to 2560 × 1600. - **Networking:** Dual Intel® WGI210IT Gigabit Ethernet ports with teaming, Wake‑on‑LAN, and PXE boot. - **Serial Communication:** 2 × software‑programmable RS‑232/422/485 ports (COM1/2) and 2 × RS‑232 ports (COM3/4). - **USB Connectivity:** 1 × USB 3.0, 4 × USB 2.0 external, and 1 × internal USB 2.0 port. - **Storage:** 1 × SATA II port for 2.5″ HDD/SSD, 1 × Type II CompactFlash socket. - **Audio:** Realtek ALC269 HD Audio codec (Line‑out and Mic‑in). - **Power Input:** 9 – 32 V DC wide‑range input with pluggable connector and remote on/off switch. - **Operating Temperature:** 0 – 50 °C standard; ‑20 – 70 °C with industrial SSD/CF option. - **Construction:** Fanless aluminum chassis, wall‑mountable, 3.5 kg weight. - **Embedded Management:** ADLINK SEMA 2.2 (Smart Embedded Management Agent) for remote monitoring and control. - **Certifications:** CE, FCC Class A, UL/cUL, CB, RoHS, and WEEE compliant.

Hersteller: Adlink Technology Inc.

Kategorie: Atom Powered Embedded

1059,00 EUR (w/o VAT)