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Industrial Computers

Industrie-PCs sind für den zuverlässigen Dauerbetrieb in Produktion, Automation und Maschinenbau ausgelegt. Sie widerstehen Staub, Vibrationen und Temperaturschwankungen und bieten eine stabile Basis für Steuerung, Visualisierung und Datenerfassung.

Unterkategorien

2.1 - (Artificial Intelligence Robot) Rechenplattformen, Kameras und Robotiksysteme für industrielle KI- und Automatisierungsanwendungen.
2.1.1 - (Inference & Deep Learning) Rechenplattformen für die Ausführung von KI-Modellen und Deep-Learning-Anwendungen im industriellen Umfeld.
2.1.2 - (Smart AI Cams) Intelligente Kameras für die Integration bildbasierter KI-Auswertung in industrielle Anwendungen.
2.1.3 - (ROS Robots AV) Robotikplattformen für die Entwicklung ROS-basierter Anwendungen und autonomer Fahrfunktionen.
2.2 - (Embedded Systems) Embedded-Computer für die Integration von Rechenleistung und Schnittstellen in Maschinen und Anlagen.
2.2.1 - (Core i7/i5/i3 Embedded) Embedded-Computer mit Intel-Core-i3-, i5- und i7-Prozessoren für industrielle Rechen- und Steuerungsaufgaben.
2.2.1.1 - (Adlink M-Series) ADLINK-Embedded-Systeme der M-Serie für industrielle Rechner- und Integrationslösungen.
2.2.1.2 - (Nuvo-6000/7000/8000-Series) Nuvo-Systeme der Serien 6000, 7000 und 8000 für industrielle Automatisierung und Datenerfassung.
2.2.1.3 - (Nuvo-5000-Series) Embedded-Computer der Nuvo-5000-Serie für industrielle Steuerungs- und Verarbeitungsaufgaben.
2.2.1.4 - (Nuvo-3000-Series) Embedded-Computer der Nuvo-3000-Serie für die Integration in Maschinen und Bestandsanlagen.
2.2.1.5 - (Nuvo-4000-Series) Embedded-Computer der Nuvo-4000-Serie für industrielle Rechen- und Schnittstellenanwendungen.
2.2.1.6 - (Nuvo-2000-Series and others) Embedded-Computer der Nuvo-2000-Serie und weiterer Baureihen für industrielle Integrationsaufgaben.
2.2.1.7 - (Embedded with GPU) Embedded-Systeme mit GPU für parallele Datenverarbeitung, Bildanalyse und KI-Anwendungen.
2.2.1.8 - (Nuvo-9000-Series) Embedded-Computer der Nuvo-9000-Serie für industrielle Automatisierung und Bildverarbeitung.
2.2.2 - (Atom Powered Embedded) Embedded-Computer mit Intel-Atom-Prozessoren für kompakte industrielle Rechen- und Steuerungssysteme.
2.2.3 - (ARM Embedded Systems) ARM-basierte Embedded-Systeme für Geräteintegration, Kommunikation und industrielle Steuerungsaufgaben.
2.2.3.1 - (LCD HMI) ARM-basierte Bediengeräte mit LCD für die Anzeige und Steuerung von Maschinenfunktionen.
2.2.3.2 - (IoT Gateway) IoT-Gateways zur Anbindung von Geräten und Betriebsdaten an übergeordnete Informationssysteme.
2.2.3.3 - (Automation Controller) Automatisierungscontroller für die Umsetzung industrieller Steuerungs- und Kommunikationsaufgaben.
2.2.3.4 - (SBC Modules) ARM-basierte Einplatinencomputer für die Entwicklung kundenspezifischer Geräte und Embedded-Anwendungen.
2.2.3.5 - (Accessories) Systemzubehör für die Installation und Erweiterung ARM-basierter Embedded-Plattformen.
2.2.4 - (IPC Embedded System) Embedded-Industriecomputer für die Integration in Maschinen, Prüfstände und Automatisierungssysteme.
2.2.5 - (HMI) HMI-Systeme zur Bedienung und Visualisierung industrieller Maschinen und Prozesse.
2.2.6 - (Handheld Android 5.0) Handheld-Geräte mit Android 5.0 für kompatible mobile Erfassungs- und Bedienanwendungen.
2.2.7 - (Power Modules) Versorgungsmodule für den elektrischen Anschluss und Betrieb kompatibler Embedded-Systeme.
2.3 - (PXI/cPCI Controller/Chassis) Controller und Gehäuse für modulare PXI- und CompactPCI-Mess- und Steuerungssysteme.
2.3.1 - (PXIe Platform) PXI-Express-Systemplattformen für den Aufbau modularer Mess- und Prüfsysteme.
2.3.1.1 - (PXIe / PXI Controller 3U) 3-HE-Controller für die zentrale Verarbeitung und Steuerung in PXI- und PXI-Express-Systemen.
2.3.1.2 - (PXIe PXI Chassis) PXI- und PXI-Express-Chassis für die Aufnahme kompatibler Controller und Messmodule.
2.3.2 - (cPCI 3U CPU chassis) CompactPCI-Prozessorkarten und Gehäuse im 3-HE-Format für modulare Industriesysteme.
2.3.2.1 - (cPCI CPU P-III Level) CompactPCI-Prozessorkarten der Pentium-III-Klasse für kompatible Bestands- und Ersatzteilsysteme.
2.3.2.2 - (cPCI CPU LPP-266) CompactPCI-Prozessorkarten der LPP-266-Klasse für die Instandhaltung kompatibler Systeme.
2.3.2.3 - (cPCI Interface Cards) CompactPCI-Schnittstellenkarten zur Erweiterung modularer Industrie- und Steuerungssysteme.
2.3.2.4 - (cPCI 3U 19'' Chassis) 3-HE-CompactPCI-Gehäuse für den Aufbau modularer Systeme im 19-Zoll-Rack.
2.3.2.5 - (cPCI LCD) LCD-Komponenten für Anzeige- und Bedienfunktionen in kompatiblen CompactPCI-Systemen.
2.3.2.6 - (cPCI Backplanes) CompactPCI-Backplanes zur Verbindung von Controller- und Erweiterungsbaugruppen.
2.3.2.7 - (cPCI Power Supplies) Netzteile für die elektrische Versorgung kompatibler CompactPCI-Systeme.
2.3.3 - (cPCI 6U CPU, Chassis) CompactPCI-Prozessorkarten und Chassis im 6-HE-Format für industrielle Systemplattformen.
2.3.3.1 - (cPCI CPU Card 6U) 6-HE-CompactPCI-Prozessorkarten für modulare Rechner- und Steuerungssysteme.
2.3.3.2 - (cPCI CPU Card P-III Level 6U) 6-HE-CompactPCI-Prozessorkarten der Pentium-III-Klasse für kompatible Bestandsanlagen.
2.4 - (Industrial Computer) Industriecomputer, Panel-PCs und Displays für Rechen-, Bedien- und Visualisierungsaufgaben.
2.4.1 - (Industrial Computer 19'' Systems) 19-Zoll-Industriecomputersysteme für die Integration in Racks und Automatisierungsschränke.
2.4.1.1 - (Industrial Computer 19'') Industriecomputer im 19-Zoll-Format für zentrale Rechen- und Steuerungsaufgaben.
2.4.1.2 - (IPC 19'' Workstation with LCD, Kbd, Low Mounting Depth) 19-Zoll-Workstations mit LCD, Tastatur und geringer Einbautiefe für kompakte Racks.
2.4.1.3 - (IPC 19'' Workstation With LCD, Kbd) 19-Zoll-Workstations mit integriertem LCD und Tastatur für industrielle Bedienplätze.
2.4.1.4 - (IPC 19'' Workstation With LCD) 19-Zoll-Workstations mit LCD für die integrierte Verarbeitung und Darstellung von Betriebsdaten.
2.4.2 - (Panel LCD PCs) Panel-PCs mit LCD für die Integration von Bedienung und Rechenleistung in Maschinenfronten.
2.4.2.1 - (Panel IPCs With Front Controls) Panel-Industriecomputer mit frontseitigen Bedienelementen für Maschinen- und Anlagenbedienung.
2.4.2.2 - (Panel IPCs Without Front Controls) Panel-Industriecomputer ohne frontseitige Bedienelemente für integrierte Bedien- und Anzeigelösungen.
2.4.2.3 - (Open Frame PC System) Open-Frame-PC-Systeme für den Einbau in kundenspezifische Gehäuse und Bedienoberflächen.
2.4.3 - (Panel Displays) Panel-Displays für die industrielle Anzeige von Prozess-, Maschinen- und Systemdaten.
2.4.3.1 - (Industrial Monitor) Industriemonitore für Visualisierung und Bedienplätze in Maschinen und Anlagen.
2.4.3.1.1 - (LCD Panel 4:3) LCD-Panels im 4:3-Format für die Integration in industrielle Anzeige- und Bedienlösungen.
2.4.3.1.2 - (LCD Widescreen) Breitformatige LCD-Displays zur Darstellung industrieller Prozess- und Anwendungsoberflächen.
2.4.3.1.3 - (LCD Rackmount) Rackmount-LCD-Monitore für Anzeige- und Bedienplätze in 19-Zoll-Systemen.
2.4.3.1.4 - (LCD Monitor) LCD-Monitore für Anzeigeaufgaben an industriellen Rechner- und Bedienplätzen.
2.4.3.2 - (LCD Open Metal Frame) LCD-Displays mit offenem Metallrahmen für die Integration in kundenspezifische Systeme.
2.4.3.3 - (Panel 19") 19-Zoll-Anzeigepanels für die Integration in industrielle Racks und Rechnerschränke.
2.4.3.4 - (Panel Display 19'' With Keyboard) 19-Zoll-Anzeigeeinheiten mit Tastatur für zentrale Bedienplätze in Rack-Systemen.
2.5 - (Complete) Komplettsysteme für industrielle Steuerung, dezentrale I/O-Anbindung und Bewegungsautomatisierung.
2.5.1 - (EtherCAT) EtherCAT-Komponenten für die Vernetzung von Steuerungen, I/O-Modulen und Antrieben.
2.5.1.1 - (Master) EtherCAT-Master für die Koordination kompatibler Antriebe und dezentraler I/O-Teilnehmer.
2.5.1.2 - (Modules) EtherCAT-Module zur Erweiterung industrieller Steuerungs- und Automatisierungssysteme.
2.5.1.3 - (Remote IO Modules) Remote-I/O-Module zur dezentralen Signalerfassung und -ausgabe in EtherCAT-Netzwerken.
2.5.2 - (Motion Control) Motion-Control-Systeme zur Koordination von Antrieben und industriellen Positionieraufgaben.

Produkte

1121 Produkte

Nr. Code Produkt Preis Menge
2.2.1.1 Core GM45 fanless 4*GbE 4*COM 6*USB 3.0 MXE-5104
Core GM45 fanless 4*GbE 4*COM 6*USB 3.0

- **Processor:** Intel® Core™2 Duo P8400, 2.26 GHz dual-core CPU - **Chipset:** Intel® GM45 Graphics Memory Controller Hub + ICH9-M I/O Controller - **Fanless Design:** Passive cooling for silent, dust-free operation - **Rugged Construction:** Operates from -20°C to +70°C (with industrial SSD) - **Maritime Certification:** IEC-60945 compliant for marine-grade reliability - **Power Input:** 9–24 VDC isolated wide-range DC input - **Networking:** Four Gigabit Ethernet ports (2× Intel® 82574L, 2× Realtek 8111C) - **Serial Communication:** 2× RS-232 and 2× RS-232/422/485 configurable ports - **USB Connectivity:** Six USB 2.0 ports for peripheral expansion - **Display Output:** DVI-I connector supporting both analog CRT and digital DVI-D dual-display output - **Storage:** One SATA port for 2.5" HDD or SSD installation - **Vibration Resistance:** 5 Grms (SSD/CF configuration) - **Shock Resistance:** 50 Grms, 11 ms half-sine pulse (SSD/CF configuration) - **Compact Form Factor:** 248 × 185 × 85 mm, 3.7 kg - **Operating Systems Supported:** Windows® XP, Windows® 7, Linux (by request)

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio MXE-5301
Core i7-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio

- **High-Performance CPU:** Equipped with an Intel® Core™ i7-2710QE quad-core processor, delivering up to 150% performance improvement over previous generations with minimal power increase. - **Chipset:** Intel® Mobile Platform Controller Hub QM67, supporting advanced I/O, SATA III, and integrated graphics. - **Fanless Design:** Completely fanless operation ensures silent, maintenance-free performance in harsh environments, with operating temperature ranges from 0°C to 50°C (standard) or -20°C to 60°C (extended). - **Rugged Construction:** Designed for industrial reliability with 5 Grms vibration resistance, 50G shock tolerance, and wide 9–32 VDC power input. - **Rich I/O Connectivity:** - 4 Gigabit Ethernet ports (2 Realtek® 8111C, 1 Intel® 82574IT, 1 Intel® 82579LM PHY) - 4 COM ports (2 RS-232/422/485 programmable, 2 RS-232) - 6 USB ports (2 USB 3.0 + 4 USB 2.0) - 4 isolated digital I/O channels (1.5 kV isolation) - 1 audio input/output (mic-in, line-out) - 1 PS/2 combo port for keyboard/mouse - **Display Support:** Dual display output via DVI-I connector supporting VGA (up to QXGA 2048×1536) and DVI (up to 1920×1080). - **Storage Options:** - 1 SATA III port for 2.5" HDD/SSD - 1 external CFast slot - 1 eSATA port for external storage expansion - **Wireless Expansion:** Dual Mini PCIe slots and one USIM socket for 3G, Wi-Fi, Bluetooth, and GPS modules. - **Remote Management:** Intel® Active Management Technology (AMT) 7.0 for remote diagnostics, BIOS configuration, and system updates. - **Software Support:** Compatible with Windows® XP, XP Embedded, Windows® 7, and Linux (distribution by request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio MXE-5302
Core i5-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio

- **Processor and Chipset:** Equipped with a 2nd Generation Intel® Core™ i5-2510E dual-core processor and Intel® QM67 Mobile Platform Controller Hub, providing a balance of performance and energy efficiency. - **Fanless Operation:** Completely fanless design ensures silent operation and high reliability in harsh environments. Supports extended temperature operation from -20°C to +70°C (with industrial SSD or CFast). - **Rugged Design:** Built for industrial use with 5 Grms vibration resistance, 50G shock tolerance, and wide 9–32 VDC power input range. - **Rich I/O Connectivity:** - 4 Gigabit Ethernet ports (2 Realtek® 8111C, 1 Intel® 82574IT, 1 Intel® 82579LM PHY) - 4 COM ports (2 RS-232/422/485 programmable, 2 RS-232) - 6 USB ports (2 USB 3.0 + 4 USB 2.0) - 4 isolated digital I/O channels (1.5 kV isolation) - 1 audio input/output (mic-in, line-out) - 1 PS/2 combo port for keyboard/mouse - **Display Support:** Dual independent display via DVI-I connector supporting VGA and DVI-D outputs (up to 2048×1536 analog, 1920×1080 digital). - **Storage Options:** - 1 SATA-III (6.0 Gb/s) port for 2.5" HDD/SSD - 1 external CFast slot - 1 eSATA port for external storage expansion - **Expansion Capability:** - 2 internal Mini PCIe sockets (one with USIM socket for 3G communication, one supporting mSATA) - Optional wireless modules (3G, Wi-Fi, Bluetooth, GPS) - **Remote Management:** Supports Intel® Active Management Technology (AMT) 7.0 for remote diagnostics, updates, and BIOS configuration. - **Software Compatibility:** Supports Windows® XP, Windows® 7, and Linux (distribution available upon request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio MXE-5303
Core i3-QM67 fanless 4*GbE 4*COM 6*USB 4*DIO 1*Audio

- **Processor and Chipset:** - Intel® Core™ i3-2330E dual-core processor - Intel® Mobile Platform Controller Hub (QM67) - Integrated Intel® HD Graphics 3000 GPU - **Fanless Design:** - Completely fanless operation for silent, maintenance-free performance. - Ruggedized thermal design supports extended temperature operation (-20°C to +70°C with industrial SSD). - **Rich I/O Connectivity:** - 4 Gigabit Ethernet ports (2× Realtek® 8111C, 1× Intel® 82574IT, 1× Intel® 82579LM PHY) - 4 COM ports (2× RS-232/422/485 software-programmable, 2× RS-232) - 6 USB ports (2× USB 3.0, 4× USB 2.0) - 4 isolated digital I/O channels (1.5 kV isolation) - 1 audio interface (mic-in, line-out) - 1 PS/2 combo port for keyboard/mouse - **Expansion and Storage:** - 2 Mini PCIe slots (one with USIM socket, one with mSATA support) - 1 SATA III port for 2.5" HDD/SSD - 1 external CFast slot - 1 eSATA port for external storage expansion - **Wireless and Remote Management:** - Dual Mini PCIe slots support 3G, Wi-Fi, Bluetooth, and GPS modules. - Intel® Active Management Technology (AMT) 7.0 for remote diagnostics and BIOS configuration. - **Rugged Industrial Design:** - 9–32 VDC wide-range power input - 5 Grms vibration resistance (SSD/CFast) - 50 G shock resistance - CE and FCC Class A compliance

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio MXE-5401
Core i7-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio

- **High-Performance Processing:** Equipped with a 4th Generation Intel® Core™ i7-4700EQ 2.4 GHz (Turbo up to 3.4 GHz) quad-core processor, delivering superior performance for compute-intensive and multimedia applications. - **Intel® Technologies:** - **Intel® Quick Sync Video:** Accelerated video encoding and decoding for image/video processing. - **Intel® vPro™ Technology:** Includes iAMT™ 9.0, TPM 1.2, TXT, and Intel® VT for enhanced security, virtualization, and remote management. - **Intel® VT-x and VT-d:** Hardware-assisted virtualization support. - **ADLINK SEMA 2.2 (Smart Embedded Management Agent):** Provides real-time system monitoring, watchdog timer control, power management, and remote diagnostics. - **Fanless Rugged Design:** - Cable-free internal construction for reliability. - Operates in extended temperature ranges (-20°C to +60°C with industrial SSD). - Withstands 5 Grms vibration and 100G shock (SSD/CFast configuration). - **Rich I/O Connectivity:** - 4× Gigabit Ethernet ports (3× Intel® I210IT + 1× Intel® I217LM). - 4× COM ports (2× RS-232/422/485, 2× RS-232). - 6× USB 3.0 (4 with 1600 mA power budget) + 1× USB 2.0. - 8× isolated digital inputs and 8× isolated digital outputs (1.5 kV isolation). - 1× Audio In, 1× Line Out. - 2× DisplayPort + 1× DVI-I supporting up to 3 independent displays. - **Storage and Expansion:** - 2× SATA III (6.0 Gb/s) ports with RAID 0/1 support. - 1× CFast slot, 1× eSATA port. - 2× Mini PCIe slots (one switchable to mSATA). - 1× USIM slot for 3G/LTE communication. - **Wide Power Input Range:** 9–32 VDC input with optional 160 W AC-DC adapter. - **Software Support:** Compatible with Windows® 7 / 7 Embedded and Linux (by request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio MXE-5402
Core i5-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio

- **Processor & Chipset:** Equipped with an Intel® Core™ i5-4400E dual-core 2.7 GHz processor (Turbo up to 3.3 GHz) and Intel® QM87 chipset, delivering high computing performance with low power consumption. - **Fanless Design:** Completely fanless construction ensures silent operation, reduced maintenance, and enhanced reliability in harsh industrial environments. - **Rich I/O Connectivity:** - 4 × Gigabit Ethernet ports (3 × Intel® I210IT + 1 × Intel® I217LM PHY) - 4 × COM ports (2 × RS-232/422/485 configurable, 2 × RS-232) - 6 × USB 3.0 ports (4 with 1600 mA power budget) + 1 × internal USB 2.0 - 8 × isolated digital inputs and 8 × isolated digital outputs (1.5 kV isolation) - 1 × Audio In + 1 × Line Out - **Display Support:** Supports up to three independent displays via 1 × DVI-I and 2 × DisplayPort interfaces, with resolutions up to 2560 × 1600 @ 60 Hz. - **Expansion & Storage:** - 2 × Mini PCIe slots (one switchable to mSATA) - 1 × USIM slot for 3G/LTE communication - 2 × SATA III ports (6.0 Gb/s) with RAID 0/1 support - 1 × CFast slot (Type II) - 1 × eSATA port for external storage expansion - **Power Input:** Wide-range 9–32 VDC input with optional 160 W AC-DC adapter. - **Ruggedization:** - Operating temperature: 0°C to 50°C (standard), -20°C to +70°C (extended with industrial SSD/CFast) - Vibration resistance: 5 Grms (SSD/CFast), 0.5 Grms (HDD) - Shock resistance: 100 G (SSD/CFast), 20 G (HDD) - ESD protection: ±4 kV contact, ±8 kV air - **Embedded Management:** Integrated ADLINK SEMA 2.2 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security & Manageability:** Intel® vPro™ technology (iAMT™ 9.0, TPM 1.2, TXT, Intel® VT) for advanced security and remote management.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio MXE-5403
Core i3-QM87 fanless 4*GbE 2*COM 6*USB 3.0 8*DI 8*DO 1*Audio

- **Processor & Architecture:** Equipped with a dual‑core Intel® Core™ i3‑4100E processor (2.4 GHz, Haswell architecture) delivering strong computing performance with low thermal design power (TDP). - **Chipset:** Intel® QM87 chipset supporting advanced I/O, SATA III, USB 3.0, and PCIe 3.0 interfaces. - **Graphics & Display:** Integrated Intel® HD Graphics supporting up to three independent displays via 1 × DVI‑I and 2 × DisplayPort connectors. Maximum resolutions: – DisplayPort: up to 2560 × 1600 @ 60 Hz – DVI‑I: up to 1920 × 1080 @ 60 Hz – VGA (via DVI‑I analog): up to 2048 × 1280 @ 60 Hz - **Fanless Rugged Design:** Completely fanless aluminum chassis with cable‑free internal design, optimized for vibration resistance (up to 5 Grms) and extended temperature operation (‑20 °C to +70 °C with industrial SSD/CFast). - **Rich I/O Interface:** – 4 × Gigabit Ethernet (3 × Intel I210IT + 1 × Intel I217LM) – 4 × COM ports (2 × RS‑232/422/485 + 2 × RS‑232) – 6 × USB 3.0 (4 ports with 1600 mA power budget) + 1 × USB 2.0 – 8 × Isolated Digital Inputs + 8 × Isolated Digital Outputs (1.5 kV isolation) – 1 × Audio In + 1 × Line Out - **Expansion & Storage:** – 2 × Mini PCIe slots (one switchable to mSATA) – 1 × USIM socket for 3G/LTE modules – 2 × SATA III ports (6 Gb/s) supporting RAID 0/1 – 1 × CFast Type II slot – 1 × eSATA port - **Power Input:** Wide‑range 9 – 32 V DC input with optional 160 W AC‑DC adapter. - **Embedded Management:** Integrated ADLINK SEMA 2.2 (Smart Embedded Management Agent) for system health monitoring, watchdog timer, and remote management. - **Security & Virtualization:** Intel® vPro™ technology (iAMT 9.0, TPM 1.2, TXT, Intel VT) for secure remote management and virtualization. - **Software Support:** Compatible with Windows 7 / Windows 7 Embedded and Linux (distribution by request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i7-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio MXE-5501
Core i7-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio

- **Processor Platform:** 6th Generation Intel® Core™ i7-6820EQ (Skylake) with Intel® QM170 chipset. - **Fanless Design:** Completely fanless operation for silent, dust-resistant, and maintenance-free performance. - **Single-Side I/O Layout:** Simplifies installation and maintenance with all I/O ports accessible from one side. - **Rich I/O Connectivity:** - 4× Intel® Gigabit Ethernet ports - 6× COM ports (4× RS-232/422/485 configurable, 2× RS-232) - 8× isolated Digital I/O (8 DI + 8 DO) - 8× USB ports (4× USB 3.0, 4× USB 2.0) - 1× DVI-I and 2× DisplayPort outputs - 1× Audio (Mic-in/Line-out) - **Storage Flexibility:** - 2× hot-swappable 2.5” SATA III (6 Gb/s) drive bays - 1× CFast socket - 1× M.2 2280 slot - **Expansion Capability:** - 2× Mini PCIe slots - 2× USIM sockets for 3G/4G/LTE connectivity - **Rugged Construction:** - Operating temperature: 0°C to 50°C (standard) - Extended temperature option: -20°C to +60°C (with industrial SSD) - Vibration resistance: 5 Grms (SSD configuration) - Shock resistance: up to 100G (SSD configuration) - **Power Input:** 9–32 VDC wide-range input for industrial and vehicular use. - **System Management:** Integrated ADLINK SEMA 3.0 (Smart Embedded Management Agent) for remote monitoring and control. - **Software Support:** Windows® 10/7/Embedded Standard 7 and Linux distributions.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i5-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio MXE-5502
Core i5-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio

- **High‑Performance CPU:** Equipped with a 6th Generation Intel® Core™ i5‑6440EQ quad‑core processor (2.7 GHz base, up to 3.4 GHz Turbo) and Intel® QM170 chipset, providing strong computing and graphics performance for industrial workloads. - **Fanless, Rugged Design:** Completely fanless aluminum chassis ensures silent operation and resistance to dust and vibration. Operates in extended temperature ranges from ‑20 °C to +70 °C (with industrial SSD/CFast). - **Rich I/O Connectivity:** - 4 × Intel® Gigabit Ethernet ports - 6 × COM ports (2 × RS‑232 + 4 × RS‑232/422/485 configurable) - 8 × USB ports (4 × USB 3.0 + 4 × USB 2.0) - 8 × isolated digital inputs and 8 × isolated digital outputs - 1 × Mic‑in/Line‑out audio interface - 2 × DisplayPort and 1 × DVI‑I (supporting DVI‑D and VGA) - **Flexible Storage Options:** - 2 × hot‑swappable 2.5″ SATA III (6 Gb/s) drive bays - 1 × M.2 2280 slot (SATA) - 1 × CFast socket Enables RAID or redundant storage configurations. - **Expansion and Communication:** - 2 × Mini PCIe slots with 2 × USIM sockets for 3G/4G/LTE, Wi‑Fi, Bluetooth, or GPS modules. - Optional wireless kit supports 3G/Wi‑Fi/BT/GPS connectivity. - **System Management:** Integrated ADLINK SEMA 3.0 (Smart Embedded Management Agent) for remote monitoring, power management, and health diagnostics. - **Wide Power Input:** 9 – 32 V DC input range with optional 160 W AC‑DC adapter. - **Industrial‑Grade Reliability:** Cable‑free internal design, 5 Grms vibration resistance, 100 G shock tolerance (SSD), and ESD protection (±4 kV contact, ±8 kV air). - **Software Compatibility:** Supports Windows 10/7/Embedded Standard 7 and Linux distributions.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Core i3-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio MXE-5503
Core i3-QM170 fanless 4*GbE 6*COM 8*USB 8*DI 8*DO 1*Audio

- **Processor and Chipset:** Equipped with a 6th Generation Intel® Core™ i3-6100E processor (Skylake architecture) and Intel® QM170 chipset, providing strong computational performance and integrated Intel® HD Graphics 530. - **Fanless Design:** Completely fanless operation ensures silent performance and high reliability in dusty or vibration-prone environments. The system’s thermal design supports operation in extended temperature ranges up to -20°C to +70°C (with industrial SSD). - **Rich I/O Connectivity:** - 4 × Intel® Gigabit Ethernet ports - 6 × COM ports (4 configurable RS-232/422/485 + 2 RS-232) - 8 × USB ports (4 USB 3.0 + 4 USB 2.0) - 8 × isolated Digital Inputs and 8 × isolated Digital Outputs - 1 × Audio (Mic-in/Line-out) - 2 × DisplayPort (4096×2304 @60Hz) and 1 × DVI-I (supports DVI-D and VGA) - **Storage Flexibility:** - 2 × 2.5” SATA III (6.0 Gb/s) hot-swappable drive bays - 1 × M.2 2280 slot (SATA) - 1 × CFast socket - **Expansion and Communication:** - 2 × Mini PCIe slots with 2 × USIM sockets for wireless modules (3G/4G/LTE, Wi-Fi, Bluetooth, GPS) - Optional wireless kit for extended connectivity - **Rugged Construction:** - Cable-free internal design - 5 Grms vibration resistance (SSD configuration) - 100G shock resistance (SSD configuration) - EMC compliance with CE/FCC Class A - **System Management:** Integrated ADLINK SEMA 3.0 (Smart Embedded Management Agent) for remote monitoring, power management, and system health diagnostics. - **Software Support:** Compatible with Windows® 10/7/Embedded Standard 7 and Linux distributions (others available upon request).

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.1 Coffee Lake-H Fanless Embedded System MXE-5600
Coffee Lake-H Fanless Embedded System

- **High-Performance Computing:** Powered by 8th/9th Gen Intel® Core™ i7/i5/i3 or Xeon® E-2200 series processors (Coffee Lake-H), supporting up to 6 cores and 12 threads for intensive edge workloads. - **Fanless Thermal Design:** Advanced passive cooling architecture ensures silent operation and long-term reliability in dusty or vibration-prone environments. - **Compact and Rugged Construction:** Industrial-grade aluminum chassis with vibration resistance and extended temperature tolerance for field deployment. - **Rich I/O Connectivity:** Multiple Gigabit Ethernet ports, USB 3.1/2.0, DisplayPort/HDMI/DVI, serial ports, and digital I/O for flexible peripheral integration. - **Flexible Storage Options:** Supports 2.5" SATA drives, M.2 SSDs, and optional CFast for high-speed, reliable data storage. - **Expansion Capability:** Mini PCIe and M.2 slots for wireless modules, fieldbus cards, or additional I/O expansion. - **Wide Power Input Range:** 9–36 VDC input with power protection features for industrial power environments. - **Extended Operating Temperature:** Typically -20°C to +60°C (depending on configuration), ensuring stable operation in harsh conditions. - **Industrial Reliability:** Designed for 24/7 operation, shock and vibration resistance compliant with IEC 60068-2 standards. - **Software and OS Support:** Compatible with Windows 10 IoT Enterprise, Linux, and other embedded operating systems.

Hersteller: Adlink Technology Inc.

Kategorie: Adlink M-Series

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2.2.1.2 Bracket Bracket
Bracket

Bracket for expansion sockets, 5pcs per pack

Hersteller: Keine Kategorie

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 Cable-COM-3D9M Cable-COM-3D9M
Cable-COM-3D9M

Cable assembly, 1*DB9(F) to 3*DB9(M), 10CM, for Nuvo-6000 series

Hersteller: Keine Kategorie

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 DIN-rail mounting for Nuvo-3100VTC series DINRAIL-31
DIN-rail mounting for Nuvo-3100VTC series

- **Purpose-Built for Nuvo-3100VTC Series:** Engineered to match the mechanical design and mounting points of the Nuvo-3100VTC embedded controller series, ensuring perfect fit and alignment. - **DIN-Rail Mounting Compatibility:** Supports standard **35 mm DIN-rail (EN 60715 / IEC 60715)** profiles commonly used in industrial automation and control systems. - **Rugged Construction:** Built from durable, industrial-grade materials to withstand vibration, shock, and temperature variations typical of vehicular and factory environments. - **Quick Installation and Removal:** Enables tool-assisted or tool-free attachment and detachment from DIN-rails, simplifying maintenance and system upgrades. - **Compact and Space-Efficient Design:** Optimized for confined spaces within control panels or vehicle compartments, maintaining accessibility to I/O ports and connectors. - **Secure Locking Mechanism:** Incorporates a reliable locking latch or clip system to prevent accidental dislodging during operation or transport. - **Corrosion-Resistant Finish:** Surface-treated to resist oxidation and corrosion, ensuring long-term reliability in harsh industrial conditions. - **Optimized Thermal and Mechanical Integration:** Designed to maintain proper airflow and mechanical balance when the Nuvo-3100VTC is mounted vertically or horizontally on a DIN-rail. - **Ease of Integration:** Fully compatible with existing Nuvo-3100VTC accessories and cable management systems.

Hersteller: Keine Kategorie

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 DINRAIL-M1 DINRAIL-M1
DINRAIL-M1

Dinrail clip for Nuvo-2000/4000/6000 series

Hersteller: Keine Kategorie

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 Core i3/i5/i7 H110 Fanless System PCIe*16 PCIe*8 Nuvo-6002
Core i3/i5/i7 H110 Fanless System PCIe*16 PCIe*8

- **Intel® 6th‑Gen Skylake LGA1151 CPU Support:** Compatible with Intel® Core™ i7‑6700TE, i5‑6500TE, i3‑6100TE, Pentium® G4400TE, and Celeron® G3900TE processors (35 W TDP). - **Fanless Thermal Design:** Passive cooling architecture ensures silent operation and high reliability in dusty or vibration‑prone environments. - **Compact Industrial Form Factor:** 124 mm (W) × 225 mm (D) × 174 mm (H), optimized for cabinet, wall, or rack installation. - **Dual PCIe Expansion:** One PCIe x16 (Gen3, 16 lanes) and one PCIe x8 (Gen2, 4 lanes) slot for add‑on cards such as data acquisition, motion control, or GPU acceleration. - **Rich Front‑Accessible I/O:** 2 × Gigabit Ethernet, 4 × USB 3.0, 5 × COM ports, 2 × DVI‑D/HDMI, and 1 × audio output. - **Dual Independent Display Outputs:** Integrated Intel® HD 530/510 graphics controller supports up to 1920 × 1200 resolution on dual DVI/HDMI outputs. - **Wide Operating Temperature:** ‑25 °C to +60 °C under 100 % CPU load (with SSD). - **Rugged Environmental Tolerance:** 5 Grms vibration and 50 Grms shock resistance per IEC 60068‑2‑64/‑27. - **Flexible Power Input:** 8 – 35 V DC via 3‑pin pluggable terminal block; optional 120 W or 160 W AC/DC adapters. - **Mounting Versatility:** Standard wall‑mount, optional DIN‑rail or 19‑inch rack‑mount kits. - **Industrial‑Grade Reliability:** CE/FCC Class A compliance, extended temperature components, and solid‑state storage options.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 Core i3/i5/i7 H110 Fanless System PCIe*16 2*PCIe*4 2*PCI Nuvo-6023
Core i3/i5/i7 H110 Fanless System PCIe*16 2*PCIe*4 2*PCI

- **Fanless Industrial Design:** Completely fanless aluminum chassis for silent operation and high reliability in dusty or vibration‑prone environments. - **Intel® 6th‑Gen Skylake CPU Support:** Supports LGA1151 socket processors including: - Core™ i7‑6700TE (8 MB cache, 2.4/3.4 GHz, 35 W TDP) - Core™ i5‑6500TE (6 MB cache, 2.3/3.3 GHz, 35 W TDP) - Core™ i3‑6100TE (4 MB cache, 2.7 GHz, 35 W TDP) - Pentium® G4400TE (3 MB cache, 2.4 GHz, 35 W TDP) - Celeron® G3900TE (2 MB cache, 2.3 GHz, 35 W TDP) - **High Expandability:** - 1 × PCIe x16 (Gen3, 16 lanes) - 1 × PCIe x4 (Gen2, 4 lanes) - 1 × PCIe x4 (Gen2, 1 lane) - 2 × PCI (33 MHz/32‑bit) Provides compatibility with both modern and legacy add‑on cards. - **Rich I/O Connectivity:** - 2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT) - 4 × USB 3.0 ports - 2 × RS‑232/422/485 software‑selectable ports - 2 × RS‑232 ports - 2 × DVI‑D/HDMI video outputs - 1 × Speaker‑out audio jack - **Storage Flexibility:** - 3 × 2.5″ SATA III ports for HDD/SSD - 1 × full‑size mSATA socket - **Rugged Environmental Tolerance:** - Operating temperature: –25 °C to +60 °C - Vibration: 5 Grms (5–500 Hz, 3 axes, SSD installed) - Shock: 50 Grms (half‑sine 11 ms, SSD installed) - **Compact Form Factor:** 184 mm (W) × 225 mm (D) × 174 mm (H), 3.5 kg - **Wide‑Range DC Power Input:** Accepts 8–35 V DC via 3‑pin terminal block; optional 120 W AC/DC adapter available. - **Front‑Accessible I/O:** All major ports are accessible from the front panel for easy maintenance when installed in cabinets or racks. - **Multiple Mounting Options:** Wall‑mount (standard), DIN‑rail, and 19″ rack‑mount (optional).

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 Core i3/i5/i7 H110 Fanless System PCIe*16 PCIe*8 3*PCI Nuvo-6032
Core i3/i5/i7 H110 Fanless System PCIe*16 PCIe*8 3*PCI

- **Intel® 6th‑Gen Skylake CPU Support:** Compatible with Intel® Core™ i7‑6700TE, i5‑6500TE, i3‑6100TE, Pentium® G4400TE, and Celeron® G3900TE processors (LGA1151 socket, 35 W TDP). - **Fanless Thermal Design:** Proven Neousys fanless architecture ensures silent operation and high reliability in harsh environments, with operating temperature from ‑25 °C to +60 °C under full CPU load. - **Rich Expansion Capability:** Provides one PCIe x16 (Gen3, 16‑lane), one PCIe x8 (Gen2, 4‑lane), and three 32‑bit/33 MHz PCI slots for legacy and modern add‑on cards. - **Compact Industrial Form Factor:** Dimensions of 184 mm (W) × 225 mm (D) × 174 mm (H) and weight of 3.5 kg, offering full IPC functionality in a small footprint. - **Comprehensive I/O Interface:** Front‑accessible ports include dual Gigabit Ethernet (Intel® I219‑LM and I210‑IT), four USB 3.0, five COM ports (two software‑selectable RS‑232/422/485 and three RS‑232), dual DVI‑D video outputs, and one audio speaker‑out. - **Flexible Storage Options:** Supports up to three 2.5″ SATA III HDD/SSD drives and one full‑size mSATA module for OS or data storage. - **Wide‑Range DC Power Input:** Accepts 8 – 35 V DC via a 3‑pin pluggable terminal block; optional 120 W or 160 W AC/DC adapters available. - **Rugged Reliability:** Vibration resistance up to 5 Grms (5–500 Hz, 3 axes) and shock resistance up to 50 Grms (11 ms half‑sine), compliant with IEC 60068‑2‑64 and IEC 60068‑2‑27. - **Versatile Mounting Options:** Standard wall‑mounting; optional DIN‑rail and 19″ rack‑mount kits. - **Industrial‑Grade Environmental Endurance:** Operating humidity 10 – 90 % RH (non‑condensing); storage temperature ‑40 °C – +85 °C.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 Core i3/i5/i7 H110 Fanless System PCIe*16 4*PCI Nuvo-6041
Core i3/i5/i7 H110 Fanless System PCIe*16 4*PCI

- **Intel® 6th-Gen Skylake Platform:** Supports Intel® Core™ i7/i5/i3, Pentium®, and Celeron® LGA1151 CPUs, offering scalable performance from entry-level to high-end industrial computing. - **Fanless Thermal Design:** Proven Neousys fanless architecture ensures silent operation and high reliability in dusty or vibration-prone environments. - **Rich Expansion Capability:** - 1 × PCIe x16 slot (Gen3, 16 lanes) - 4 × PCI slots (33 MHz/32-bit) This configuration provides compatibility with legacy and modern add-on cards. - **Compact Industrial Form Factor:** 184 mm (W) × 225 mm (D) × 174 mm (H), optimized for cabinet or rack integration. - **Wide Operating Temperature Range:** -25°C to +60°C under full CPU load (with SSD). - **High Shock and Vibration Resistance:** - Vibration: 5 Grms, 5–500 Hz, 3 axes (IEC60068-2-64) - Shock: 50 Grms, half-sine 11 ms (IEC60068-2-27) - **Dual Gigabit Ethernet Ports:** Intel® I219-LM and Intel® I210-IT controllers for reliable industrial networking. - **Multiple Storage Options:** - 3 × 2.5" SATA III ports for HDD/SSD - 1 × full-size mSATA socket - **Front-Accessible I/O:** Simplifies maintenance and integration in confined spaces. - **Dual Independent Display Outputs:** 2 × DVI-D connectors supporting up to 1920×1200 resolution. - **Comprehensive Serial Communication:** 2 × software-programmable RS-232/422/485 ports and 2 × RS-232 ports. - **Flexible Power Input:** 8–35 VDC via 3-pin terminal block; optional 120W AC/DC adapter. - **Mounting Flexibility:** Wall, DIN-rail, or rack-mount options. - **Industrial-Grade Reliability:** Designed for 24/7 operation in automation, transportation, and factory environments.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 8th-Gen Q370 Fanless System 2*PCIe*8 2*GbE Nuvo-7002DE
8th-Gen Q370 Fanless System 2*PCIe*8 2*GbE

- **Intel® 8th-Gen Coffee Lake CPU Support:** Supports Intel® Core™ i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T processors (LGA1151 socket, 35W/65W TDP). - **Fanless Rugged Design:** Completely fanless aluminum chassis with optimized thermal conduction for reliable operation in harsh environments (-25°C to +70°C). - **Dual PCIe Expansion (Cassette Module):** Two PCIe x8 Gen3 slots (4-lane signals each) in a patented Cassette compartment for add-on cards, ensuring thermal isolation and simplified installation. - **High-Speed I/O Connectivity:** - 2x Intel Gigabit Ethernet ports (I219-LM and I210-IT) - 8x USB ports (4x USB 3.1 Gen2, 4x USB 3.1 Gen1) - 4x COM ports (2x RS-232/422/485 software-programmable, 2x RS-232) - 1x 3.5mm audio jack (mic-in/speaker-out) - **Triple Independent Display Support:** Integrated Intel® UHD Graphics 630 with VGA, DVI-D, and DisplayPort outputs supporting up to 4K resolution (4096x2304). - **Flexible Storage Options:** - 2x 2.5” SATA III HDD/SSD bays (RAID 0/1 supported) - 1x M.2 2280 (M key) NVMe slot for SSD or Intel® Optane™ memory - 1x full-size mSATA (mux with mini-PCIe) - 1x M.2 2242 (B key) with dual SIM sockets for LTE/4G modules - **Wide Power Input Range:** 8–35 VDC input via 3-pin terminal block, with optional 160W AC/DC adapter (PA-160W-OW). - **Extreme Ruggedness:** - Vibration: MIL-STD-810G, Method 514.6, Category 4 - Shock: MIL-STD-810G, Method 516.6, Procedure I - Operating temperature: -25°C to +70°C (35W CPU), -25°C to +50°C (65W CPU) - **Modular Expansion via MezIO™ Interface:** Proprietary high-speed connector for Neousys MezIO™ modules (additional I/O, DIO, ignition control, etc.). - **Advanced Management and Security:** - Intel® AMT 12.0 for remote management - TPM 2.0 hardware security module - Watchdog timer and programmable DIO support

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 8th-Gen Q370 Fanless System PCIe*16 2*GbE Nuvo-7002E
8th-Gen Q370 Fanless System PCIe*16 2*GbE

- **Intel® 8th‑Gen Coffee Lake CPU Support:** Supports LGA1151 socket processors up to 6 cores/12 threads, including Intel® Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T. Configurable TDP of 35 W or 65 W for performance‑to‑thermal optimization. - **Fanless Thermal Design:** Advanced passive cooling architecture ensures silent operation and long‑term reliability in environments from ‑25 °C to +70 °C (with 35 W CPU). - **Intel® Q370 Chipset:** Provides high‑speed I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support. - **Integrated Intel® UHD Graphics 630:** Supports triple independent display outputs via VGA, DVI‑D, and DisplayPort (up to 4096 × 2304 resolution). - **Patented Expansion Cassette:** One PCIe ×16 slot (Gen3, 8‑lane signals) in a thermally isolated compartment for add‑on cards, simplifying installation and improving heat dissipation. - **MezIO™ Interface:** Proprietary high‑speed mezzanine connector for modular I/O expansion (digital I/O, serial, GbE, USB, ignition control, etc.). - **Comprehensive I/O Connectivity:** 2 × Gigabit Ethernet (Intel® I219‑LM + I210‑IT), 8 × USB 3.1 (4 × Gen2 10 Gbps + 4 × Gen1 5 Gbps), 4 × COM ports (2 × RS‑232/422/485 software‑selectable + 2 × RS‑232), audio I/O, and dual mSATA/M.2 expansion. - **Wide‑Range DC Power Input:** 8 – 35 V DC input via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW). - **Rugged Reliability:** MIL‑STD‑810G‑compliant vibration (5 Grms, 5–500 Hz) and shock (50 Grms, 11 ms) resistance; CE/FCC Class A EMC compliance. - **Compact Industrial Form Factor:** 240 mm (W) × 225 mm (D) × 90 mm (H), 4.4 kg, wall‑mount or optional DIN‑rail installation.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 9th/8th-Gen Q370 Fanless System 2*GbE Nuvo-7002LP
9th/8th-Gen Q370 Fanless System 2*GbE

- **Intel® 9th/8th Gen Core™ i7/i5/i3 LGA1151 CPU Support:** Compatible with 35W and 65W TDP processors, including Core i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T. - **Intel® Q370 Chipset:** Provides advanced I/O, PCIe Gen3 lanes, and Intel® AMT 12.0 remote management support. - **Fanless Design:** Passive cooling architecture ensures silent operation and long-term reliability in harsh environments. - **Dual Gigabit Ethernet Ports:** Two Intel® controllers (I219-LM and I210-IT) provide reliable network connectivity with support for Wake-on-LAN and AMT remote management. - **Rich I/O Connectivity:** 8× USB 3.1 ports (4× Gen2, 4× Gen1), 4× COM ports (2× RS-232/422/485 software-programmable, 2× RS-232), audio I/O, and multiple video outputs (VGA, DVI-D, DisplayPort). - **Triple Independent Display Support:** Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA, DVI-D, and DisplayPort up to 4K resolution. - **Flexible Storage Options:** - 1× front-accessible hot-swappable 2.5" SATA III HDD/SSD bay (up to 9.5 mm) - 1× internal 2.5" SATA III HDD/SSD bay (up to 15 mm) - 1× M.2 2280 (M Key) NVMe slot (PCIe Gen3 x4) - 1× full-size mSATA (mux with mini-PCIe) - **Expansion Capability:** - 1× mini-PCIe slot with internal SIM socket - 1× M.2 2242 (B Key) slot with dual front-accessible SIM sockets - 1× MezIO™ expansion port for modular I/O expansion - **Wide Power Input Range:** 8–35 VDC input via 3-pin terminal block, supporting industrial and vehicular power systems. - **Rugged Environmental Design:** - Operating temperature: -25°C to +70°C (35W CPU) - Vibration: MIL-STD-810G, Method 514.6, Category 4 - Shock: MIL-STD-810G, Method 516.6, Procedure I - EMC: CE/FCC Class A (EN 55032 & EN 55024) - **Compact Low-Profile Chassis:** 240 mm (W) × 225 mm (D) × 79 mm (H), 3.1 kg weight, optimized for space-constrained installations. - **Hot-Swappable Drive Bay:** Unique to the LP variant, enabling quick maintenance and RAID 0/1 configurations. - **TPM 2.0 and AMT 12.0 Support:** Hardware-based security and remote management capabilities.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 8th-Gen Q370 Fanless System PCI 2*GbE Nuvo-7002P
8th-Gen Q370 Fanless System PCI 2*GbE

- **Intel® 8th-Gen Coffee Lake CPU Support:** Supports Intel® Core™ i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T processors (LGA1151 socket, 35W/65W TDP). - **Fanless Rugged Design:** Completely fanless aluminum chassis with efficient passive heat dissipation, ensuring reliable operation in harsh environments from -25°C to +70°C. - **Single PCI Expansion Slot:** Equipped with a patented Neousys Cassette module providing one PCI slot for industrial add-on cards, enabling flexible system expansion. - **High-Speed I/O Connectivity:** - 2x Intel® Gigabit Ethernet ports (I219-LM and I210-IT) - 8x USB ports (4x USB 3.1 Gen2 10Gbps + 4x USB 3.1 Gen1 5Gbps) - 4x COM ports (2x RS-232/422/485 software-programmable + 2x RS-232) - 1x 3.5mm audio jack (mic-in/speaker-out) - **Triple Independent Display Outputs:** Integrated Intel® UHD Graphics 630 supporting simultaneous outputs via VGA, DVI-D, and DisplayPort (up to 4K resolution). - **Flexible Storage Options:** - 2x SATA III ports for 2.5” HDD/SSD (up to 15mm thickness, RAID 0/1 support) - 1x M.2 2280 (M key) NVMe slot for high-speed SSD or Intel® Optane™ memory - 1x full-size mSATA slot (mux with mini-PCIe) - **Expansion and Modularity:** - 1x Mini PCIe slot with internal SIM socket - 1x M.2 2242 (B key) slot with dual front-accessible SIM sockets - 1x MezIO™ interface for modular I/O expansion (digital I/O, ignition control, PoE, etc.) - **Wide Range DC Power Input:** 8–35 VDC input via 3-pin pluggable terminal block, supporting remote on/off control and LED status output. - **Rugged Environmental Tolerance:** - Operating temperature: -25°C to +70°C (with 35W CPU) - Vibration: MIL-STD-810G, Method 514.6, Category 4 - Shock: MIL-STD-810G, Method 516.6, Procedure I - EMC: CE/FCC Class A, EN 55032 & EN 55024 compliant - **Compact and Durable Construction:** Dimensions: 240 mm (W) × 225 mm (D) × 90 mm (H) Weight: 4.4 kg (including CPU, memory, and HDD)

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 8th-Gen Q370 Fanless System 2*PCIe*8 6*GbE Nuvo-7006DE
8th-Gen Q370 Fanless System 2*PCIe*8 6*GbE

- **Intel® 8th-Gen Coffee Lake CPU Support:** Supports LGA1151-socket processors up to 6 cores/12 threads, including Intel® Core™ i7-8700/8700T, i5-8500/8500T, i3-8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T. Configurable for 35W or 65W TDP operation. - **Fanless Rugged Design:** Completely fanless aluminum chassis with efficient passive heat dissipation, ensuring silent operation and long-term reliability in harsh environments. - **Dual PCIe Expansion (Patented Cassette Module):** Two PCIe x8 slots (Gen3, 4-lane each) housed in a patented expansion Cassette for thermal isolation and simplified installation of add-on cards. - **Six Gigabit Ethernet Ports:** 1x Intel® I219-LM and 5x Intel® I210-IT controllers, with optional IEEE 802.3at PoE+ (Ports 3–6, 100W total budget). - **High-Speed USB Connectivity:** 4x USB 3.1 Gen2 (10Gbps) and 4x USB 3.1 Gen1 (5Gbps) ports via Intel® native xHCI controller. - **Triple Independent Display Outputs:** Integrated Intel® UHD Graphics 630 supports simultaneous output via VGA (1920×1200), DVI-D (1920×1200), and DisplayPort (4096×2304). - **Wide Operating Temperature Range:** -25°C to +70°C (with 35W CPU) or up to +50°C (with 65W CPU at full load). - **Rugged Environmental Compliance:** MIL-STD-810G vibration and shock resistance, CE/FCC Class A EMC compliance. - **Flexible Storage Options:** Dual 2.5" SATA III bays (RAID 0/1), one M.2 2280 (NVMe/Optane™), and one full-size mSATA (mux with mini-PCIe). - **Advanced Manageability:** Intel® AMT 12.0 and TPM 2.0 support for remote management and hardware-level security. - **Wide Range DC Power Input:** 8–35 VDC input via 3-pin terminal block; optional 160W AC/DC adapter (PA-160W-OW). - **Expandable I/O via MezIO™ Interface:** Proprietary high-speed connector for Neousys MezIO™ modules (additional DIO, COM, USB, ignition control, etc.).

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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2.2.1.2 8th-Gen Q370 Fanless System PCIe*16 6*GbE Nuvo-7006E
8th-Gen Q370 Fanless System PCIe*16 6*GbE

- **Intel® 8th‑Gen Coffee Lake CPU Support:** Supports LGA1151 socket processors up to 6 cores/12 threads, including Core™ i7‑8700/8700T, i5‑8500/8500T, i3‑8100/8100T, Pentium® G5400/G5400T, and Celeron® G4900/G4900T. Offers up to 65 W TDP with BIOS‑configurable power limits for thermal optimization. - **Fanless Rugged Design:** Completely fanless aluminum chassis with efficient passive heat dissipation. Operates reliably from ‑25 °C to +70 °C (with 35 W CPU) and up to +50 °C with 65 W CPU. Complies with MIL‑STD‑810G vibration and shock standards. - **High‑Performance Chipset and Graphics:** Intel® Q370 Platform Controller Hub with integrated Intel® UHD Graphics 630 supporting triple independent displays (VGA, DVI‑D, DisplayPort). - **Extensive I/O Connectivity:** Six Gigabit Ethernet ports (1× Intel I219‑LM + 5× Intel I210‑IT), four of which optionally support IEEE 802.3at PoE+ (80–100 W total budget). Eight USB 3.1 ports (4× Gen 2 10 Gbps + 4× Gen 1 5 Gbps). Four serial ports (2× software‑programmable RS‑232/422/485 + 2× RS‑232). Audio I/O via 3.5 mm jack (mic‑in/speaker‑out). - **Flexible Expansion Architecture:** ‑ 1× PCIe x16 Gen3 slot (8‑lane signals) in patented Cassette module. ‑ 2× full‑size mSATA/mini‑PCIe sockets with internal SIM support. ‑ 1× M.2 2242 B‑key slot with dual front‑accessible SIMs. ‑ 1× M.2 2280 M‑key slot for NVMe SSD or Intel® Optane™ memory. ‑ 1× MezIO™ expansion port for modular I/O extensions. - **Storage Flexibility:** Dual 2.5″ SATA III 6 Gb/s drive bays supporting RAID 0/1, plus mSATA and NVMe options. - **Wide‑Range DC Power Input:** 8 – 35 V DC via 3‑pin terminal block; optional 160 W AC/DC adapter (PA‑160W‑OW). Remote on/off and power LED control supported. - **Industrial‑Grade Reliability:** ‑ Vibration: 5 Grms (5–500 Hz, 3 axes, SSD installed, IEC 60068‑2‑64). ‑ Shock: 50 Grms (half‑sine 11 ms, SSD installed, IEC 60068‑2‑27). ‑ Humidity: 10 – 90 % non‑condensing. ‑ Storage temperature: ‑40 °C to +85 °C. - **Compact, Serviceable Construction:** Patented Cassette module isolates add‑on card heat and simplifies installation. MezIO™ interface enables application‑specific I/O customization.

Hersteller: Neousys Technology

Kategorie: Nuvo-6000/7000/8000-Series

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